US-Tech Online. -> June 2008 Issue -> Special Feature: SMT and Production

By Bahman Tavassoli, Ph.D, Chief Technologist, Advanced Thermal Solutions, Norwood, MA
In 2001, PICMG, the PCI (Personal Computer Interconnect) Industrial Computer Manufacturers Group released the ATCA (Advanced Telecommunications Computing Architecture, or AdvancedTCA) standards to help develop a modular, PC-style approach for next-generation telecom equipment. Over ...

How SMT Fasteners Solve Production Problems

By Brian G. Bentrim, PennEngineering, Danboro, PA
Traditional hardware options for assembling printed circuit boards have always carried potential baggage. The tedious and exacting process of handling and installing loose hardware often drains productivity. Broaching fasteners, while typically a more efficient alternative, can damage ...

Improving Productivity with Flexible Production Logistics

By Paul Jarossy, Flexlink Systems, Allentown, PA

Being a manufacturer in the electronics industry is not easy. Customers are demanding more for less money and products quickly become mainstream commodities, making it easy to shop from someone else. And the electronics industry has delivered, making great technological improvements while cutting prices ...

	Tooling for the SMT Process
	By Chad Gilliland and Eric Miller, Ascentec Engineering, Sherwood, OR Surface mount pallets (or carriers) are often an essential part of achieving consistent, highest quality success with new product introduction (NPI) or production volume builds. These tools are not new to the industry and are a proven part of designing a robust SMT process. Oftentimes only mechanical ...

Under Bump Metallization: Some Economical Alternatives

By Mario Orduz, National Product Manager, Uyemura USA, Ontario, CA
Under Bump Metallization (UBM) is required for connecting the die to the substrate with solder bumps for Flip-Chip packages. The UBM of the integrated circuit (IC) bonds pads that are typically aluminum but can be copper. This is an essential process step for the reliability of the ...