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Under Bump Metallization: Some Economical Alternatives
By Mario Orduz, National Product Manager, Uyemura USA, Ontario, CA
Under Bump Metallization (UBM) is required for connecting the die to the substrate with solder bumps for Flip-Chip packages. The UBM of the integrated circuit (IC) bonds pads that are typically aluminum but can be copper. This is an essential process step for the reliability of the ...
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Making the Workstation Switch at Redcom
By Dan Schoen, Product Manager, Lista International Corporation, Holliston, MA
Redcom Laboratories designs and manufactures what it calls "Reality Based Telecom Switching Systems." Since 1978, this Victor, New York-based company has addressed real-world customer communications needs with high quality, reliable switching equipment — from patented digital switching ...
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Asymtek's New Slider Valve 20% Faster
Carlsbad, CA — Asymtek, a Nordson company, is introducing the new SV-100 Slider Valve for solder paste dispensing. Up to 20 percent faster than standard auger dispensers, the new valve achieves 20,000 dots per hour (on 1mm grid) while delivering accurate and repeatable dots of less than 300µ ...
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Amphenol: Compact PCB Power Connectors
Sidney, NY — Amphenol Industrial now offers three compact, high amperage connectors suitable for use in high current, single-point connections to PC boards. The new PowerBlok™, RADSERT™ and PGY™ connectors incorporate RADSOK® technology to eliminate threaded connection failures and increase ...
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APEM Intros Indicators Catalog Haverhill, MA — APEM Components, Inc. has expanded its line of high quality miniature and industrial switches with an expanded line of professional grade LED Indicators. The company signaled this expansion with the release of its new "APEM Indicators" catalog. According to the company, this recent ...
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Speedline Receives 3 Vision Awards
Franklin, MA — SMT China Magazine presented Speedline Technologies with three prestigious Vision Awards during ceremonies at the Nepcon China trade event in Shanghai. The awards were received: the MPM Momentum™ in the Printing category; the Electrovert DwellMax Plus™ Nozzle System in the Wave ...
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