Friday, July 29, 2016
VOLUME -23 NUMBER 6
Publication Date: 06/1/2008
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ARCHIVE >  June 2008 Issue >  Front Page News > 
PolyFuel to demo methanol fuel cell laptop
Martin LaMonica, CNET

Martin LaMonica, CNET
PolyFuel, a company that develops fuel cell membranes, said Wednesday it has developed a prototype laptop--a Lenovo T40 ThinkPad--that uses methanol cartridges and a fuel cell as a power source. The company intends to show it off to consumer electronics and PC manufacturers...

Semiconductor sales may escape harsh economy's impact, Gartner says
Suzanne Deffree, Electronic News

Suzanne Deffree, Electronic News
Gartner Inc’s optimism toward the semiconductor market continues to grow, as the market research company today said the industry will record Q2 sales growth.

MIT Designs Solar Power Producing Windows, Coming Within 3 Years
Jason Mick, DailyTech

Jason Mick, DailyTech
There is much ongoing research into making photovoltaic solar power, common among commercial business and residential installations, more efficient.  While many focus on the cells themselves, MIT researchers are focusing on a different approach by changing the places where cells can be deployed and how light gets to them.

Amkor Unveils High-Performance Flip-Chip Packaging Technology
Sally Cole Johnson, Semiconductor International

Sally Cole Johnson, Semiconductor International
Responding to an industry shift toward thinner substrates to improve signal integrity and electrical performance, Amkor Technology Inc. (Chandler, Ariz.) has developed a flip-chip molded ball grid array (FCMBGA) that uses a molded underfill (MUF) rather than a capillary underfill (CUF) — enabling the much-coveted closer spacing between passives and the flip-chip die, better warpage control for thin-core substrates and improved solder joint reliability for passives.



 
 
SMTA and IPC: Cleaning and Conformal Coating Conference Program Finalized
MINNEAPOLIS, MN - The SMTA and IPC are pleased to announce the program for the 2016 Cleaning and Conformal Coating Conference being held October 25-27, 2016 in Rosemont, IL.

Two tutorials will be held on Tuesday, October 25th. Dale Lee, Plexus Corporation, will instruct “Design for Excellence: Focus on DfR-Design for Reliability of Hardware to be Cleaned” on Tuesday morning. After lunch, Doug Pauls, Rockwell Collins and Jason Keeping, P.Eng., Celestica, Inc. will co-instruct a course on “Robust Coating Processes in the Factory: Methods, Critical Parameters, Problems and Remedies.”

Vi TECHNOLOGY Promotes Jacky Zhou to Sales Manager – China
SAINT-EGREVE, FRANCE - Vi TECHNOLOGY, a leading provider of inspection solutions for PCB assembly, is pleased to announce the promotion of Jacky Zhou to Sales Manager – China.

Zhou joined Vi TECHNOLOGY in 2005 as Applications & Support Engineer, and quickly moved up to a sales position in East China.
 

Viribright Lighting Announces US Patent Award for LED Packaging Design
CORONA, CA - Viribright Lighting, Inc., a global leader in LED lighting manufacturing, announced today that is has received a US Patent (US 9,379,300) for the design of an LED chip welded in a flip-chip manner on a floating copper heat radiation support. The Viribright LED packaging design generates more lumens per watt with better control of heat dissipation than previous LED manufacturing methods.

 
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