Industry Articles Components and Distribution Test and Measurement SMT and Production PCB and Manufacturing Assembly and Packaging PCB and Assembly

U.S. Tech Part Search Powered by Terms Of Use

HOME> Industry Articles> Assembly and Packaging>

Folder    Article    Weblink    Product    Forum Topic    Calendar    Form    Document    Album

Atmospheric Plasma Surface Cleaning for Advanced Nanotechnology Publication Date: 7/11/2008 By John Sniegowski, Ceiba Technologies and Dr. K.H. Lee, Plasma Systems & Materials One of the on-going challenges with ever shrinking feature sizes is to provide an effective yet economical cleaning solution that yields a properly treated surface that result in consistent and reliable adhesion and coating properties. There are numerous requirements for this in electronics ... Automating Tight Dispensing Needs Publication Date: 6/10/2008 By Cliff R. Bockard, Vice President, Global Automation Inc., Old Saybrook, CT Over the last few years, the manufacture of medical equipment has grown to the point where a number of operations have become fully automated. One of these applications is the automation of the dispensing processes. Dispensing of fluids, liquid or viscous, such as epoxies, silicones ... Automation Key to Quality Coax Cable Assembly Publication Date: 6/10/2008 By Pete Doyon, VP of Product Management, Schleuniger, Inc., Manchester, NH Coaxial cable is used in a variety of products serving many different markets. It is used to carry higher frequency signals from point A to point B with... Dispensing Robots: EMS Providers' Right Hand Publication Date: 6/10/2008 By James Dornan, Director of Marketing, I&J Fisnar, Inc. These days, the decision to justify automating a dispensing application is in itself automatic. Even with emerging industrial markets and low labor costs in the BRIC nations (Brazil, Russia, India and China), automation has become the first logical route to low cost... First Pass Success with Hi-Rel Circuits Publication Date: 6/10/2008 By Michael L. Martel, Contributing Editor Many electronics assemblers have turned to selective soldering as a replacement for wavesoldering of selected underside areas or through-hole components using pallets. There are a number of reasons for this: custom pallets are expensive, the wavesoldering process... Meeting Tomorrow's AOI Challenges Today Publication Date: 7/11/2008 By Dr. George T. Ayoub, CEO and President, Machine Vision Products, Inc., Carlsbad, CA Market demand for new electronics products has been on a fast track with growing desire for slick features, mobility, and increased integrated functionality. Aggressive design requirements mandate smaller form factors forcing shrinkage in all three dimensions. Integrated functionality forces ... Scalability Adds Flexibility for Dispensing Systems Publication Date: 7/11/2008 By Steven J. Adamson, Market Manager, Asymtek, Carlsbad, CA Scalable dispensing is a new concept in dispensing system design. It answers the question, "Why purchase a large machine when the boards/part carriers are often no larger than 300 x 200mm?" Many of today's automotive boards have to fit in a space no larger than 125mm square, and many portable ... Single-Sourcing: the Production Line Problem Solver Publication Date: 7/11/2008 By Mike Foster, General Manager, Dynatech Technology, Inc., Horsham, PA Whether you're replacing an existing SMT line or adding a new one, making the3 right buying decision has its challenges. Should you pick the best-in-class process equipment and hope the pieces "play nicely" together? Or, do you rely on one vendor to recommend, or even include, other ... Solder Paste Analysis: Meeting New Standards Publication Date: 7/11/2008 By Graham Naisbitt, Managing Director, Gen3 Systems In the electronics industry, analysis of manufacturing defects shows that solder problems are largest single cause of failure. And with surface mount technology now the dominant assembly method, many of these soldering failures can be traced back to poor housekeeping of solder paste creating ...