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Lord Corp. Intros Thermal Die Lid Attach
Publication Date: 8/20/2008

Cary, NC — Lord Corporation has developed MT-431 a non-silicone thermal die lid attach (TDLA) adhesive. According to the company, the adhesive was developed in response to customers looking to replace their existing two material processes (such as a thermal interface material (TIM) and a lid attach material ...
Conductive Potting Compound from Epoxies Etc.
Publication Date: 8/20/2008

Cranston, RI — Epoxies Etc.'s UL 94 V-O listed 50-2369 FR is described as the fastest self extinguishing thermally conductive polyurethane potting compound available on the market today. It offers a combination of properties seldom seen in a Thermally Conductive Potting Compound. The compound provides ...
Benchtop Stencil Printer from Manncorp
Publication Date: 8/20/2008

Huntingdon Valley, PA — An improved version of Manncorp's Model 5500 Benchtop Stencil Printer incorporates an innovative design that provides true vertical separation of the stencil from the PC board, prior to the lifting of the stencil frame. This movement of the stencil from the PC board is an ...
DMI Intros Cost-Effective Fixture Material
Publication Date: 7/23/2008

North Plains, OR — DMI International's HC300 composite material, manufactured in USA reportedly offers excellent benefits in overall performance for necessary palleting/fixtures in PC board (Printed Circuit Board) production line processing. The composite material is already in use in 2000 plus solder ...
Vitronics Soltec Unveils New Wave Soldering Platform
Publication Date: 5/11/2007

Stratham, NH — Vitronics Soltec has introduced the new Delta flexible wave soldering platform, designed to deliver high yields and throughput while minimizing downtime and cost ...
SEHO: Smart, Programmable Wave Soldering System
Publication Date: 6/12/2007

Ashland, VA — SEHO PowerSelective "smart" wavesoldering system offers highly flexible selective soldering offering what the company calls absolutely reproducible results along with high solder quality.
Rapid Ramp-Up IR Underheater from Manncorp
Publication Date: 1/25/2008

Huntingdon Valley, PA — Manncorp has introduced a rapid IR underheater, a self-contained unit that safely boosts PC board preheat temperatures at the industry-mandated rate of 3.5°C/second and set temperatures are constantly maintained during soldering. With up to 50 percent of thermal energy from ...
OK Int'l Convection Pre-Heater for High Efficiency
Publication Date: 5/11/2007

Garden Grove, CA — OK International has introduced a focus pre-heater for enhanced process control during lead-free hand assembly and rework. The PCT-100 uses convection air he ...
OK Int'l Launches Dual Output Soldering/Rework System
Publication Date: 4/28/2008

Garden Grove, CA — OK International's new MFR-2200 Series Soldering and Rework System delivers a high power, flexible solution for production hand soldering, touch-up and SMD rework. Incorporating the renowned response and control of SmartHeat® Technology, the new system incorporates the ability ...
OK International Enhances Fume Extraction Performance
Publication Date: 8/21/2007

Garden Grove, CA — OK International has enhanced its BVX-200 Fume Extraction System with brushless motor technology, which eliminates wearout of motor parts and significantly increases system lifetime in normal operation. According to the company, the system also delivers enhanced reliability, improved ...
New Generation Conductive Desoldering Pump from Topline
Publication Date: 6/12/2007

Garden Grove, CA — Topline has introduced "Vyper" — an ergonomic ESD-safe hand desoldering tool. The Vyper is described as a totally new desoldering pump, designed to simplify desoldering operations.
Multicore® LF600 Lead-Free Solder Paste from Henkel
Publication Date: 5/11/2007

Irvine,CA — Henkel has introduced a new advanced lead-free solder paste material designed for the ultimate in manufacturing flexibility and superior performance regardless of regional cli ...
Manncorp: Specialty Soldering Equipment
Publication Date: 12/7/2007

Huntingdon Valley, PA — A new series of low-cost benchtop machines and accessories employing varying techniques to solder or desolder board components has been added to Manncorp's product line. Designed to meet the needs of low to mid-volume PC board assemblers...
Manncorp Intros Next Gen Reflow Ovens
Publication Date: 3/26/2008

Huntingdon Valley, PA — Manncorp is now offering a new generation of forced hot air lead-free CR reflow systems that meet the high temperature and tight process control requirements of lead-free. The new ovens reportedly occupy up to 30 percent less...
ITW Chemtronics Intros Lead-Free Flux
Publication Date: 7/20/2007

Kennesaw, GA — ITW Chemtronics has introduced a new lead-free soldering flux to its CircuitWorks® line of benchtop circuit board repair and rework products. CircuitWorks Lead-Free Flux is specifically designed for soldering and desoldering applications where lead-free solder alloys are being employed ...
Heraeus Intros Water Soluble Ball Dip Paste
Publication Date: 8/21/2007

West Conshohocken, PA — Heraeus has introduced a new line of water-soluble ball dip pastes for solder on pad (SOP) substrates. The BD paste series enables manufacturers to utilize SOP substrates while maintaining outstanding yields. Since the convex surface of the SOP substrate causes solder ball ...
Hakko: IR Preheater and Boom Stand
Publication Date: 9/24/2007

Valencia, CA — American Hakko Products, Inc. has introduced the FR-1012 (P/N: FR1012-01) — a benchtop board heater designed to elevate the temperature of printed circuit board assemblies so that components on them can be soldered and de-soldered more easily, and with improved results. This is ...
Hakko: Dual Port Soldering System
Publication Date: 1/25/2008

Valencia, CA — The Hakko FM-203 dual port soldering system offers two ports that can be used for multiple Hakko tools, including two soldering irons or any combination of soldering iron and SMD hot tweezer, SMD mini hot tweezer or the Hakko FM-2024 desoldering tool. The soldering system also provides ...
Hakko: Desoldering and Soldering Station
Publication Date: 4/28/2008

Valencia, CA — The Hakko FM-204 desoldering station has a built-in vacuum pump, a gun or pencil style desoldering handpiece, quick-change composite nozzles (N3 series), a lockout key card that prevents accidental or unauthorized temperature settings, sleep mode functionality that engages when the ...
Hakko: Compact Soldering Station
Publication Date: 3/26/2008

Valencia, CA — American Hakko Products has introduced the Hakko FX-951 — a compact, color-coordinated soldering station that is best described as "cute". Its attractive exterior encloses a unit that has all the power of the Hakko FM-203 yet fits on the palm of the user's hand. According to the ...
 
 
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