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Robotic Dispensing: Keeping a Lid on Costs
Publication Date: 6/10/2008

Today's manufacturing processes call for dispensing fluids that include adhesives, acids, alcohol, anaerobic resins, conformal coatings, cyanoacrylates, oils, grease, lubricants, silicones, gels, solder pastes, sealants, solvents and UV adhesives.
Flux Jet Technology for Lead-Free Soldering
Publication Date: 6/10/2008

The trend toward environmentally responsible electronics assembly is well-documented. Regulations banning the use of lead, such as Europe's RoHS directive, are driving similar initiatives throughout the world. While many manufacturers have implemented lead-free wave soldering, both ...
X-ray Inspection of Lead-Free Products
Publication Date: 6/10/2008

X-ray inspection of PC boards is most often performed using two dimensional x-ray systems. 2D x-ray inspection systems consist of an x-ray source, detector, and a multi-axis manipulation system for object maneuverability. Images are taken and seen "as is" with little to no calculation ...
Reliability of Embedded Thin-Film NiP Resistors
Publication Date: 6/10/2008

The use of embedded resistors in multilayer printed circuit boards is increasing at the same time the industry shifts to dielectric materials for lead-free...
Flex Circuits: Meeting Today's Assembly Challenges
Publication Date: 6/10/2008

Challenges in the manufacture of electronic assemblies are common in today's "world is flat" environment. They include cultural differences in the workplace, communication, both time and language...
Small-Batch Automated System on a Budget
Publication Date: 6/10/2008

If your customers need short runs that call for highflexibility, plus a mix of lead-free and leaded assemblies, it'spossible to satisfy their demands with...
Budget Priced Systems Meet Small Shop Needs
Publication Date: 6/10/2008

In spite of the relentless drive toward miniaturization and the increased use of reflow soldering for SMT, there has continued to be a need for wave soldering, even though this process has steadily lost ground to reflow. Continuing miniaturization of products has been the driving force ...
Heavy Wire Bonding: New Standards, New Machines
Publication Date: 6/10/2008

Heavy wire bonding is always at risk from residual vibrations. The industry has long been aware of this problem and has been waiting for much needed improvements in heavy wire bonding technology. Movement of the bonder axes can cause the entire assembly to vibrate (residual vibrations) ...
Embedding ICs Inside PC Boards
Publication Date: 6/10/2008

The idea of putting components inside the printed wiring board instead of on the surface of the board has been around for at least 30 years, although it has been limited to passive components such as the thin film resistive material made by Ohmega Technologies, and more recently the resistor ...
Controlling Reflow Oven Cooling Rates
Publication Date: 6/10/2008

The mandated removal of lead from the environment motivated the surface mount industry to search for a material to replace eutectic tin-lead solder. The new material had to be compatible with most of the existing components while maintaining good electrical conductivity, strength, and ...
PC Board Makers Must Lead the Revolution
Publication Date: 6/10/2008

The PC board design cycle process can be divided into four capabilities quadrants: Knowledge; Tools; Libraries; and Manufacturing. At Sunstone, we liken these quadrants to an engineering ecology, or ECOsystem.
Specifying Fluid Dispensing Equipment
Publication Date: 6/10/2008

Fluid dispensing and coating processes are required for many assembly and packaging operations. These processes provide combinations of electrical, mechanical, and thermal properties to components and assemblies for functionality or enhanced reliability. Common processes are surface ...
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