Monday, May 21, 2018
VOLUME -23 NUMBER 6
Publication Date: 06/1/2008
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Archive >  June 2008 Issue >  Front Page News > 
PolyFuel to demo methanol fuel cell laptop
Martin LaMonica, CNET

Martin LaMonica, CNET
PolyFuel, a company that develops fuel cell membranes, said Wednesday it has developed a prototype laptop--a Lenovo T40 ThinkPad--that uses methanol cartridges and a fuel cell as a power source. The company intends to show it off to consumer electronics and PC manufacturers...
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Semiconductor sales may escape harsh economy's impact, Gartner says
Suzanne Deffree, Electronic News

Suzanne Deffree, Electronic News
Gartner Inc’s optimism toward the semiconductor market continues to grow, as the market research company today said the industry will record Q2 sales growth.
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MIT Designs Solar Power Producing Windows, Coming Within 3 Years
Jason Mick, DailyTech

Jason Mick, DailyTech
There is much ongoing research into making photovoltaic solar power, common among commercial business and residential installations, more efficient.  While many focus on the cells themselves, MIT researchers are focusing on a different approach by changing the places where cells can be deployed and how light gets to them.
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Amkor Unveils High-Performance Flip-Chip Packaging Technology
Sally Cole Johnson, Semiconductor International

Sally Cole Johnson, Semiconductor International
Responding to an industry shift toward thinner substrates to improve signal integrity and electrical performance, Amkor Technology Inc. (Chandler, Ariz.) has developed a flip-chip molded ball grid array (FCMBGA) that uses a molded underfill (MUF) rather than a capillary underfill (CUF) — enabling the much-coveted closer spacing between passives and the flip-chip die, better warpage control for thin-core substrates and improved solder joint reliability for passives.
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Atotech to present Spherolyte® CU UF3 for fine line RDL at ECTC 2018
BERLIN, GERMANY - Atotech is pleased to announce its partaking in the Electronics Components and Technology Conference (ECTC) 2018. As a gold sponsor, Atotech will participate with two presentations and a booth, highlighting its latest solutions for flexible electronics as well as fan-out wafer-level and fan-out panel-level packaging.    
Avnet Showcases Connected Ecosystem at IoT World 2018
PHOENIX, AZ - Avnet, a leading global technology company, will be showcasing its connected ecosystem this week at Internet of Things (IoT) World 2018, May 14-17 at the Santa Clara Convention Center in Santa Clara, Calif. The Avnet ecosystem is an expansive network of owned companies, services, solutions and partners that provides more than two million customers with the tools and resources they need to bring their IoT projects to market.    

DfR Solutions Addresses Mission-Critical Impact on Electronics Reliability: System-Level Effects on Solder Joints in Harsh Environments
BELTSVILLE, MD - DfR Solutions, leader in quality, reliability, and durability (QRD) solutions for the electronics industry, today announced that Dr. Craig Hillman, CEO of DfR Solutions is speaking at the IPC High Reliability Forum for Mil-Aero and Automotive Sectors in Linthicum, Maryland, taking place May 15-17, 2018.
 

Specialty Coating Systems Announces New Dates for Educational Parylene Seminars in Malaysia and Singapore
INDIANAPOLIS, IN - Specialty Coating Systems today announced a date change for its upcoming free, educational Parylene conformal coating seminars. The Singapore seminar will now be held on Thursday, July 19, 2018, and the seminar in Penang, Malaysia will take place Tuesday, July 24, 2018.       
 
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