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EVS Reduces Solder Consumption by 50 Percent
Publication Date: 9/20/2016

Isle of Wight, UK — EVS International has added the EVS 8KLF to its line of solder recovery systems, which includes the EVS 500 and EVS 500LF. The simple, yet ruggedly designed EVS 500 can reduce dedrossing time by 75 percent and decrease waste dross by up to 85 percent. The system meshes perfectly ...
Gen3 Offers Cleaning and Contamination Test Systems
Publication Date: 9/20/2016

Farnborough, Hampshire, UK — Gen3 Systems has developed test and measurement equipment that helps predict the reliability of electronic circuits and systems in the field. The company offers its contaminometer series, which comprises the CM11+, CM22+, CM33+, CM33L+, CM60 and CMBBT.
Hakko Intros Hot Air Rework System
Publication Date: 9/20/2016

Valencia, CA — Hakko has introduced its FR-811, an economical rework system with a wide variety of intelligent features, making it a good system for reworking bottom-terminated components. The station can provide and control up to six profile stages, creating a full-scale thermal profile similar ...
Henkel Intros Silicon Sealant for Automotive Industry
Publication Date: 9/20/2016

Irvine, CA — A brand new silicone adhesive sealant technology from Henkel Adhesive Electronics has been designed to provide both high performance and process flexibility. The new material, Bergquist TLB 400 SLT, is a two-part silicone sealant designed for automotive module applications. With an adaptable ...
Indium Offers Solder Paste and Reinforced Preforms
Publication Date: 9/20/2016

Clinton, NY — Indium Corporation has developed a halogen-free, no-clean solder paste, Indium8.9HF. The paste is specifically formulated to reduce voiding while delivering high transfer efficiency with low variability. The no-clean paste is good for a variety of applications, especially automotive ...
Inovaxe Intros Smart Rack and Mechanical Cart
Publication Date: 9/20/2016

Deerfield Beach, FL — Inovaxe has introduced two new products, its SR series of smart racks and its InoBin smart mechanical cart. The smart rack is intended for customers whose main challenge is finding parts quickly and do not need all the features of the InoAuto smart cart. The design is based ...
inTEST Intros IC Temperature Characterization System
Publication Date: 9/20/2016

Mansfield, MA — Called a "breakthrough in IC temperature characterization," by inTEST, the company's new Temptronic® ThermoSpot benchtop system has been designed to offer temperature forcing without the use of thermoelectric (TE) modules.
JTAG: Hardware for PCB Test and In-System Programming
Publication Date: 9/20/2016

Easton, MD — JTAG's latest products demonstrate the company's focus on "fixture embedded" test technology. The JT 5705/FXT multi-function JTAG tester is a compact, single-board test system that supports analog measurement and stimulus, frequency measurements, digital I/O, boundary-scan testing, and ...
Juki Launches Intelligent Storage System and X-ray Platform
Publication Date: 9/20/2016

Morrisville, NC — Juki Automation Systems has introduced its ISM UltraFlex 3600 intelligent storage system that provides automatic kitting for the next placement machine run. The company has also developed a new X-ray component counting platform.
KIC's Smart Oven Technology Reduces Oven Costs
Publication Date: 9/20/2016

San Diego, CA — KIC has developed smart oven technologies that lead to reduced production costs, higher quality and the new capabilities that the electronic assembly market demands.
Koh Young Offers Full Lineup of SPI and AOI Systems
Publication Date: 9/20/2016

Chandler, AZ — Koh Young Technology now offers what it has named a "total 3D inspection and process optimization solution" for PCB manufacturers and assemblers. The company's complete offering ranges from advanced solder paste inspection (SPI) systems for process optimization to automated optical ...
ManexERP: MX System for Cable and Wire Harness Production
Publication Date: 9/20/2016

Chicago, IL — ManexERP has introduced the next generation of its enterprise resource planning (ERP) software for electronics manufacturers and cable and wire harness manufacturing companies. The all new MX is a dashboard and business intelligence software solution. Its easy-to-use workflow is powerful ...
Metcal: Solder Wire Feeder and Rework Systems
Publication Date: 9/20/2016

Cypress, CA — Metcal has introduced its new USF-1000 solder wire feeder, which allows a new level of control during the soldering process. The company also offers a range of proven rework and repair equipment, which includes the Scarab site cleaning system, the scorpion rework system, and the MX ...
Mirtec Offers 3D AOI and 3D SPI Systems
Publication Date: 9/20/2016

Oxford, CT — Mirtec offers a range of automated inspection systems including its MV-6 Omni 3D AOI and MS-11e 3D SPI systems. According to the company, the market demand for the two systems has led to three straight quarters of unprecedented growth for the organization.
Nihon Intros Lead-Free No-Clean Solder Paste
Publication Date: 9/20/2016

Osage Beach, MO — Nihon Superior's new SN100CV P506 D4 is a lead-free, no-clean solder paste alloy designed to result in thermally stable solder joints even after thermal cycling. Unlike silver-containing alloys that derive their strength from a dispersion of fine particles of eutectic Ag3 ...
Nordson ASYMTEK: Dual Programmable Pitch Coating Applicators
Publication Date: 9/20/2016

Carlsbad, CA — Nordson ASYMTEK has introduced dual-simultaneous programmable pitch on its Select Coat® SL-940 conformal coating system. With dual-simultaneous programmable pitch, two of the same conformal coating applicators are installed and operated simultaneously, coating two parts at the same ...
Nordson DAGE: Quadra 5 Flexible X-ray System
Publication Date: 9/20/2016

Aylesbury, Buckinghamshire, UK — Nordson DAGE, a division of Nordson Corporation, now offers its Quadra 5 flexible X-ray inspection solution, which it has developed specifically for the electronics market. The Quadra 5 offers high performance and ease of use for both 2D and 3D applications. Its ...
Nordson YESTECH: High-Powered 3D AOI System
Publication Date: 9/20/2016

Carlsbad, CA — Nordson YESTECH now offers its FX-940 Ultra 3D AOI with cutting-edge 3D technology for the inspection of solder defects, lead defects/tilted leads, component presence and co-planarity of chips, BGAs and other height-sensitive devices.
PA&E Intros Hermetic BMA RF/Microwave Connectors
Publication Date: 9/20/2016

Wenatchee, WA — Design engineers can now leverage the utility of a 38999 format, high-speed RF connector in harsh environment applications, following PA&E's release of its new hermetic 38999 blind mate attach (BMA) RF connector line.
Panasonic Launches PanaCIM Maintenance for Asset Management
Publication Date: 9/20/2016

Rolling Meadows, IL — Panasonic Factory Solutions Company of America has launched a new PanaCIM® maintenance solution to control the full lifecycle of any manufacturing asset. PanaCIM Maintenance brings innovative, value-added elements to help manufacturers streamline processes, reduce costs, increase uptime ...
 
 
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