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Vision Engineering: Stereo Zoom Microscopes
Publication Date: 6/3/2011

New Milford, CT — Vision Engineering has added a low-cost stereo zoom microscope to its large range of microscopes. Called the SX25, the instrument has been designed to incorporate high-quality optics. It does this without adding in all of the unnecessary optional extras, thus keeping the cost down, making ...
Universal Extends Through-hole Capabilities
Publication Date: 6/3/2011

Conklin, NY — Universal Instruments has released its Generation 88 through-hole equipment portfolio. Refined through decades of experience, the company's current throughhole lineup builds upon the industry-standard for design and reliability to conquer the growing demands of the industry.
United Resin: Fast-Cure Adhesive
Publication Date: 6/3/2011

Royal Oak, MI — United Resin Corporation has developed a very fast cure epoxy adhesive called E-Cast F-28 resin and 385 hardener.
Testronics: Upgraded Backplane Test System
Publication Date: 6/3/2011

Richardson, TX — Testronics has added top-side probing to its Model 402LV Backplane Test System.
Speedline Intros SPI Print Optimizer
Publication Date: 6/3/2011

Franklin, MA — Speedline Technologies has introduced the SPI Print Optimizer, now available with MPM printers. The SPI Print Optimizer utilizes measurements from the end-user's automated, 3-D Solder Paste Inspection (SPI) machine as part of an integrated, closed-loop system to align the printed circuit ...
Semi-Automated Optical Inspection System from Simmons
Publication Date: 6/3/2011

Exton, PA — RS Simmons has introduced the SimmScope Semi-Automatic Optical Inspection System (SOI) for printed circuit boards. According to the company, the SimmScope greatly enhances the speed and accuracy of manual PCB assembly inspection at a fraction of the cost of an AOI. It also reduces fatigue ...
Omron: High-Speed PCB Inspection Solutions
Publication Date: 6/3/2011

Schaumburg, IL — Omron Inspection Systems has introduced high-speed enhancements for the industry proven VT-RNS Automated Optical Inspection System. These enhancements were developed to help manufacturers shorten program generation, improve inspection cycle time and eliminate escapes and reduce false ...
Nordson YESTECH: Upgraded AOI Software
Publication Date: 6/3/2011

Carlsbad, CA — Nordson YESTECH has introduced the latest generation FX Series AOI and upgraded YESPC software. The FX is equally well suited for high-volume or high mix manufacturing environments, providing fast throughput and high resolution for inspection of 01005 components. The company's Advanced ...
Nordson DAGE: High Resolution X-ray Inspection
Publication Date: 6/3/2011

Aylesbury, Buckinghamshire, UK — Nordson DAGE's flagship X-ray inspection systems use the latest technology, flat panel detector to provide the ultimate choice for the highest quality real time X-ray imaging. The special NT maintenance-free, sealed transmissive X-ray tube, provides 100 nanometer ...
Multi-Seals Intros Nano-Forms Preforms
Publication Date: 6/3/2011

Manchester, CT — Multi-Seals Inc. is introducing Nano-forms epoxy preforms to provide precision seals on microelectronics. With preforms as small as 0.035-in. (0.89mm) outside diameter and 0.011-in. (0.28mm) inside diameter, Nano-forms allow highly repeatable placement of minute amounts of epoxy ...
Microscan Launches Free Online Barcode Generator
Publication Date: 6/3/2011

Renton, WA — Microscan has introduced, a free online barcode generator located at that allows visitors ...
Magid's Palm Coated Gloves Add More Protection
Publication Date: 6/3/2011

Chicago, IL — Magid Glove & Safety has added two new gloves to the XKS family line today with the addition of the Magid® CutMaster® XKS500 and XKS510 palm coated styles, taking the XKS Work Gloves' already extreme cut protection to the next level.
Juki's Ups Speed with New High-Speed Modular Mounter
Publication Date: 6/3/2011

Morrisville, NC — Juki Automation Systems, Inc. has released the FX-3R High-speed Modular Mounter. The newest model in the series, the FX-3R has significantly higher production capacity than its predecessor, the FX-3. Design improvements to both hardware and software give the FX-3R a production capacity ...
Hesse & Knipps Launches Wire Bonding Video Demos on Web
Publication Date: 6/3/2011

San Jose, CA — Hesse & Knipps Semiconductor Equipment GmbH has recently launched its new wire bonding demonstration website at . The new website presents more than two dozen videos demonstrating various thin wire wedge bonding, ribbon bonding and heavy wire bonding technologies ...
Hakko: Fume Extraction System
Publication Date: 6/3/2011

Valencia, CA — The Hakko FA-430 fume extraction system has powerful suction yet can be quiet as a mouse. It has three airflow adjustment modes (High, Medium and Low), a 3-stage filtering process, and a filter replacement notification function that ensures excellent filtering efficiency. 
The notification function detects the number of fan revolutions and then notifies the operator of the appropriate time to replace ...
GPD Global Software Optimizes Underfill
Publication Date: 6/3/2011

Grand Junction, CO — GPD Global's FLOware® Operating Software now offers patent-pending optimization for complex underfill processes.
It can be difficult to program an optimized routine for products that have multiple sizes of components to be underfilled. The difficulty is in the timing of each pass to ensure an optimal flow time. The FLOware software's UltiPath optimization routines ...
Goepel: AOI of Bonding Pads
Publication Date: 6/3/2011

Jena, Germany — Goepel electronics' OptiCon AOI systems can now be utilized for automated inspection of bonding pads for solder splashes, deformations and any other impurities in the micrometer range. Meeting these test tasks, an additional camera module with a resolution of 3µm is available in the AOI systems.

An adaptive illumination system and specially developed inspection functions reportedly enable best possible
Essemtec: Universal Interface Aids Prototyping
Publication Date: 6/3/2011

Aesch, Switzerland — Essemtec has developed a universal interface that allows data exchange with nearly all CAD and pick-and-place systems. The only requirement is that data must be provided as ASCII text files. The input filter of the interface can be adapted to the data structure.
Data I/O: SuperBoost for Embedded Devices
Publication Date: 6/3/2011

Redmond, WA — Data I/O Corporation has introduced SuperBoost for FlashCORE III technology — which significantly decreases programming times for e.MMC and SD devices and increases production throughput.
SuperBoost is a field-upgradeable feature for FlashCORE III programmers that fundamentally re-architects and optimizes the ...
Bliss Debuts the PCB Vertical Carrier
Publication Date: 6/3/2011

Milpitas, CA — Bliss Industries Inc. is introducing its new PCB Vertical Carrier. The unusual new patent-pending carrier and cart is designed to accommodate almost any size PCB or PCBA.
The ESD-safe PCB Vertical Carrier includes two bottom rows of adjustable guides and one back row, preventing spilling PC boards. The carrier is easy to ...
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