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BTU: Enhanced Energy Pilot Software
Publication Date: 8/13/2015

North Billerica, MA — BTU International, Inc. is exhibiting the PYRAMAX reflow oven and its enhanced ENERGY PILOT software. In addition to taking advantage of idle time to reduce oven operating costs, the latest release of BTU's Energy Pilot software allows users of the company's reflow ovens ...
Canadian EMS Dorigo Adds Koh Young 3D SPI, AOI
Publication Date: 8/13/2015

Chandler, AZ — Canadian Pacific Northwest EMS leader Dorigo Systems has installed Koh Young KY8030-3 SPI and Zenith 3D AOI systems in the company's newest SMT PCBA manufacturing line, adding 3D measurement and inspection capability for printed solder paste (SPI) as well as completed SMT assemblies ...
Fujipoly: ECU and Embedded Systems Cooling
Publication Date: 8/13/2015

Carteret, NJ — Fujipoly® offers one of the industry's most comprehensive assortments of Thermal Interface Materials for both commercial and military vehicle ECUs. The company manufactures its proprietary Sarcon® material in many different forms, thicknesses and shapes to satisfy nearly any application ...
Hemco: Enclosures for Lab Automated Processes
Publication Date: 8/13/2015

Independence, MO — HEMCO EnviroMax Enclosures are engineered to isolate lab automation instrumentation and processes that include liquid handling, powder and sample weighing, and high throughput screening. They are available in standard sizes or can be fabricated to meet the customer's exact size ...
inTEST Thermal Launches Benchtop IC Temp Testing
Publication Date: 8/13/2015

Temperature tester attaches to DUT.
Mansfield, MA — inTEST Thermal Solutions has introduced two benchtop systems for temperature testing integrated circuits, including high-watt emitting devices. The Temptronic® ThermoSpot® consists of a highly responsive benchtop temperature-forcing unit that feeds a thermal probe head through a flexible umbilical.
IPTE: Easy-Test-Handler and EasyRouter
Publication Date: 8/13/2015

Genk, Belgium — IPTE is showing its Easy-Test-Handler ETH and the depaneler EasyRouter. The Easy-Test-Handler ETH can be used for in-circuit or functional test as well as programming processes — all can be inline automated. The ETH is practical for use with individual PCBs, multiple boards or ...
KEMET Expands Automotive Polymer Electrolytic Capacitor Ratings
Publication Date: 8/13/2015

Lech, Germany — KEMET has expanded the specifications of its line of automotive grade polymer electrolytic capacitors. The T591 High Performance Automotive Grade Polymer Electrolytic Series delivers stability and endurance under harsh humidity and temperature conditions. The new extensions include ...
Kyzen: Award-Winning AQUANOX A4708
Publication Date: 8/13/2015

Nashville, TN — Kyzen's innovative new product technology will display the acclaimed, advanced technology AQUANOX® A4708, which already has won three industry awards since its debut earlier this year.
Metcal: Scarab Site Cleaning System
Publication Date: 8/13/2015

Garden Grove, CA — Metcal is exhibiting its new Scarab Site Cleaning System (APR-2000-SCS) along with the new Solder Ball Replacement Kit and MX-HPDC dual cartridge hand piece.
Nordson DAGE: Best-in-Class Test and Inspection Equipment
Publication Date: 8/13/2015

Aylesbury, Buckinghamshire, UK — Nordson DAGE, a division of Nordson Corporation (NASDAQ: NDSN), is exhibiting the 4000Plus Bondtester and XD7600NT Diamond FP X-ray inspection system. The second-generation 4000Plus Bondtester offers extraordinary accuracy and repeatability of data, providing complete ...
Rehm: Vacuum Soldering Systems
Publication Date: 8/13/2015

Blaubeuren-Seissen, Germany — Rehm Thermal Systems is showing its energy-efficient, low-maintenance and void-free convection Reflow Soldering System VisionXP+. The vacuum option is particularly noteworthy, since the usual method has been to remove voids and pores at the soldering point with an external ...
Scienscope Intros X-Scope 8000 AXI
Publication Date: 8/13/2015

Chino, CA — Scienscope International, a complete inspection solutions provider, is exhibiting its new X-Scope 8000 AXI. AXI systems from Scienscope are fully automatic X-Ray inspection machines using new advanced servo axis motion technology in order to rotate the target, and move the flat panel ...
ULVAC Ships Plasma Ashing System to U.S. Government Facility
Publication Date: 8/13/2015

Methuen, MA — ULVAC Technologies, Inc. has delivered an ENVIRO-1Xa plasma ashing/photoresist stripping system to a U.S. Government Research Facility, in the Washington, DC area. The ENVIRO-1Xa is described as the most capable and flexible ashing system for advanced research and critical manufacturing ...
VJ Electronix: Advanced Rework Technologies
Publication Date: 8/13/2015

Littleton, MA — VJ Electronix, Inc. will highlight the new high-performance Summit II, SRT Micra and XQuik with AccuCount for counting components stored in reels. The new Summit II is the latest semi-automated rework system. Improved ergonomics combined with next-generation controls and proven heating ...
ClassOne Electroplating System Goes to MEMS Foundry X-FAB
Publication Date: 7/10/2015

Kalispell, MT — X-FAB, recently named "MEMS Foundry of the Year," has just purchased a new Solstice® S8 Electroplating System from ClassOne Technology. The 8-chamber, fully-automated tool will be installed at the X-FAB facility in Erfurt, Germany.
Flexible Flat Semiconductor Cables from Cicoil
Publication Date: 7/10/2015

Valencia, CA — Rated for Class 1 Clean Rooms utilized in Semiconductor Wafer Fabs, Cicoil's Flexible Flat Cables are suitable for operational critical applications that require absolute reliability. The crystal-clear designs are free of halogens and contaminants, and are an excellent alternative ...
Kyzen: Innovative Advanced Packaging Chemistry
Publication Date: 7/10/2015

Nashville, TN — Kyzen's innovative innovative new MICRONOX® MX2710 pH Neutral Advanced Packaging Chemistry is a universal cleaning agent for advanced packaging. Formulated for optimum Cu pillar compatibility, MX2710 is environmentally friendly and provides brilliant solder joints. It is available ...
MIRTEC Previews Advanced SiP Inspection and Measurement System
Publication Date: 7/10/2015

Oxford, CT — MIRTEC is showing its most recent solutions for System in Package (SiP) inspection and measurement. The company's MP-520 system was developed specifically to address the challenges related to SiP inspection. It combines Precision Linear Drive Motor Technology with the company's exclusive ...
Nordson DAGE Launches New Wafer Level Bondtester
Publication Date: 7/10/2015

Aylesbury, Buckinghamshire, UK — Nordson DAGE, a division of Nordson Corporation (NASDAQ: NDSN), is presenting the 4800 wafer level Bondtester for the first time in North America. The Bondtester is described as being at the forefront of wafer testing technology, developed for testing wafers from 200 up to 450mm ...
Adhesive-Backed Nylon Lock-Fit PCB Supports from Keystone
Publication Date: 4/27/2015

Astoria, NY — A new assortment of adhesive-backed Nylon stacking Spacers/Supports is among the latest circuit board hardware components available from Keystone Electronics Corp.
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