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Budget Priced Systems Meet Small Shop Needs Publication Date: 6/10/2008 By Heike Schlessmann, Marketing Manager, SEHO Systems GmbH, Kreuzwertheim, Germany In spite of the relentless drive toward miniaturization and the increased use of reflow soldering for SMT, there has continued to be a need for wave soldering, even though this process has steadily lost ground to reflow. Continuing miniaturization of products has been the driving force ... Controlling Reflow Oven Cooling Rates Publication Date: 6/10/2008 By Fred Dimock, Manager, Process Technology, BTU International, North Billerica, MA The mandated removal of lead from the environment motivated the surface mount industry to search for a material to replace eutectic tin-lead solder. The new material had to be compatible with most of the existing components while maintaining good electrical conductivity, strength, and ... Embedding ICs Inside PC Boards Publication Date: 6/10/2008 By Tom Adams, teadams@earthlink.net The idea of putting components inside the printed wiring board instead of on the surface of the board has been around for at least 30 years, although it has been limited to passive components such as the thin film resistive material made by Ohmega Technologies, and more recently the resistor ... Flex Circuits: Meeting Today's Assembly Challenges Publication Date: 6/10/2008 By John Talbot, Director of Sales & Engineering, Flexible Circuit Technologies, Plymouth, MN Challenges in the manufacture of electronic assemblies are common in today's "world is flat" environment. They include cultural differences in the workplace, communication, both time and language... Flux Jet Technology for Lead-Free Soldering Publication Date: 6/10/2008 By Richard Burke and Ken Kirby, Speedline Technologies, Franklin, MA The trend toward environmentally responsible electronics assembly is well-documented. Regulations banning the use of lead, such as Europe's RoHS directive, are driving similar initiatives throughout the world. While many manufacturers have implemented lead-free wave soldering, both ... Heavy Wire Bonding: New Standards, New Machines Publication Date: 6/10/2008 By Herbert Sturmann, Dipl.-Ing., Hesse & Knipps, Paderborn, Germany Heavy wire bonding is always at risk from residual vibrations. The industry has long been aware of this problem and has been waiting for much needed improvements in heavy wire bonding technology. Movement of the bonder axes can cause the entire assembly to vibrate (residual vibrations) ... PC Board Makers Must Lead the Revolution Publication Date: 6/10/2008 By Nolan Johnson, EDA Product Marketing Manager, Sunstone Circuits, Mulino, OR The PC board design cycle process can be divided into four capabilities quadrants: Knowledge; Tools; Libraries; and Manufacturing. At Sunstone, we liken these quadrants to an engineering ecology, or ECOsystem™. Reliability of Embedded Thin-Film NiP Resistors Publication Date: 6/10/2008 By Bruce Mahler, Ohmega Tech, Culver City, CA The use of embedded resistors in multilayer printed circuit boards is increasing at the same time the industry shifts to dielectric materials for lead-free... Robotic Dispensing: Keeping a Lid on Costs Publication Date: 6/10/2008 By Arnold Fletcher Today's manufacturing processes call for dispensing fluids that include adhesives, acids, alcohol, anaerobic resins, conformal coatings, cyanoacrylates, oils, grease, lubricants, silicones, gels, solder pastes, sealants, solvents and UV adhesives. Small-Batch Automated System on a Budget Publication Date: 6/10/2008 By Jonathan Wol, President, Pillarhouse USA, and Darren Smee,Global Process Support Manager, Pillarhouse International (U.K.) If your customers need short runs that call for highflexibility, plus a mix of lead-free and leaded assemblies, it'spossible to satisfy their demands with... Specifying Fluid Dispensing Equipment Publication Date: 6/10/2008 By Al Lewis, Director of Applications Engineering, Asymtek, Carlsbad, CA Fluid dispensing and coating processes are required for many assembly and packaging operations. These processes provide combinations of electrical, mechanical, and thermal properties to components and assemblies for functionality or enhanced reliability. Common processes are surface ... X-ray Inspection of Lead-Free Products Publication Date: 6/10/2008 By Devonne McPherson, Customer Support Manager, phoenix|x-ray Systems + Services, Inc., St. Petersburg, FL X-ray inspection of PC boards is most often performed using two dimensional x-ray systems. 2D x-ray inspection systems consist of an x-ray source, detector, and a multi-axis manipulation system for object maneuverability. Images are taken and seen "as is" with little to no calculation ...