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Semicon West Highlights Special Sessions
San Jose, CA — Semicon West is being presented July 15-17 at San Francisco's Moscone Center. Special sessions include Challenges in Device Scaling, Test, Assembly & Packaging, and Emerging Markets. Challenges in Device Scaling will provide the connection with the advanced processes, materials, and tools that are taking designs to 22nm and beyond, including high-k metal gates, low-k dielectrics, next-generation lithography, Design-for-Manufacturing (DFM), and process control.

Test, Assembly & Packaging will let attendees discover the final manufacturing technologies and ideas in test, assembly, and advanced packaging that are leading the way to new applications and new opportunities in yield management, high-density and wafer-level packaging, 3D through-silicon via (TSA), SiP, SoC, and PoP technologies and more.

Emerging Markets will provide exploration of developing applications for micro manufacturing-and the emerging opportunities and challenges for suppliers-in a wide range of emerging markets, from thin film batteries, energy harvesting, and fuel cells, to MEMS, solid state lighting, and printed electronics.

Contact: Semicon 408-943-6973 Web: http://www.semi.org

 
 

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