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An Innovative Approach to Soldering Aluminum with ALUSAC-35
Publication Date: 2/11/2015


Aluminum is often considered as a conductive-metal replacement for copper in electronic circuitry because it is a lighter and more cost-effective material. The material is a popular choice for use in motor windings and cable harnesses for automotive applications where its low density ...
Epoxy Flux: Exploring the Most Versatile, Low-Cost Approach for High Reliability in PoP Assembly
Publication Date: 2/11/2015


Package-on-package (PoP) is rapidly becoming the predominant packaging method for mobile devices. However, while similar to ball-grid-array (BGAs), the solder joints of assembled PoPs need underfill reinforcement to protect against cracking when the device is dropped. The conventional ...
New Approach Reduces Reflow Costs While Maintaining Oven Performance
Publication Date: 2/11/2015


Process engineers are often tasked with reducing manufacturing costs. Even if this is not an "official" job function, most engineers are aware that minimizing manufacturing costs is an important part of their job. In many cases, cost reductions stem from lowering the costs of materials ...
PCB Packaging: Cost, Size, Layers, Technology
Publication Date: 2/11/2015


A printed-circuit board (PCB) is often the single most expensive component of an electronic design's bill of materials (BOM). For this reason, designers may look to the PCB as a means of increasing functionality and technology, while Sourcing Specialists may consider the PCB as a means ...
PoP Housings Fit Large Functions Into Small Spaces
Publication Date: 2/11/2015


Packaging has long been an essential part of electronic progress, enabling different electronic designs to be mobile and portable. Electronic packaging has assisted components and systems with operating in such hostile environments as deep in space. The main function of package-on-package ...
Rinsing to Remove Cleaning Agents from Bottom Terminations
Publication Date: 2/11/2015


A major challenge in electronics production is cleaning and rinsing under components with bottom-side terminations. With the many demands on today's printed circuit boards (PCBs), including increased component density and circuit complexity, proper cleaning supports reliability. To ...
Small Fragile Electronic Component Assembly: Challenges and Solutions
Publication Date: 2/11/2015


Surface-mount components continue to get smaller, currently as small as 0.2 x 0.4mm (type 01005 packages). With solder area of only 0.07 x 0.2mm, these components require careful handling. The interspacing between components must be close for high component density on a printed-circuit ...
Spray Fluxing Technology and a Tale of Two Fluxes
Publication Date: 2/11/2015


To meet customer demands, many contract manufacturers (CMs) are using two different flux types on a single wave-soldering line. Typically, this is handled in one of three ways. It can be accomplished by using two separate spray fluxer systems, which brings more congestion to the production ...
AOI: The Role of Value-Added Solutions
Publication Date: 2/11/2013


It doesn't take a crystal ball to know that today's market is inundated with inspection companies and their inspection systems. They come in all sizes and shapes with a multitude of variations of the technology.
Tomorrow's SMT Placement Platform Is Here Now
Publication Date: 2/11/2013


For many years, the ideal placement machine consisted of fast hardware that would be able to place ever smaller components in great numbers in established processes. Equipment makers tried to leapfrog each other in terms of machine speed and performance.
Image-Based Barcode Readers Can Help the Whole System
Publication Date: 2/11/2013


Laser scanners use a moving pinpoint of light to illuminate the barcode. A single photocell receives the reflected light and converts the barcode into an electrical signal as it moves across a barcode. The scanner then measures the relative widths of the bars and spaces, translates ...
You Only Think You Don't Need X-Ray Imaging
Publication Date: 2/11/2013


How often have we heard the refrain: "We don't need x-ray imaging; we don't place BGA components." This is a common misconception in electronics manufacturing circles, and there are a couple of reasons for this. But before we get into that, we need to back up a little and look at the ...
Selective Conformal Coating
Publication Date: 2/11/2013


Conformal coating is an enabling process that allows for the ruggedizing of electronic devices and modules. As the process increases the durability of electronics that are subjected to various end-use environmental conditions, it adds value to the product. While it does add value, consumers ...
Future Dispensing and MID Technologies
Publication Date: 2/11/2013


The number of applications for jet valves is growing rapidly, especially for LED manufacturing and production. Vermes Microdispensing GmbH — a subsidiary of the Essemtec Group — is involved with forming LEDs with filled media, a process that requires flexibility, accuracy and ...
Two-Tiered Product Line Meets Market Segment Needs
Publication Date: 2/11/2013


Portable Electronics needs equipment that has high uptime, excellent repeatability and reliability. This is even more important to high-volume manufacturers because they have multiple lines that produce large volumes of boards within one factory or even across different factories. Repeatability ...
Hot Solder Dip Component Lead Refurbishing
Publication Date: 2/11/2013


In the years since RoHS took effect, component manufacturers have converted virtually all of their components to lead-free solder compatibility, leaving those with exemptions, e.g., Hi-rel and military electronics suppliers, with no source for components for tin-lead soldered assemblies ...
Keeping Wave and Selective Soldering Up to Date
Publication Date: 2/11/2013


Voids in solder joints are nearly inevitable in everyday processing conditions. The solutions currently available are based on vacuum technology, but this technology has a problem: the heat transfer is really restricted and the vacuum is applied after the peak heating zone. To eliminate ...
Materials Testing for Microelectronics
Publication Date: 2/11/2013


Like buildings and bridges, electronic circuits are structures in which materials with quite different mechanical properties are joined together. Predictable and reliable behavior depends on understanding their properties and potential failure modes. A wide range of methods exist to ...
Getting PCBs Really Clean
Publication Date: 3/28/2012


Yesterday's chemicals — CFCs, HCFCs, brominated solvents, detergents and glycols — cannot do a good cleaning job on today's electronics because most flux formulations have changed. Cleaning should be adapted to the job's requirements while maintaining stability in time, efficiency ...
Remote Alarming for Power Grids
Publication Date: 3/28/2012


An electrical utility company needed to send alarms from remote stations in the event that the local power grid went down, and in other special cases including operational faults and security breaches. The entire time a substation was off the grid, an area was without power, so an advanced ...
 
 
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