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Sunday, July 23, 2017
VOLUME - NUMBER
SEMICON WEST '17
ATX East / MD&M '17
NEPCON China, SMT/Hybrid Pkg, EWPTE, EDS '17
ADM Cleveland and APEC '17
ATX West and IPC APEX '17
SMTAI and IMAPS '16
SEMICON West '16
NEPCON China '15
ATX WEST/APEX '15
AATE and IPC MW 11
SMTAI, Autotest, ATX MW/MDM and Assembly '14
Electronics West/MDM and IPC/APEX '13
SEMICON West '14
IPC APEX '14
NEPCON China Product Preview '12
Electronics West/MDM 11
SEMICON WEST 10
Atlantic Design/MDM 11
ATLANTIC DESIGN & MFG '13
SEMICON WEST 08
Electronics West/MDM 08
NEPCON China Product Preview '13
Multi tradeshow Product Preview '12
Electronics West/MDM 12
ATE and IPC MW 09
NEPCON South China '16
Atlantic Design/ATX/MDM '16
NEPCON China,SMT/Hybrid Pkg,EDS,EWPTE '16
ATX/MDM West '16
productronica,The ASSEMBLY Show, IMAPS, MDM/Minneapolis '15
Nepcon South China '15
SEMICON West '15
ATX/MDM EAST '15
EDS, SMT/Hybrid Pkg,Wire Tech Expo '15
SEMICON West '13
NEPCON China, SMT/Hybrid Pkg, EDS, NWPTE '14
Electronics West/MDM 10
ATX Midwest, IMAPS, PCB West '13
ATX West '14
ATExpo & IPC MW 07
NEPCON China '13, EDS, more
SEMICON WEST/Intersolar '12
Atlantic Design/MDM 10
Atlantic Design/MDM 09
NEPCON South China '13
ATExpo & IPC MW 08
Electronic West/MDM 09
SMTAI and productronica '13
AATE/IPC Midwest 10
SMTAI and productronica '13
Atlantic Design/MDM 08
"V8 Power" and Nanometer Precision in PI Piezo Motor
Auburn, MA — PI (Physik Instrumente) has introduced a new, robust OEM walking motor drive, the N-331, with its configuration rooted in existing patented piezo actuator technology and a patented piezo stepping motion principle design.
Applied Energy Systems Upgrades Heater Blanket
Malvern, PA — Applied Energy Systems (AES) has introduced an updated design for its heater blanket for use with SEMI-GAS
liquified gas delivery systems. New features have been added to the standard blanket design to improve its safety and performance in vaporizing liquefied gases ...
Applied Motion Products Integrates HEIDENHAIN Encoder
Schaumburg, IL — HEIDENHAIN Corporation has partnered with Applied Motion Products in the development of Applied Motion's StepSERVO
integrated motors. Using HEIDENHAIN's RENCO brand RCML 15 rotary encoders, StepSERVO combines the high-torque capabilities of step motors with the closed-loop dynamic ...
CyberOptics Showcases Multi-Sensor Portfolio
Minneapolis, MN — CyberOptics
Corporation is showcasing its WaferSense and ReticleSense auto multi-sensors (AMS/AMSR) at SEMICON West 2017. The company's AMS/AMSR portfolio measures leveling, vibration and relative humidity in an all-in-one, wireless, real-time device. Using the reticle- or wafer-shaped sensors with ...
KYZEN Releases Cu Pillar Flip Chip Cleaner
Nashville, TN — KYZEN
has introduced its MICRONOX
MX2707 cleaner, which is specifically designed for copper pillar flip chip cleaning applications. The cleaner is formulated to meet the demands of leadless devices, including BGAs, flip chips, QFNs, LGAs, and passives. It has been optimized ...
Marposs Develops Non-Contact Gauging Probe
Auburn Hills, MI — Marposs is displaying its new non-contact gauge (NCG), which is used for controlling the thickness of different transparent parts, such as glass, plastic or silicon wafers during production. The NCG probe can withstand harsh manufacturing environments, including direct contact ...
Mentor's Valor Enables Industry 4.0
Wilsonville, OR — Mentor's Valor IoT manufacturing hardware is designed to create a dedicated IoT infrastructure for the entire packaging assembly line, providing accelerated interfaces for machines that do not output Open Manufacturing Language (OML). This enables Industry 4.0 deployment without the need to ...
MicroAssembly Technologies Intros Die Attach System
Yokneam, Israel — For the first time in the U.S., MicroAssembly Technologies is offering its Crossover Model 6200 die attach system. The Crossover is a state-of-the-art die attach machine that is capable of performing any die attach process in fully automatic mode.
Nordson Showcases Test and Inspection Systems
Vista, CA — Nordson DAGE and Nordson YESTECH are showcasing a suite of award-winning systems targeted at both the semiconductor and PCB markets, including the Quadra
7 X-ray inspection system, M1m AOI system and 4800 advanced wafer testing bondtester.
PATLITE Offers LED Indicators and Signal Towers
Torrance, CA — PATLITE is offering a wide range of visual and audible indication products that range from MP3 voice alarms to signal lights with multicolor LEDs, along with network enabled signal towers.
Plasma Etch Exhibits Plasma Cleaning Solutions
Carson City, NV — Plasma Etch is providing live demonstrations of two of its most popular products, the PE-50 plasma cleaner and the plasma wand.
Royce and V-TEK Release Automated Die Sorter
Mankato, MN — Royce Instruments and V-TEK International have released an automated die sorter, the AP+. Royce and V-TEK combined technologies to build on the successful MP300, creating a solution for low-volume, high-mix production and research environments.
Sikama and Air Products Develop Reflow System
Santa Barbara, CA — Sikama International and Air Products and Chemicals, Inc., have partnered in the development of an electron attachment flux-less reflow system for the wafer-level packaging market.
ULVAC Intros Series of Industrial Vacuum Pumps
Methuen, MA — ULVAC Technologies has introduced its VS series of single-stage rotary vane pumps for a wide range of industrial vacuum applications. The VS650A and VS750A are robust, install-anywhere pumps with speeds of up to 750 m
/h (8,073 ft
/h). These small-footprint, all-in ...
Virtual Highlights Smart Handling Solutions
Colorado Springs, CO — Virtual Industries is exhibiting its lineup of manual vacuum handling solutions, including the TWEEZER-VAC
Elite and ADJUST-A-VAC
YINCAE: Ball Attach Adhesive for Lead-Free Bumping
Albany, NY — YINCAE is showcasing two new materials, its BP 256 ball attach adhesive and the SMT 256EP replacement for conventional solder paste. BP 256 has been designed to enhance solder joint reliability and eliminate cleaning for lead-free ball bumping processes on CSP, BGA, flip chip, and PoP ...
YXLON Installs 600th X-ray Inspection System
Hudson, OH — YXLON has installed its 600th MU2000-D X-ray inspection system. After launching in 1997, the universal radiographic system is still a very successful inspection system worldwide, due to its flexibility and durability.
ZEISS: FIB-SEM for 3D Analytics and Sample Prep
Thornwood, NY — ZEISS has introduced a new generation of focused ion beam scanning electron microscopes (FIB-SEMs) for high-end applications in research and industry. The ZEISS Crossbeam 550 offers a significant increase in resolution for imaging and material characterization, as well as a speed ...
ZYGO Expands Molded Base Films Analysis
Middlefield, CT — ZYGO has expanded the capabilities of its Nexview
3D optical profiler for measuring the thickness and topography of films. Using ZYGO's patented Model Based Films Analysis (MBA), full area profiling of top surface, thickness, and underlying surfaces in the presence of a transparent ...
Beckhoff Intros Explosion-Proof Terminals
Savage, MN — Beckhoff has introduced its ELX series EtherCat terminals built with safe inputs and outputs for direct field connection of devices in hazardous areas, including classified zones 0, 1 and 2. PC-based control from Beckhoff now combines industrial automation and process technology, including ...
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