Saturday, February 25, 2017
VOLUME -23 NUMBER 6
Publication Date: 06/1/2008
Advertisements

Archive >  June 2008 Issue >  Front Page News > 
PolyFuel to demo methanol fuel cell laptop
Martin LaMonica, CNET

Martin LaMonica, CNET
PolyFuel, a company that develops fuel cell membranes, said Wednesday it has developed a prototype laptop--a Lenovo T40 ThinkPad--that uses methanol cartridges and a fuel cell as a power source. The company intends to show it off to consumer electronics and PC manufacturers...
Read More
Semiconductor sales may escape harsh economy's impact, Gartner says
Suzanne Deffree, Electronic News

Suzanne Deffree, Electronic News
Gartner Inc’s optimism toward the semiconductor market continues to grow, as the market research company today said the industry will record Q2 sales growth.
Read More
MIT Designs Solar Power Producing Windows, Coming Within 3 Years
Jason Mick, DailyTech

Jason Mick, DailyTech
There is much ongoing research into making photovoltaic solar power, common among commercial business and residential installations, more efficient.  While many focus on the cells themselves, MIT researchers are focusing on a different approach by changing the places where cells can be deployed and how light gets to them.
Read More
Amkor Unveils High-Performance Flip-Chip Packaging Technology
Sally Cole Johnson, Semiconductor International

Sally Cole Johnson, Semiconductor International
Responding to an industry shift toward thinner substrates to improve signal integrity and electrical performance, Amkor Technology Inc. (Chandler, Ariz.) has developed a flip-chip molded ball grid array (FCMBGA) that uses a molded underfill (MUF) rather than a capillary underfill (CUF) — enabling the much-coveted closer spacing between passives and the flip-chip die, better warpage control for thin-core substrates and improved solder joint reliability for passives.
Read More


 
 
Dr. Nebioglu of Dymax Corporation Presented Her Research at the IPC/ APEX Expo
TORRINGTON, CT - Dymax Corporation is proud of the participation of its Senior R&D Manager of the Adhesives team, Dr. Aysegul Kascatan Nebioglu at the IPC/ APEX Expo 2017 that took place on February 14 to 17 in San Diego, California.

Indium Corporation’s Durham to Share Expertise at IMAPS Device Packaging
CLINTON, NY - Indium Corporation’s Maria Durham, Technical Support Engineer for Semiconductor and Advanced Assembly Materials, will share her expertise at IMAPS 13th International Conference and Exhibition on Device Packaging on March 7-9 in Fountain Hills, Ariz.
 

3D Glass Solutions Announces Highest Efficiency 5G IPD RF Filters
ALBUQUERQUE, N.M. - 3D Glass Solutions, Inc. (3DGS), a world-class expert on the fabrication of electronic packages and devices using photo-definable glass-ceramics, announced today the development and production of the highest efficiency 5G integrated passive devices (IPD) for radio frequency (RF) filters. These RF filters have been designed to operate as bandpass filters for frequencies at 5GHz and 28GHz with less than 1.0 dB of insertion loss.

Internet of Things: a promising future for sensors| Yole Développement & Fraunhofer EMFT seminar - Munich, July 3&4
LYON, FRANCE - The MEMS & sensor offering has never been so diverse. Inertial, pressure, temperature, (bio-)chemical and gas sensors as well as microphones, fingerprint and iris recognition. All devices are part of the IoT revolution.

 
search login