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Goepel: New Debug Interfaces
Publication Date: 8/12/2010

Jena, Germany — Goepel electronic is introducing TIC020, another TAP Interface Card (TIC) within the JTAG/Boundary Scan hardware platform SCANFLEX® family. The new TIC module has a programmable multi-bus interface, which enables nearly unlimited compatibility with numerous standardized and proprietary ...
New Boundary-Scan Tools from JTAG
Publication Date: 8/12/2010

Eindhoven, Netherlands — JTAG has released its development and hardware debug tool, JTAG ProVisionT V1.8, available on the company's latest tools CD (release 16). An important development tool for all boundary-scan applications, ProVision combines advanced automation with the level of control and ...
Nordson YESTECH: Next Gen Conformal Coat Inspection
Publication Date: 7/7/2010

Carlsbad, CA — Nordson YESTECH has introduced the next generation inspection solution, the FX-UV Automated Conformal Coating Inspection System. Conformal coatings used by electronic manufacturers contain U.V. indicators for the purpose of quality inspection. Since coatings are transparent, units ...
Spartanics Offers Free Materials Testing for Laser Cutting
Publication Date: 7/7/2010

Rolling Meadows, IL — Spartanics has opened its Laser Die Cutting Applications Laboratory for Materials Research to assist electronics engineers and electronics products manufacturers in using rapidly advancing laser die cutting technology. The technology is useful for manufacturing membrane switches ...
T-Tech Intros Advanced Prototyping System
Publication Date: 7/7/2010

Norcross, GA — T-Tech Inc. is introducing its latest and most advanced PCB prototyping system — the Quick Circuit QCJ5.
 This state-of-the-art in-house circuit board prototyping system is equipped with a host of features including: Z-Axis motion control; 12-, 24-, or 32-position automatic tool change...
Lambient: Products for Dielectric Cure Monitoring
Publication Date: 7/7/2010

Boston, MA — Lambient Technologies LLC develops instruments, sensors and software for monitoring the dielectric properties of curing polymers. These properties provide insight into the chemistry, formulation, reaction rate, viscosity and cure state of epoxies, polystyrenes, polyurethanes, silicones ...
Renishaw Intros 5-Axis Touch-Trigger Probe
Publication Date: 6/3/2010

Hoffman Estates, IL — Renishaw's new PH20 probe head increases touch-trigger coordinate measurement machine (CMM) inspection throughput up to three times using fast, infinite, rotary positioning and unique "head touch" capability for high-speed point capture with minimal CMM movement. Designed for use with the industry-standard TP20 touch-trigger probe, the new PH20 head brings 5-axis inspection capability ...
Pressurex Pressure Sensor Film Aids Bond Strength
Publication Date: 6/3/2010

Madison, NJ — When used in microelectronics, ultrasonic welding creates reliable bonds without introducing impurities or thermal distortion into components. Semiconductor devices, transistors and diodes are often connected by thin aluminum and gold wires using ultrasonic welding. It is also used ...
DEK: Sentinel Print Inspection System
Publication Date: 6/3/2010

Rolling Meadows, IL — DEK's new Sentinel system is designed to safeguard stencil print productivity — unifying automatic verification, traceability, real-time process management and inspection capabilities. It reportedly safeguards and increases productivity at the print platform, measured most effectively and realistically as even greater numbers of qualified good boards per hour moving  ...
Goepel Develops DDR3 Memory Test Module
Publication Date: 6/3/2010

Jena, Germany — Goepel electronic has introduced the CION Module/SO-DIMM204-3, the newest member of the company's CION product family. The new low-cost, digital I/O module is controlled through an IEEE 1149.1 TAP (Test Access Port) and provides resources for connectivity testing of all signal ...
New ACE Software Toolkit for Selective Soldering
Publication Date: 6/3/2010

Spokane, WA — Selective Soldering has been made simpler and easier by the launch of ACE production Technologies' new KISS-Ware 2.0 software and programming tools. This latest release of the company's advanced selective soldering software.
Designed to provide users with a more intuitive programming platform, the new software easily...
SPEA Intros Innovative Flying Prober
Publication Date: 6/3/2010

Volpiano, Italy — SPEA has introduced the all new 4030 Flying Probe Tester, expressly designed to replace bed-of-nails systems in the production test of SMT boards. According to the company, it overcomes accessibility limits, offering high productivity, great flexibility and low cost of test in a ...
Vi Tech: 3D AOI System
Publication Date: 6/3/2010

Saint-Egreve, France — Vi Technology has introduced the 2K High Speed, a fast and compact AOI solution. Designed to provide a solution to the most demanding applications, it combines very high throughput and extremely small components inspection to meet the challenges of miniaturization in high-throughput ...
Machine Vision Intros Large-Board Capacity AOI
Publication Date: 5/7/2010

Carlsbad, CA — Machine Vision Products (MVP) has introduced its new large board AOI system, the MVP Spectra. Built on the robust design of the Supra and Ultra series, this system uses a tri-linear stage and comes in two formats. The Spectra is capable of inspecting boards up to 24 x 24-in. (610 x 610mm) , while ...
Nordson YESTech Debuts Upgraded Software
Publication Date: 5/7/2010

Carlsbad, CA — Nordson YESTech has upgraded YESPC software and has unveiled its FX Series AOI and advanced technology 3D X-Ray inspection solutions for populated printed circuit boards. The YESPC software is a web-based SPC (Statistical Process Control) tool that can be utilized for both real-time ...
PVA: Fiducial Camera Auto Corrects Board Misalignment
Publication Date: 5/7/2010

Halfmoon, NY — PVA (Precision Valve & Automation, Inc.) has released an active fiducial camera option for all PVA350, PVA650, and PVA2000 selective coating platforms. The 640 x 480 CMOS camera provides an extraordinary level of control and accuracy by automatically confirming alignment against a ...
Seica Develops Thermal Scan for Probers
Publication Date: 5/7/2010

Salem, NH — Seica, Inc. has just introduced "Flying IC Thermal Detection Units" on its line of Aerial flying probers. Two IC Thermal Detection Units are positioned on each side of the unit under test to detect thermal parameters of ICs under power. The purpose is to compare temperatures of known ...
Vi Technology: Turbocharging AOI Systems
Publication Date: 5/7/2010

Saint-Egreve, France — Vi Technology's Vi-3D-SPC integrated SPC software is a powerful, fully featured, easy-to-use SPC modular software platform. It is fully integrated with the 3D-SPI machine; data transfer is over a high-speed network connection directly from the source.
Goepel Intros Low-Cost Boundary Scan Controller
Publication Date: 5/7/2010

Jena, Germany — Goepel electronic has introduced the SCANBOOSTER/PCI-DT, a new high-performance, low-cost boundary scan controller, as an addition to the company's product line. The new controller is compliant with the PCI bus specification and supports JTAG/Boundary Scan tests, VarioTAP® emulation ...
Viscom Intros Hi-Performance AOI
Publication Date: 2/6/2010

Hanover, Germany — Viscom has unveiled the newest version of the S3088 system AOI family — optimized for fast, highly accurate solder joint inspection. Inspectable printed circuit board dimensions have been significantly enlarged and the camera technology further improved. The system is delivered with the latest software release, containing even more helpful new functions for inspection operation.
The company's new AOI system is deliberately focused on economical electronic assembly inspection — from prototypes to
...
 
 
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