Friday, September 22, 2017
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Fuji Offers AIMEX III Component Mounter

Vernon Hills, IL — Fuji Machine America is now offering its AIMEX III component mounter. The AIMEX III can support large panels up to 77.4 x 71 cm (30.5 x 23 in.) in size. The system also supports the simultaneous production of two different products, using a double-conveyor configuration. The system ...
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Hakko Intros RF Induction Heat Micro-Soldering Iron

Valencia, CA — American Hakko Products has introduced its FX-1002 micro-soldering iron, designed for use with Hakko FX-100 RF induction heat soldering stations. The company has taken the power and performance of its T31 series tips and compressed them into T35 series micro-tip shapes. The soldering ...
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High-Performance 3D AOI From Viscom

Duluth, GA — Viscom's S3088 ultra gold 3D AOI system can reach data rates of up to 3.6 GP (gigapixels) per second. At the system's core is the company's high-performance camera module, XMplus, with high-throughput camera technology. The 3D camera module has more than 120 MP.
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Indium Intros Solder Paste for Fine-Feature Printing

Clinton, NY — Indium Corporation has released its Indium11.8HF-SPR (T5-MC) solder paste. Indium11.8HF-SPR is a new air and nitrogen reflow, no-clean, lead-free solder paste designed to meet the fine-feature printing requirements of mobile manufacturers.
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"V8 Power" and Nanometer Precision in PI Piezo Motor

Auburn, MA — PI (Physik Instrumente) has introduced a new, robust OEM walking motor drive, the N-331, with its configuration rooted in existing patented piezo actuator technology and a patented piezo stepping motion principle design.
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Applied Energy Systems Upgrades Heater Blanket

Malvern, PA — Applied Energy Systems (AES) has introduced an updated design for its heater blanket for use with SEMI-GAS® and VERSA-GASliquified gas delivery systems. New features have been added to the standard blanket design to improve its safety and performance in vaporizing liquefied gases ...
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Applied Motion Products Integrates HEIDENHAIN Encoder

Schaumburg, IL — HEIDENHAIN Corporation has partnered with Applied Motion Products in the development of Applied Motion's StepSERVO integrated motors. Using HEIDENHAIN's RENCO brand RCML 15 rotary encoders, StepSERVO combines the high-torque capabilities of step motors with the closed-loop dynamic ...
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CyberOptics Showcases Multi-Sensor Portfolio

Minneapolis, MN — CyberOptics® Corporation is showcasing its WaferSense and ReticleSense auto multi-sensors (AMS/AMSR) at SEMICON West 2017. The company's AMS/AMSR portfolio measures leveling, vibration and relative humidity in an all-in-one, wireless, real-time device. Using the reticle- or wafer-shaped sensors with ...
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KYZEN Releases Cu Pillar Flip Chip Cleaner

Nashville, TN — KYZEN® has introduced its MICRONOX® MX2707 cleaner, which is specifically designed for copper pillar flip chip cleaning applications. The cleaner is formulated to meet the demands of leadless devices, including BGAs, flip chips, QFNs, LGAs, and passives. It has been optimized ...
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Marposs Develops Non-Contact Gauging Probe

Auburn Hills, MI — Marposs is displaying its new non-contact gauge (NCG), which is used for controlling the thickness of different transparent parts, such as glass, plastic or silicon wafers during production. The NCG probe can withstand harsh manufacturing environments, including direct contact ...
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Mentor's Valor Enables Industry 4.0

Wilsonville, OR — Mentor's Valor IoT manufacturing hardware is designed to create a dedicated IoT infrastructure for the entire packaging assembly line, providing accelerated interfaces for machines that do not output Open Manufacturing Language (OML). This enables Industry 4.0 deployment without the need to ...
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MicroAssembly Technologies Intros Die Attach System

Yokneam, Israel — For the first time in the U.S., MicroAssembly Technologies is offering its Crossover Model 6200 die attach system. The Crossover is a state-of-the-art die attach machine that is capable of performing any die attach process in fully automatic mode.
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Nordson Showcases Test and Inspection Systems

Vista, CA — Nordson DAGE and Nordson YESTECH are showcasing a suite of award-winning systems targeted at both the semiconductor and PCB markets, including the Quadra 7 X-ray inspection system, M1m AOI system and 4800 advanced wafer testing bondtester.
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PATLITE Offers LED Indicators and Signal Towers

Torrance, CA — PATLITE is offering a wide range of visual and audible indication products that range from MP3 voice alarms to signal lights with multicolor LEDs, along with network enabled signal towers.
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Plasma Etch Exhibits Plasma Cleaning Solutions

Carson City, NV — Plasma Etch is providing live demonstrations of two of its most popular products, the PE-50 plasma cleaner and the plasma wand.
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Royce and V-TEK Release Automated Die Sorter

Mankato, MN — Royce Instruments and V-TEK International have released an automated die sorter, the AP+. Royce and V-TEK combined technologies to build on the successful MP300, creating a solution for low-volume, high-mix production and research environments.
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Sikama and Air Products Develop Reflow System

Santa Barbara, CA — Sikama International and Air Products and Chemicals, Inc., have partnered in the development of an electron attachment flux-less reflow system for the wafer-level packaging market.
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ULVAC Intros Series of Industrial Vacuum Pumps

Methuen, MA — ULVAC Technologies has introduced its VS series of single-stage rotary vane pumps for a wide range of industrial vacuum applications. The VS650A and VS750A are robust, install-anywhere pumps with speeds of up to 750 m3/h (8,073 ft3/h). These small-footprint, all-in ...
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Virtual Highlights Smart Handling Solutions

Colorado Springs, CO — Virtual Industries is exhibiting its lineup of manual vacuum handling solutions, including the TWEEZER-VAC® Elite and ADJUST-A-VAC® Elite.
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YINCAE: Ball Attach Adhesive for Lead-Free Bumping

Albany, NY — YINCAE is showcasing two new materials, its BP 256 ball attach adhesive and the SMT 256EP replacement for conventional solder paste. BP 256 has been designed to enhance solder joint reliability and eliminate cleaning for lead-free ball bumping processes on CSP, BGA, flip chip, and PoP ...
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