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Friday, April 20, 2018
VOLUME - NUMBER
PCB and AUTOMATION
Test and Automation
PCB and Test
Test and Assembly
SMT and Assembly
Assembly and Production
PCB and Production
Assembly and Production
PCB and Assembly
Assembly and Packaging
PCB and Manufacturing
SMT and Production
Test and Measurement
Components and Distribution
Production and Packaging
Test and Measurement
PC-Based Vision Simplifies SMD Component Placement
By John Lewis, Market Development Manager, Cognex Corporation, Natick, MA
Populating today's PCBs requires high-speed and high-accuracy component placement. The Genesis and Advantis
surface-mount placement systems from Universal Instruments Corp. has helped PCB builders at both original equipment manufacturers' and contract electronics manufacturers' facilities ...
Size Up Component Defects Nondestructively
Tom Adams, Consultant, Sonoscan, Inc.
Acoustic microscopic imaging can locate internal defects in packaged integrated circuits (ICs) and other components without physically damaging the package. The microscope's transducer sends a pulse of ultrasound into the sample. The pulse is reflected, partly or entirely, by material ...
Sizing Up the Benefits of Quantum Computers
By Jeffrey Paulownia
Computers have come a long way in recent decades, driven by the power available in microprocessors. Intel co-founder Gordon E. Moore at one time (in a 1965 technical paper) proposed that the number of components in an integrated circuit (IC) or microprocessor would double each two years ...
Take The Guesswork Out Of AOI: Measure
By Jean-Marc Peallat, President & CEO, and Russ Warncke, Applications & Support Manager, Vi Technology Americas
Automated optical inspection (AOI) has become an essential tool for SMT production lines, although the use of AOI systems and technology is far from standard in the industry. Initially, the main objective in using AOI equipment was to improve quality and productivity by reducing the ...
Automated Optical Inspection Keeps Pace With QA Demands
By Andy Bonner, YesTech Europe, Winchester, Hampshire, United Kingdom, www.yestech-europe.com
Smaller components and more densely packed printed-circuit boards (PCBs) are challenging the best efforts of electronic manufacturers to maintain a high level of quality assurance (QA). But as more and more manufacturers and integrated manufacturing services (IMS) providers are discovering ...
Camera-Assisted Automation Enhances Bond Testing
By Alan King, International Sales Director, Bond Test, Nordson DAGE, Fremont, CA
Bond testing grows in importance with every advance in semiconductor packaging technology. The bond testing capabilities of many facilities are being challenged to characterize the integrity of interconnections within semiconductor devices with ultrafine pitches, containing stacked ...
Heating Up Multiple Ovens For CM Production
By Jesse Hodges, Process Engineer, Inovar, Inc., Logan, UT
Contract manufacturers (CMs) producing electronic printed circuit board (PCBs) often must juggle multiple ovens for properly managing reflow processes. Although multiple ovens can bring added capability, they can also bring a degree of difficulty to the validation process, and most ...
Pulse Generators "Stimulate" Medical Device Industry
By Chris Vaillancourt, Business Unit Manager for Medical Products, Morgan Technical Ceramics
Neuromodulation has spurred a great deal of excitement in recent years for treatment of different medical conditions and diseases. This technology uses electrical signals to stimulate or block different nerve impulses in the body and is adapted from technology used in cardiac rhythm ...
Thinking "Green" Makes Demand for Power Semiconductors Grow
By Barbara Loferer, Multitest
Recently, IHS Research (www.ihs.com) announced a forecast for power semiconductors with an expected compound annual growth rate of 8 percent. This figure is slightly less than in previous reports, but still indicates the potential of this market. The demand for power semiconductors ...
Underfilling Flip-Chip Die Using Continuous-Path Motion Control
By Akita Morita, Business Development Manager, Nordson ASYMTEK
Flip-chip devices have been important components in electronic circuits for some time, with underfill technology helping to minimize thermal stress between flip chips and the substrates on which they are mounted. The process of adding underfill materials to flip chips and other miniature ...
3D X-Ray Inspection Provides Quality Check of Double-sided PCBs
By Andreas Tuerk, Team Manager AXI Division, Goepel electronic GmbH
Today's electronics are more compact, complex and faster than earlier versions of the same products. Smaller products demand reduced power usage along with lower costs. Space saving techniques used to accomplish these goals includes newer component packages with hidden leads under ...
Dog-Bones and Daisy Chain for Test Labs
By Martin Hart, President, TopLine Corporation, Milledgeville, GA
Engineers routinely use dummy IC packages with internal daisy chain circuitry — fondly known as "Dog-Bones" within the PC board design community. Daisy chain provides engineers with a simple and cost-effective testing mechanism to glean valuable data about process failures. Such ...
Highly Accelerated Stress Screenings
By Alan Perkins, Vice President of Sales and Marketing, Qualmark
Considering that electronics giants such as Apple
manage to introduce new and improved products every year, the need for faster and more accurate reliability checking comes into sharp focus. While traditional environmental stress screenings such as "burn-in" still have their place ...
Low Cost Electrical Test for Counterfeit Device Detection
By Tom Saven, VP — Network Marketing and Terry Harvell, Engineering Manager — Diagnosys, Inc.
It's a dilemma faced frequently. When we take our car for repair, our mechanic can choose between factory replacement OEM parts or their lower priced alternative. We are told that third party parts are manufactured to the same rigid standards as the OEM version, but at a fraction of ...
Complex Serialization: An Approach for Today
By Nader Shehad, BPM Microsystems, Houston, TX
Device programming systems are a key resource in the electronics industry for writing customer-supplied data patterns such as Intel HEX, Motorola S-record, POF and other file formats into blank semiconductor devices. Traditionally, a data pattern is loaded into the device programming ...
Measuring Losses in Switch-Mode Power Supplies
By David Maliniak, Technical Marketing Communications Specialist, Teledyne LeCroy, Chestnut Ridge, NY
Switch-mode power supplies are known for efficiencies that can run into the high 90 percent range, a far cry from the 50-60 percent efficiencies one may expect from the older technology of linear power supplies. Power-supply efficiency is a measure of how much energy is wasted between ...
Tracking Down Counterfeit ICs
By Alan Lowne, CEO, Saelig Co., Inc.
Today's most prevalent counterfeit chips reportedly represent $169 billion in potential risk per year for the global electronics world, according to market research firm IHS iSuppli. The most vulnerable chip types include analog ICs, microprocessors, memory ICs, and programmable logic ...
X-Ray Inspection to Identify Counterfeit Parts
By Dr. Bill Cardoso, Creative Electron, Inc., San Marcos, CA
Radiography (x-ray inspection) is a technique that is central to all recent and upcoming counterfeit detection standards, including IDEA 1010B, CCAP 101, AS5553, AS6081, and AS6171. X-ray inspection provides the unique ability to "see" what is inside an electronic component without ...
Combining 2D and 3D in a Single AOI Platform
By Brian D'Amico, Mirtec Corp., Oxford, CT
Advanced miniature packaging has led to ever-increasing PCB density and complexity. As the manufacturing process becomes progressively more complicated, there is the probability for defects on many finished PCB assemblies. For years the Automated Optical Inspection (AOI) industry has ...
A Better Way to Clean Circuit Boards
By Paul McKinney, Simplimatic Automation. Evington, VA
Foreign material, dust, lint, foreign object damage (FOD) — whatever you call it — when it's on your circuit boards, it's never a good thing. For engineering managers tasked with reducing waste and increasing quality, there are many ways to eliminate foreign material in your processes ...
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