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Industrial Connectors Outperform Hardwiring


Thousands of equipment manufacturers have switched from point-to-point (hard) wiring to connector-based cable assemblies in factory and process automation and control systems. By adopting progressive connectivity solutions, they have improved both unit costs and productivity. Using ...

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Mirtec: Delivering Tomorrow's Inspection Technology Today


The latest industry challenge comes from the LED fabrication sector, and Mirtec, closely monitoring this emerging trend, has entered the LED arena with the debut of the MV-9XP LED Package Inspection System, with technology specifically developed to address the inspection requirements ...

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Sorting Test Gear for Military Measurements


Military electronic systems are governed by their own sets of standards and demanding requirements in order to meet performance levels under a wide range of highly difficult environmental conditions. Testing these electronic systems and their components usually calls for measurement ...

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MEMS Testing: Contact Added Boat Provides Step Forward


For those faced with testing microelectromechanical-systems (MEMS) devices, two truths are critical: speed is everything and time is money. Unfortunately, traditional test sockets and device handling methods can waste both. When dealing with MEMS devices, a number of issues have existed ...
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Enhancing Fluid Dispense Platform Accuracy


Miniaturization trends in semiconductor applications continue to push the limits of fluid dispenser capabilities to accurately dispense fluids into smaller spaces between printed-circuit-board (PCB) components, camera modules, and die. Customers are increasingly more concerned with ...

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Germanium Not Phosphorus for Nickel-Doped, Lead-Free Solders


Removing lead from solder has raised the importance of micro-alloying elements and other chemical agents and compounds in modern electronic circuits. The large-scale changeover of the electronics industry to producing printed-circuit boards (PCBs) with lead-free solder has placed a ...
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GHz Sockets Support High-Speed, High-Density IC Packages


Today's high-speed packaged devices use multi-GHz clock speeds, fine pin densities (of below 0.4-mm pitch), and high pin counts (in excess of 2000). But the method of mounting such high-speed packaged devices to a PCB is critical for achieving top performance. Socketing is one means ...

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Jet Technology: Advances in Fluid Dispensing


Demand continues to grow for electronic devices that can be made smaller in size, driving manufacturing and packaging technologies to find new ways to dispense electronic packaging materials in ever-smaller amounts and with greater speed and accuracy. As a result, a great deal of attention ...

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New Approaches to Electrical Power in "Smart" Homes


Smart homes might eventually solve our problems with energy efficiency, but we still have a long way to go. All of our home electronic appliances run on DC, including today's LED lighting, so efficient power supply units (PSUs) will play an essential role in significantly reducing power ...
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Power-Supply Common Mode Noise


Noise in an electronic circuit or system consists of random or undesired fluctuations in the electrical signals or voltage source. Noise is often conducted through interconnect cables and conducting metal parts such as brackets, shields, and the chassis. Radiated noise is a form of ...

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Storing Test Data In The Cloud


Automatic-test-equipment (ATE) systems are renowned for their advanced measurement capabilities, whether for measuring anything from DC power to the fastest digital signals. But these same systems can generate massive amounts of test results, which make data storage a challenge. Many ...
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Apply Line Scan Technology for Improved AOI


Automated optical inspection (AOI) is a critical part of ensuring high quality in production printed-circuit boards (PCBs). But to ensure quality, many AOI equipment suppliers simply will add an additional downward-looking, field-of-view (FOV) camera, circled by a ring light to help ...

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Driving SMT Solutions for the Automotive Industry


Electronic content has been increasing steadily in automobiles, and the large and growing automotive markets in North and South America offer great business opportunities for electronics components manufacturers. But those suppliers must consider some special requirements of the automotive ...

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PC-Based Vision Simplifies SMD Component Placement


Populating today's PCBs requires high-speed and high-accuracy component placement. The Genesis and Advantis® surface-mount placement systems from Universal Instruments Corp. has helped PCB builders at both original equipment manufacturers' and contract electronics manufacturers' facilities ...

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Size Up Component Defects Nondestructively


Acoustic microscopic imaging can locate internal defects in packaged integrated circuits (ICs) and other components without physically damaging the package. The microscope's transducer sends a pulse of ultrasound into the sample. The pulse is reflected, partly or entirely, by material ...

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Sizing Up the Benefits of Quantum Computers


Computers have come a long way in recent decades, driven by the power available in microprocessors. Intel co-founder Gordon E. Moore at one time (in a 1965 technical paper) proposed that the number of components in an integrated circuit (IC) or microprocessor would double each two years ...

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Take The Guesswork Out Of AOI: Measure


Automated optical inspection (AOI) has become an essential tool for SMT production lines, although the use of AOI systems and technology is far from standard in the industry. Initially, the main objective in using AOI equipment was to improve quality and productivity by reducing the ...

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Automated Optical Inspection Keeps Pace With QA Demands


Smaller components and more densely packed printed-circuit boards (PCBs) are challenging the best efforts of electronic manufacturers to maintain a high level of quality assurance (QA). But as more and more manufacturers and integrated manufacturing services (IMS) providers are discovering ...
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Camera-Assisted Automation Enhances Bond Testing


Bond testing grows in importance with every advance in semiconductor packaging technology. The bond testing capabilities of many facilities are being challenged to characterize the integrity of interconnections within semiconductor devices with ultrafine pitches, containing stacked ...
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Heating Up Multiple Ovens For CM Production


Contract manufacturers (CMs) producing electronic printed circuit board (PCBs) often must juggle multiple ovens for properly managing reflow processes. Although multiple ovens can bring added capability, they can also bring a degree of difficulty to the validation process, and most ...

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