Tuesday, May 31, 2016
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Emerson Launches High Efficiency Bus Converters
Low-profile converters.
Carlsbad, CA — Emerson Network Power has launched two intermediate bus converters (IBCs) that are capable of delivering exceptionally high levels of usable output power with a conversion efficiency of 97 percent. Forming the latest additions to the Artesyn family of high power density IBCs, the products comprise a 300 Watt eighth-brick and a 642 Watt quarter-brick. Both IBCs are targeted at the telecommunications, networking, computing and industrial electronics markets.

The converters are intended primarily for powering multiple downstream non-isolated point-of-load (POL) converters in distributed power systems with 9.6V intermediate bus architectures, where their superior performance makes them suitable low-cost replacements for larger form factor converters. The IBCs are said to be especially cost-effective solutions for applications with well regulated 48V input voltages, or for feeding general-purpose wide input POL converters which can tolerate some supply variation.

The new IBC60 quarter-brick and IBC32 eighth-brick IBCs are designed to operate from a 38 to 55VDC supply, have a fixed 5:1 conversion ratio and generate an isolated, unregulated DC output. When fed with a 48VDC supply, the converters generate a 9.6VDC output. The IBC60 can deliver up to 60A, achieving a power density in excess of 400 Watts per cubic-inch, and a typical load regulation figure of 2.5.

The new IBCs have industry-standard pin-outs and footprints, and are based on a single-board package designed for through-hole board mounting. The eighth-brick IBC32 measures 2.3 x 0.9-in., while the quarter-brick IBC60 has a 2.3 x 1.45-in. footprint and uses dual output pins to facilitate high current transfer. Designed for fully automated assembly to help reduce manufacturing costs, the modules are constructed entirely from surface-mount components, using planar, in-the-board transformer structures to minimize profile. They have an installed height of just 0.48-in., making them suitable for system racks with very tight card pitches.

Based on a thermally efficient open-frame design, they are designed for operation over a wide ambient temperature range of -40 to +85°C without a heatsink, and are suitable for both convection cooled and forced air environments.

For more information, contact: Emerson, P.O. Box 4100, St. Louis, MO 63136-8506 314-553-2000 Web:
http://www.GoToEmerson.com

See at EDS Booth #1151P.

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