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Friday, July 1, 2016
VOLUME -23 NUMBER 6
Publication Date: 06/1/2008
Front Page News
People in the News
Electronic Mfg. Services
Electronic Mfg. Products
Special Feature: SMT and Production
Product Preview: Atllantic Des / MDM
June 2008 Issue
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In U.K.: National Electronics Week
Bannockburn, IL — IPC is presenting a series of in-depth technical seminars in conjunction with National Electronics Week (NEW). Focusing on next generation technologies in design, fabrication and assembly, the IPC technical seminars will take place June 17-19, 2008 at Earls Court, London, UK.
IPC is presenting an international team of instructors to lead 15 full- and half-day courses designed to offer attendees insight on board and assembly production at lowest cost, innovations in advanced packaging, and the latest developments in lead-free reliability, process troubleshooting and more.
Over 300 companies spanning design, components, manufacturing through to distribution will be showcasing new and proven products and services.
Two interactive production lines will demonstrate state-of-the-art components on six layer boards. Showcasing leading-edge technologies in action, this exhibit will provide attendees with an opportunity to be part of the line, with live discussion forums taking place to analyze findings.
UK and International Trade Associations will assist with expert advice. Trade publications, a jobs section to advertise vacancies and even, legal attorneys will be on hand to help. A live brokerage area will feature global electronics companies who have been invited by the UKTI to interact with visitors and exhibitors.
Two seminar theaters will run a full and free World class program over the three days of National Electronics Week. Leading industry groups including E-KTN, Intellect and UKEA will discuss a wide range of leading-edge topics including RoHS, WEEE and supply chain management.
There will also be paid-for seminars and workshops throughout the event with topics covering lead free, ball grid array, reliability and much more.
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