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Linear Encoders for Direct Drives
Publication Date: 3/28/2012

Linear motors have made serious inroads into highly dynamic applications such as manufacturing and measuring equipment in the semiconductor industry, in PCB assembly machines, textile machines and in automation. Direct drives for open and closed-loop control require continuous real ...
Moving from Quality Assurance to Quality Control
Publication Date: 3/28/2012

Quality assurance (QA) has long been the recognized term and method for manufacturing quality processes. But we should question this, as additional benefit can be gained from focusing on Quality Control (QC). These benefits can move quality from a "non value- added cost" to actually ...
Laser Marking: Scratching the Surface
Publication Date: 3/28/2012

In the past, CO2 and Nd: YAG lasers dominated the marking, cutting and welding of industrial tooling and manufactured goods. These laser types were the first to be brought to the marketplace and they were quite useful for their time. Focusing solely on the laser marking side ...
Better Inspection at Lower Cost
Publication Date: 5/9/2011

From surface mount IC chips, to potato chips, customers are demanding higher quality and lower costs. That places the responsibility totally on manufacturing machine designers to use innovative tools that both inspect for 100 percent quality and increase the product throughput rate.\par ...
Linear Motion System Speeds Hard Disk Production
Publication Date: 5/9/2011

Today's growth in digital data has created a huge demand for hard disk storage media. At the same time, hard disk manufacturers are facing strong price and competitive pressures. This combination makes it critical for hard disk manufacturers to maximize throughput. The more hard disks ...
What to Look for in Lead-free Selective Soldering Equipment
Publication Date: 5/9/2011

Selective soldering is a flexible, adaptable process that is increasingly applied to an ever-widening range of soldering tasks. However, the selective soldering process itself is complex. There are many selective soldering machines available on the market, ranging from expensive automated ...
Selective Soldering by Laser
Publication Date: 5/9/2011

The development and improvement of selective soldering systems using laser technologies within the past few years has happened for several reasons — the wide range of electronic equipment on the market, the extreme miniaturization and integration of electronic components, along with ...
Vacuum Bonding for High-Yield Production
Publication Date: 5/9/2011

High-power operation of assemblies and closely packed components require effective heat transfer to a heat sink that is in thermal contact with the PCB. Inefficient heat transfer causes assemblies to overheat, which may damage the electrical components or result in failures in operation ...
Sub-Micron Resolution from New Generation of Hexapods
Publication Date: 5/9/2011

Hexapods were first introduced to the public in the late 1800s and first employed in an industrial application in the late 1940s, used on a tire testing machine. Six-axes parallel kinematic positioning systems (hexapods) used in robotics assembly cells made their debut in 1954. Since ...
Heavy Wire Bonding: Exceeding Productivity Demands
Publication Date: 8/12/2010

How can you keep up with these demands for your heavy wire bonding production? If your manufacturing equipment is not on ? or perhaps more importantly ? above par, it may be time to take a look at the latest heavy wire bonding manufacturing equipment innovations.
Material Trade-offs for Advanced Electronic Packages
Publication Date: 8/12/2010

In the electronics industry's headlong rush to shrink everything, everything is smaller, even though the components and circuits are far more complex than ever. The overall trend has been an increase in functionality and a decrease in size. Improvements in radar and communications technology ...
Manufacturing Solar Cells — Assembly & Packaging
Publication Date: 8/12/2010

The trend in packaging has shown a serious shift: attendance at assembly and packaging conferences has been dwindling over the past few years. At the same time, solar power shows have been celebrated with lots of fanfare, aisles crowded. More and more electronics assembly and packaging ...
How SMT Equipment Slashes Back-End Semicon Costs
Publication Date: 8/12/2010

The electrical connections between a semiconductor die and its package — and hence the outside world — are today made using wire (or flip-chip) bonders. Because of the repeatability accuracy needed for this operation — down to 10µ — the machines are expensive and have ...
Mitigating Tin Whisker Risks
Publication Date: 8/12/2010

The electronics industry has had concerns about tin whiskers for at least 60 years — often discussed in frightened, whispered voices. Tin whiskers certainly aren't a new problem. In fact, some of the first published reports of the occurrence date back to the 1940s and 1950s. But ...
Single-Sourcing: the Production Line Problem Solver
Publication Date: 7/11/2008

Whether you're replacing an existing SMT line or adding a new one, making the3 right buying decision has its challenges. Should you pick the best-in-class process equipment and hope the pieces "play nicely" together? Or, do you rely on one vendor to recommend, or even include, other ...
Solder Paste Analysis: Meeting New Standards
Publication Date: 7/11/2008

In the electronics industry, analysis of manufacturing defects shows that solder problems are largest single cause of failure. And with surface mount technology now the dominant assembly method, many of these soldering failures can be traced back to poor housekeeping of solder paste creating ...
Scalability Adds Flexibility for Dispensing Systems
Publication Date: 7/11/2008

Scalable dispensing is a new concept in dispensing system design. It answers the question, "Why purchase a large machine when the boards/part carriers are often no larger than 300 x 200mm?" Many of today's automotive boards have to fit in a space no larger than 125mm square, and many portable ...
Meeting Tomorrow's AOI Challenges Today
Publication Date: 7/11/2008

Market demand for new electronics products has been on a fast track with growing desire for slick features, mobility, and increased integrated functionality. Aggressive design requirements mandate smaller form factors forcing shrinkage in all three dimensions. Integrated functionality forces ...
Atmospheric Plasma Surface Cleaning for Advanced Nanotechnology
Publication Date: 7/11/2008

One of the on-going challenges with ever shrinking feature sizes is to provide an effective yet economical cleaning solution that yields a properly treated surface that result in consistent and reliable adhesion and coating properties. There are numerous requirements for this in electronics ...
Automating Tight Dispensing Needs
Publication Date: 6/10/2008

Over the last few years, the manufacture of medical equipment has grown to the point where a number of operations have become fully automated. One of these applications is the automation of the dispensing processes. Dispensing of fluids, liquid or viscous, such as epoxies, silicones ...
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