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Thursday, October 19, 2017
VOLUME - NUMBER
The ASSEMBLY Show, MD&M Minneapolis, productronica '17
NEPCON South China '17
ATX East / MD&M '17
SEMICON WEST '17
NEPCON China, SMT/Hybrid Pkg, EWPTE, EDS '17
ATX West and IPC APEX '17
ADM Cleveland and APEC '17
SMTAI and IMAPS '16
SEMICON West '16
NEPCON China '15
ATX WEST/APEX '15
SMTAI, Autotest, ATX MW/MDM and Assembly '14
AATE and IPC MW 11
Electronics West/MDM and IPC/APEX '13
SEMICON West '14
IPC APEX '14
NEPCON China Product Preview '12
SEMICON WEST 10
Electronics West/MDM 11
Atlantic Design/MDM 11
ATLANTIC DESIGN & MFG '13
SEMICON WEST 08
Electronics West/MDM 08
NEPCON China Product Preview '13
Multi tradeshow Product Preview '12
ATE and IPC MW 09
Electronics West/MDM 12
NEPCON South China '16
Atlantic Design/ATX/MDM '16
NEPCON China,SMT/Hybrid Pkg,EDS,EWPTE '16
ATX/MDM West '16
productronica,The ASSEMBLY Show, IMAPS, MDM/Minneapolis '15
SEMICON West '15
Nepcon South China '15
EDS, SMT/Hybrid Pkg,Wire Tech Expo '15
ATX/MDM EAST '15
SEMICON West '13
NEPCON China, SMT/Hybrid Pkg, EDS, NWPTE '14
Electronics West/MDM 10
ATX Midwest, IMAPS, PCB West '13
ATX West '14
ATExpo & IPC MW 07
NEPCON China '13, EDS, more
SEMICON WEST/Intersolar '12
Atlantic Design/MDM 10
Atlantic Design/MDM 09
ATExpo & IPC MW 08
NEPCON South China '13
Electronic West/MDM 09
SMTAI and productronica '13
AATE/IPC Midwest 10
SMTAI and productronica '13
Atlantic Design/MDM 08
Lista Creates Space-Saving Shelf Converter
Allentown, PA — Boosting productivity and maximum storage, the new Lista Shelf Converter
System transforms ordinary shelving into an efficient, high-density storage solution. Adjustable shelves, drawers, and trays convert existing shelving into customized storage to best fit everyday storage needs ...
LORD Provides Bonding Solutions for Assembly
Cary, NC — LORD is now offering bonding solutions for a wide variety of assembly applications. Products include Maxlok T6 acrylic adhesives and 310 A/B epoxy adhesive, as well as 7542, 7545, 7550, and 7556 urethane adhesives.
MacDermid Develops Microvia Filling Process
Waterbury, CT — MacDermid Enthone Electronics Solutions has released its MacuSpec AVF 700 process. AVF 700 is a high-performance electrolytic copper metallization process for the filling of PCB microvias.
marco Designs High-Performance Dispensing Systems
Dachau, Germany — A vertically-integrated systems analysis and process development company, marco offers a wide range of dispensing systems. These high-performance systems are based on proprietary piezo-ceramic technology. The dispensing valves and associated control units are designed to solve challenging ...
MEK Intros Simultaneous 2D and 3D SPI
Las Vegas, NV — MEK is displaying the latest version of its ISO-Spector SPI system. The new model is being displayed for the first time at productronica 2017. The ISO-Spector S2 has third-generation sensor technology, enabling simultaneous 2D and 3D inspection.
Metcal Offers Wide Selection of Soldering Tools
Cypress, CA — Metcal is now offering a range of soldering tools, along with its new connection validation (CV) selective soldering system. CV is the company's latest hand soldering innovation. Built on Metcal's SmartHeat
technology, CV evaluates the quality of the solder joint by calculating ...
MicroCare Intros "Green" Cleaning Products
New Britain, CT — MicroCare has presented a new range of "green" cleaning products, including a new universal flux remover and its Tergo
high-performance flux remover. All of the company's chemistries are designed to help customers clean PCBs fast and at a low cost, while meeting regulations ...
Microscan Debuts New Machine Vision Camera
Renton, WA — Microscan has added a new machine vision camera to its HAWK family. The camera is four times faster and more powerful than any other that the company has released thus far.
Microtronic Showcases SEMs and Solderability Tester
Munich, Germany — Microtronic is showcasing a variety of microelectronics production and quality assurance equipment, including PEMTRON's PS series of scanning electron microscopes (SEMs), the LBT-210 solderability tester, AIM solder materials, and more from its other suppliers.
MIRTEC Highlights MV-6 OMNI 3D AOI
Oxford, CT — MIRTEC's MV-6 OMNI 3D AOI system is configured with the company's exclusive OMNI-VISION
3D inspection technology. It combines 15 MP CoaXPress cameras with the company's eight-projection digital multi-frequency moiré 3D system, in a newly-designed cost-effective platform.
MVP Demos Latest Inspection Equipment
Carlsbad, CA — Machine Vision Products, Inc., (MVP) is now offering its latest lineup of AOI systems for microelectronics, semiconductor and SMT assembly.
New Fume Extraction Solutions from Purex
Schaumburg, IL — Purex filters are used throughout the electronics industry to filter gases and particulates that are generated by a wide variety of applications. These include laser coding and engraving, hand and machine soldering, chemical handling, coating and spraying, and many others. ...
New High-Speed Die Bonder from MRSI
North Billerica, MA — MRSI Systems has recently launched a new high-speed die bonder, the MRSI-HVM3. The system is aimed at high-volume photonics manufacturing.
Nordson Test: Full Lineup of Automated Inspection Systems
Vista, CA — Nordson Test & Inspection, made up of DAGE, MATRIX and YESTECH, is displaying a full lineup of inspection systems at productronica 2017. These include the Quadra
7 and Quadra 5 X-ray inspection systems, the new XS series in-line X-ray inspection platform complemented by the X# series ...
Panasonic Adds to NPM Series of SMT Systems
Rolling Meadows, IL — Panasonic has added to its series of SMT systems with the new NPM-W2S component placement system. The NPM-W2S is geared for manufacturers who value a reduction in set up and changeover time over pure speed. The system offers a completely integrated, single-platform solution, providing ...
Permabond's Acrylic Adhesives Bond Untreated Plastics
Somerset, NJ — Permabond has released new acrylic adhesives, TA4605 and TA4610. These new materials are designed to form strong bonds with low-surface-energy plastic substrates, such as polypropylene, polyethylene, EPDM, and PTFE, without have to pretreat the surface.
Peters: Deep Black Solder Mask for LED Applications
Kempen, Germany — LED technology is often assembled on temperature-stable white substrates with a high degree of reflectivity. Some applications, however, require the opposite effect — maximum absorption and minimal diffusion, e.g. for generating a small point-shaped light-source. LED display ...
PI Creates Mini X/Y Stage for Precision Positioning
Auburn, MA — PI (Physik Instrumente) has developed a new, ultra-compact x/y scanner and positioner, U-723. The positioning stage is powered by small, integrated direct-drive ultrasonic piezoceramic motors. A single-axis version is also available.
Pickering Creates High-Density Reed Relays
Clacton-on-Sea, UK — Pickering's new 120 series 4mm
reed relay range requires a board area of only 0.16 x 0.16 in. (4 x 4 mm). Two switch types are available: a general purpose sputtered-ruthenium switch rated at 15W, 1A (3V version) or 20W, 1A (5 and 12V versions), and a low-level ...
Pillarhouse Displays Full Range of Selective Soldering
Elk Grove Village, IL — Pillarhouse International is displaying its full range of selective soldering systems at productronica 2017, from the entry-level Pilot to the premium, in-line Orissa Fusion.
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