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Friday, October 20, 2017
VOLUME - NUMBER
The ASSEMBLY Show, MD&M Minneapolis, productronica '17
NEPCON South China '17
ATX East / MD&M '17
SEMICON WEST '17
NEPCON China, SMT/Hybrid Pkg, EWPTE, EDS '17
ATX West and IPC APEX '17
ADM Cleveland and APEC '17
SMTAI and IMAPS '16
SEMICON West '16
NEPCON China '15
ATX WEST/APEX '15
SMTAI, Autotest, ATX MW/MDM and Assembly '14
AATE and IPC MW 11
Electronics West/MDM and IPC/APEX '13
SEMICON West '14
IPC APEX '14
NEPCON China Product Preview '12
SEMICON WEST 10
Electronics West/MDM 11
Atlantic Design/MDM 11
ATLANTIC DESIGN & MFG '13
SEMICON WEST 08
Electronics West/MDM 08
NEPCON China Product Preview '13
Multi tradeshow Product Preview '12
ATE and IPC MW 09
Electronics West/MDM 12
NEPCON South China '16
Atlantic Design/ATX/MDM '16
NEPCON China,SMT/Hybrid Pkg,EDS,EWPTE '16
ATX/MDM West '16
productronica,The ASSEMBLY Show, IMAPS, MDM/Minneapolis '15
SEMICON West '15
Nepcon South China '15
EDS, SMT/Hybrid Pkg,Wire Tech Expo '15
ATX/MDM EAST '15
SEMICON West '13
NEPCON China, SMT/Hybrid Pkg, EDS, NWPTE '14
Electronics West/MDM 10
ATX Midwest, IMAPS, PCB West '13
ATX West '14
ATExpo & IPC MW 07
NEPCON China '13, EDS, more
SEMICON WEST/Intersolar '12
Atlantic Design/MDM 10
Atlantic Design/MDM 09
ATExpo & IPC MW 08
NEPCON South China '13
Electronic West/MDM 09
SMTAI and productronica '13
AATE/IPC Midwest 10
SMTAI and productronica '13
Atlantic Design/MDM 08
EPSON Debuts All-in-One SCARA Robot
Carson, CA — EPSON
Robots has launched a new T3 all-in-one SCARA robot, the Flexion
N2 six-axis robot. The robot comes with a built-in controller, a new technology feature that reduces space requirements and simplifies set up. The robot is an easy-to-integrate automation solution for simple ...
Eraser: Modular Wire and Tube Processing Systems
Minneapolis, MN — The Eraser Company, Inc., has unveiled its brand-new M700 modular series of wire and tube processing equipment. With the modular design of the machines, users can easily switch between wire, small tube and large tube processing. The M700 is a compact, tabletop system designed to ...
Essemtec Displays Rapid Prototyping and Dispensing System
Glassboro, NJ — Essemtec AG has presented a large, all-in-one platform that can be used for high-speed assembly, rapid prototyping and high-speed dispensing. The Puma/Tarantula platform is designed to adapt to various customer requirements by using different modules.
Europlacer Supplies Linn with Pick-and-Place Systems
Tampa, FL — Audio system manufacturer Linn Products has invested in four Europlacer iineo+ pick-and-place machines. The decision followed a comprehensive market assessment of placement technologies. Linn Products undertook a fresh evaluation of the capabilities of a range of pick-and-place systems ...
EVS Develops Cabinet for Solder Recovery System
Isle of Wight, UK — After receiving feedback from customers, EVS has enhanced its EVS 500LF by adding an integrated cabinet on which the system sits. The addition of the cabinet combines an automated dross chute with a compartment for the storage of recovered solder. The automated dross chute provides ...
Fast-Curing SMT Adhesive from Panacol
Steinbach, Germany — Panacol has introduced a new adhesive designed specially to attach SMT devices to circuit boards. Structalit
5610 is a fast-curing, high-viscosity adhesive that is suitable for screen printing.
FRITSCH Intros Fully-Automated Dispenser
Kastl/Utzenhofen, Germany — FRITSCH has introduced its dispenseALL 420, a flexible machine that dispenses a variety of different materials. The newly-integrated pre-flow dispenser ecoPEN 600 provides a precise and clean dispensing solution. Materials such as solder paste, glue, sealant, and paints ...
Fuji Now Includes Aegis' FactoryLogix with Nexim
Vernon Hills, IL — Fuji America Corporation now includes Aegis Software's FactoryLogix NPI software solution with its Nexim factory control software. Nexim is Fuji's solution for managing programming, inventory and real-time factory analytics.
Herrmann Intros Intelligent Ultrasonic Generator
Bartlett, IL — The new ULTRAPLAST AMG ultrasonic generator from Herrmann Ultrasonics has been developed for automation environments. It is aimed at customized machine builders, who specialize in building large multi-head ultrasonic welding systems. Suppliers for the automotive industry, and industries ...
High-Speed Flash Programming from ertec
Erlangen, Germany — ertec GmbH has launched an onboard flash programming system, ertius. The system enables extremely fast, interference-free, efficient programming of PCB assemblies, directly on the production line. Up to four programming heads can be controlled through a cable of up to 9.8 ft ...
HTV Offers Component Test, Storage, Analysis
Bensheim, Germany — Halbleiter Test & Vertriebs GmbH (HTV) is now offering a broad selection of electronic component services. These include testing, programming, long-term conservation and storage, analysis, and conditioning.
IDENTCO Offers Durable Labeling Solutions
Ingleside, IL — INDENTCO
is now offering a range of labeling advancements and solutions, including a thermal transfer and die-cut parts materials portfolio, "economy vs. high-performance" strategy to manage PCB labeling costs, and auto-apply solutions.
Indium Launches Low-Voiding Solder Paste
Clinton, NY — Indium Corporation has launched its Indium8.9HF series of solder pastes, which are no-clean and halogen-free. The pastes are designed to reduce voiding and improve stability during the printing process.
INGUN Develops 12 GHz RF Probe
Lake Wylie, SC — Test equipment manufacturer INGUN has developed a new radio-frequency probe, HFS-856. The probe is designed to contact switch connectors MM8030, MM8430, MS-156, and MS-180, as well as U.FL miniature plug connectors.
iTAC Showcases MES and IIoT Solutions
Southfield, MI — iTAC Software is now offering its iTAC.MES.Suite 9.00.00, which includes numerous new functions. The new release contains the smart data analytics integration service, ITAC.SDA.Service, and the higher-level integrated analytics platform, Apache Spark.
K&S Intros Hybrid Wafer Feeder
Fort Washington, PA — Kulicke & Soffa's hybrid wafer feeder combines fast, high-end flip chip bonding with high-speed chip shooting for SiP (system-in-package) manufacturing. The system places flip chips at up to 27,000 cph (IPC), passive components at up to 121,000 cph (IPC), and any combination ...
Keyence Launches Instant Measurement System
Itasca, IL — Keyence has introduced its IM-7000 instant measurement system. This next-generation optical comparator can accurately measure part dimensions in seconds, automatically record data and generate complete inspection reports, all at the push of a button.
KIC Intros Real-Time Analytics Dashboard
San Diego, CA — KIC's new Vantage software is designed to help engineers gain insight into reflow and wave solder processes, enabling better and faster decision making. It is a real-time dashboard for thermal processes, accessible from any authorized PC or mobile device. The process information is ...
Koh Young Highlights 3D Inspection Solutions
Chandler, AZ — Koh Young America is highlighting its full 3D inspection solutions and next-generation closed-loop KSMART process optimizer (KPO).
KYZEN Improves Cleaning Process Monitoring
Nashville, TN — KYZEN's growing ANALYST
data services platform now supports KYZEN Process Control System (PCS). The advanced, customizable analytics are packaged in attractive, user-friendly dashboard formats to support specific reporting needs.
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