Tuesday, June 19, 2018
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Nordson ASYMTEK Intros Bulk Fluid Dispensing Platform

Carlsbad, CA — Nordson ASYMTEK has introduced its Helios SD-960 series automated dispensing system for medium- and high-volume deposits of one- (1K) and two-component (2K) materials for electronics manufacturing and PCB assembly.
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Panasonic Presents Smart Factory Solutions

Rolling Meadows, IL — Panasonic is presenting a new range of full manufacturing optimization products, heavily focused on cyber-physical systems, at SMT Hybrid Packaging. The company's integrated line management system, iLNB, is the base for controlling the entire production line. It is not limited ...
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Pickering Showcases Switching and Simulation Modules

Grants Pass, OR — Pickering Interfaces is now offering a broad range of modular signal switching, simulation and cabling products for electronic test and verification. The company's two- and four-slot USB/LXI modular chassis offer small and lightweight form factors, well-suited for use in portable ...
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Plasma Etch Launches Handheld Plasma System

Carson City, NV — Plasma Etch has introduced a handheld version of its atmospheric plasma system. The plasma system is an "open-air" or atmospheric system designed for industrial surface modification. Atmospheric plasma is often used before bonding, printing or coating to increase the strength of ...
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Rehm Highlights Soldering Versatility and Transparency

Roswell, GA — Rehm is now offering its latest innovations in soldering, which include systems to make the soldering process more versatile and completely transparent. The need to provide corresponding data for digitized processes is a must today. With the introduction of ViCON system software, the ...
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SEHO Adds to Board Handling Systems

Erlanger, KY — Aiming to make electronics production more efficient and to reduce overall costs, SEHO has extended its selection of automated SMT solutions. These products now include board handling with conveyor systems to connect various machines and workplaces, along with buffer systems, turn ...
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Seica Demos "Next>" Series Production Systems

Haverhill, MA — Seica is demonstrating its "Next>" generation of solutions at SMT Hybrid Packaging, representing another leap forward for the company's range of production systems that includes flying probe test, soldering and inspection systems.
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Techcon: Dispensing Robot, Valve Controllers and Pneumatics

Cypress, CA — Techcon is displaying its TSR2000 smart dispensing robot, newly released smart valve controllers and its TS2560 series pneumatic applicators. The TSR2000 smart dispensing robot is designed specifically for precise fluid dispensing applications and is compatible with all valve types ...
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Thermaltronics Showcases Dual-Arm Soldering Robot

Great Neck, NY — Thermaltronics is now offering its TMT-R9800S dual-arm soldering robot in Germany, through its exclusive distributor Adopt SMT. The soldering robot has a variety of features not found on similar systems, such as six axes of motion, dual-arm capability, fiducial marks, dynamic laser ...
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TopLine Offers CCGA Solder Joint Reliability Solutions

Irvine, CA — TopLine is now offering a range of CCGA solder joint reliability solutions, including CCGA column grid arrays and daisy chain BGA test vehicles. TopLine's column grid array IC packages are made with non-collapsible solder columns for surface mount soldering on PCBs and provide more compliancy ...
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ULT Develops New Fume Extraction System

Löbau, Germany — ULT has introduced a series of fume extraction systems based on an entirely new design. The ULT 200 series was redesigned conceptually and technically and provides users with many new benefits.
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VERMES Debuts Versatile Microdispensing System

Otterfing, Germany — VERMES Microdispensing has launched its modular, highly flexible 3280 microdispensing system. The system is designed to adapt to various media and has many advanced features. Contact-free, precise media allocation enables fast cycle times. The fluidic parts uncoupled from the ...
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Viscom Exhibits Smart Factory Inspection Solutions

Duluth, GA — Viscom is highlighting its new X7056-II inspection system, which offers a combination of in-line 3D AXI and AOI, at SMT Hybrid Packaging. Viscom is also exploring the topic of artificial intelligence (AI). One of the highlights at the show will be a CFX showcase in cooperation with IPC ...
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VisiConsult Intros X-Ray Component Counting System

Stockelsdorf, Germany — VisiConsult has introduced its XRHCount, a fast and accurate X-ray component counting system. The XRHCount handles the counting of components with cycle times of less than 10 seconds.
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Anda Intros In-Line Plasma Cleaning Machine

Fremont, CA — Anda Technologies USA, Inc., has introduced its AP-460 atmospheric plasma treatment cleaning machine. The system is designed to remove impurities and contaminants, including dust, grease and dirt, as well as static electricity, from surfaces.
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B&K Launches Affordable Mixed-Signal Oscilloscopes

Yorba Linda, CA — B&K Precision has launched its latest digital oscilloscope series, 2560, which includes DSO and MSO models.
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BTU Showcases PYRAMAX and Profile Guardian

North Billerica, MA — BUT International, Inc., is showcasing its Profile Guardian redundant process monitor and PYRAMAX 125N reflow oven. Profile Guardian pairs a thermocouple probe at product height with software to monitor temperature deviation from baseline — independent from control TCs. The redundant ...
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CAMI Hosts Workshops at Wire Tech Expo

Acton, MA — CAMI Research, Inc., is hosting professional development workshops at the Electrical Wire Processing Technology Expo (EWPTE) in Milwaukee, Wisconsin, and is offering opportunities to win $500 in CableEye® accessories. The expo is scheduled to be held from May 9 to 10, 2018.
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CyberOptics Demos CMM Powered by MRS Technology

Mineapolis, MN — CyberOptics® Corporation is demonstrating its new high-speed SQ30003D coordinate measurement machine (CMM), an extension of the multi-reflection suppression (MRS) enabled SQ3000 platform, along with the new MRS-enabled SE3000 solder paste inspection (SPI) system.
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Data I/O Showcases UFS Programming Technology

Redmond, WA — Data I/O Corporation will be showcasing universal flash storage (UFS) device programming technology on its LumenX platform at NEPCON China 2018. New requirements for faster performance, improved responsiveness and growing file sizes for Internet of Things (IoT) devices, the connected ...
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