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Dog-Bones and Daisy Chain for Test Labs
Publication Date: 3/12/2013

Engineers routinely use dummy IC packages with internal daisy chain circuitry — fondly known as "Dog-Bones" within the PC board design community. Daisy chain provides engineers with a simple and cost-effective testing mechanism to glean valuable data about process failures. Such ...
Highly Accelerated Stress Screenings
Publication Date: 3/12/2013

Considering that electronics giants such as Apple® manage to introduce new and improved products every year, the need for faster and more accurate reliability checking comes into sharp focus. While traditional environmental stress screenings such as "burn-in" still have their place ...
Low Cost Electrical Test for Counterfeit Device Detection
Publication Date: 3/12/2013

It's a dilemma faced frequently. When we take our car for repair, our mechanic can choose between factory replacement OEM parts or their lower priced alternative. We are told that third party parts are manufactured to the same rigid standards as the OEM version, but at a fraction of ...
Complex Serialization: An Approach for Today
Publication Date: 11/28/2012

Device programming systems are a key resource in the electronics industry for writing customer-supplied data patterns such as Intel HEX, Motorola S-record, POF and other file formats into blank semiconductor devices. Traditionally, a data pattern is loaded into the device programming ...
Measuring Losses in Switch-Mode Power Supplies
Publication Date: 11/28/2012

Switch-mode power supplies are known for efficiencies that can run into the high 90 percent range, a far cry from the 50-60 percent efficiencies one may expect from the older technology of linear power supplies. Power-supply efficiency is a measure of how much energy is wasted between ...
Tracking Down Counterfeit ICs
Publication Date: 11/28/2012

Today's most prevalent counterfeit chips reportedly represent $169 billion in potential risk per year for the global electronics world, according to market research firm IHS iSuppli. The most vulnerable chip types include analog ICs, microprocessors, memory ICs, and programmable logic ...
X-Ray Inspection to Identify Counterfeit Parts
Publication Date: 11/28/2012

Radiography (x-ray inspection) is a technique that is central to all recent and upcoming counterfeit detection standards, including IDEA 1010B, CCAP 101, AS5553, AS6081, and AS6171. X-ray inspection provides the unique ability to "see" what is inside an electronic component without ...
Combining 2D and 3D in a Single AOI Platform
Publication Date: 11/28/2012

Advanced miniature packaging has led to ever-increasing PCB density and complexity. As the manufacturing process becomes progressively more complicated, there is the probability for defects on many finished PCB assemblies. For years the Automated Optical Inspection (AOI) industry has ...
A Better Way to Clean Circuit Boards
Publication Date: 8/9/2012

Foreign material, dust, lint, foreign object damage (FOD) — whatever you call it — when it's on your circuit boards, it's never a good thing. For engineering managers tasked with reducing waste and increasing quality, there are many ways to eliminate foreign material in your processes ...
What Is Resolution?
Publication Date: 8/9/2012

Automated Optical Inspection (AOI) systems rely on something we take too much for granted: the lens system. The lens system provides the image acquisition capabilities that are needed in all AOI systems — in all cameras, whether for AOI or for machine vision, for security applications ...
Dual Technology Automated Optical Inspection
Publication Date: 8/9/2012

The single inspection approach does not provide all of the answers that a production engineer needs to keep the production line running at maximum yield. With components ranging from the tiny 01005 up to long SMT or THT connectors, the AOI programmer needs superb image resolution, a ...
Overcoming the limitations of Flying Probe Test
Publication Date: 8/9/2012

When flying probers first entered the market in the late 1980s, their utility was largely limited to testing prototypes and circuits that had no good test points. The bed-of-nails in-circuit test was still king and remained that way for many years. But ICT demands a costly fixture ...
Ionic Cleanliness Testing
Publication Date: 8/9/2012

Cleanliness of PCB assemblies is easily and accurately measured through the use of a Contaminometer, a test machine that complies with IPC-TM-650 2.3.25. The ROSE Test (Resistivity Of Solvents Extracted) is a quick and easy test that takes no more than 15 minutes, on average, to perform ...
Enhanced BGA Inspection with Advanced Technology
Publication Date: 8/9/2012

Years of BGA imaging experience have resulted in a complete understanding of the actual BGA placement process. With a solid understanding of the placement process, software engineers have been able to develop image analysis software that is easy to use, while providing the relevant ...
Adding Speed and Quality to Ultra-Clean Silicone Molding
Publication Date: 12/14/2011

Located in Chicago's western suburbs, FMI produces molded silicone components for medical applications. Intricate features and key dimensions of tiny silicone prototype and (pre-) production parts are measured optically using a Nikon Metrology iNexiv system. FMI engineers say that investigating ...
Rewriting the Rules of Solder Printing
Publication Date: 12/14/2011

Based on the UK's south coast, high-profile EMS company Hansatech EMS Limited has been providing manufacturing solutions to electronics companies for over 25 years, during which time it has developed a very particular — and highly successful — approach to serving its marketplace ...
Customizing COTS Testing Systems
Publication Date: 12/14/2011

Off-the-shelf modular instruments (VME, PXI, VXI, CompactPCI, PCI, etc.) used to create automated test and measurement systems are designed to be general purpose, programmable, and flexible enough to handle a variety of input ranges and types, speeds, and functions.
High Performance Probe Sockets
Publication Date: 12/14/2011

The evolution of cell phones to today's high-end smart phones with a multi-core applications processor and memory has driven the industry to embrace 3D packaging solutions. 3D packaging can be achieved by die stacking in one package, package-in-a-package stacking or package-on-package ...
Innovative Marketing of Manufacturing Equipment
Publication Date: 12/14/2011

In the 1960s when transistors began to replace cumbersome vacuum tubes, a new industrial revolution was born. Soon, a young entrepreneur seized an opportunity. From his station wagon, Henry Mann began selling specially designed tools used to insert through-hole components in their holes ...
Boundary Scan: Test More, Pay Less
Publication Date: 11/11/2011

Today's test engineer is faced with a multitude of test technologies. The most common and best known test technologies are divided into two groups: optical and electrical.
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