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Post-Reflow Acoustic Micro Imaging
Publication Date: 11/29/2016


Before plastic-packaged ICs and other component types are mounted on a board, they are frequently inspected by a variety of methods including acoustic micro imaging tools to ensure quality. Ultrasound is able to reveal structural defects in ICs, flip chips, ceramic chip capacitors and ...
Reducing the PCB Bone Pile: Optimizing Test Strategy
Publication Date: 11/29/2016


Having worked within an established company in the world of PCB assembly testing for many years we still come across companies (OEMs) who will tell us, "We don't need to test, because we demand that the contract manufacturer (CM) only send us 100 percent working boards." But, demanding ...
Using Conformal Coating to Protect Sensitive Electronics
Publication Date: 11/29/2016


To give electronic devices the longest possible operational lifespan, conformal coating was developed to protect components, and ensures that today's electronics function properly in a variety of harsh conditions. Despite the unrelenting miniaturization of components, a suitable coating ...
Using Self-Configuring Sensors for Machine Condition Monitoring
Publication Date: 11/29/2016


Condition monitoring that requires sensors is quickly becoming an imperative throughout many industries. New digital signal conditioner technology is available that simplifies the use of eddy current (inductive) displacement sensors for high-precision and high-reliability applications ...
Choosing the Right Lighting for Machine Vision Applications
Publication Date: 2/1/2016


Machine vision systems create images by analyzing the reflected light from an object; not the object itself. A good image is the result of proper focus and illumination. Images with poor contrast and uneven illumination require much more effort from the imaging computer, which increases ...
From Asset-centric Management to Service-centric Relationships
Publication Date: 2/1/2016


As technology has advanced, consumers have grown to expect more. Companies are pushed to create the most powerful, eye-catching smart device; of better quality than competitors, and at a lower price to the customer. In this competitive market, manufacturers must maximize output while ...
Improving Traditional Test Methods
Publication Date: 2/1/2016

Process inspections, including solder paste inspection (SPI), automated optical inspection (AOI), and X-ray, are able to detect most assembly errors — but others may lurk under the surface. SPI detects if solder paste is missing on certain pads, AOI is capable of identifying missing, misaligned, ...
Leading the Way…With Test and Measurement Solutions
Publication Date: 2/1/2016


Renting test equipment can result in numerous benefits for a company, including saving in capital expenses by not having to buy the test equipment and not having to store the equipment when it is not being used, or having to upgrade equipment that becomes obsolete with age. Renting ...
Piezo Mechanisms in Optics and Laser Technology
Publication Date: 2/1/2016


The delivery of a laser beam requires precise motion of optical components. Piezo mechanisms provide just this. Piezoelectric systems are currently the gold standard of motion control, because of their speed and precision. Laser systems engineers have a large toolbox of options at their ...
Saving Valuable Time in SMT and Test Programming
Publication Date: 2/1/2016


It can take many days for a team to prepare a line for production. First, information is gathered. This includes the details of each placement, test and inspection requirement. The data are often collected in a mass of different formats, both digital and physical, as a designer tries ...
The Evolution of Cleaning Methods in PCB Rework
Publication Date: 2/1/2016


The rework process has long consisted of three steps: removal of the inoperative component, cleaning of residual solder from the ball grid assembly (BGA) pads which held the component in place, and replacement with a new component to create a viable, working PCB. The first and third ...
An Introduction to Automated Optical Inspection Technology
Publication Date: 3/18/2015


Numerous technologies are critical to the effective and efficient production of printed-circuit boards (PCBs) and one of those technologies that continues to grow in importance is automated optical inspection (AOI). AOI technology is rapidly becoming part of quality control in the production ...
Boundary-Scan Testing Checks Complex Circuit Designs
Publication Date: 3/18/2015


Boundary-scan testing (also known as IEEE Standard 1149.1) and its related specifications, has become the de facto standard for testing complex digital and mixed-signal circuit designs during manufacturing of printed-circuit-board assemblies (PCBAs). While conventional test ...
Cable and Harness Manufacturing: Productivity Through Flexibility
Publication Date: 3/18/2015


Choosing a flexible wire cable and harness test system is part of a decision process meant to provide improved productivity. A truly flexible test system will ensure usability and investment longevity across product lines, lifecycles, and generations. As a consequence, such a test system ...
Capturing and Filtering Airborne Contaminants in the Workplace
Publication Date: 3/18/2015


Ensuring safety and occupational health in the workplace has become increasingly important for manufacturing facilities in recent years. It should certainly be considered as part of the job rather than an annoyance. As manufacturing processes have grown in complexity, the pollutants ...
Measuring Three Levels of Process Control in Thermal Profiling
Publication Date: 3/18/2015


Maintaining process control within tightly defined limits is an important part of achieving high product quality in today's electronic manufacturing facilities. The pressures to deliver products in shorter development cycles and with increased capacities pose significant challenges ...
Probing Power Supplies for Use with Test Equipment
Publication Date: 3/18/2015


Test-equipment designers face many challenges when choosing an optimum power supply for their designs. A basic starting point usually involves power capacity, in terms of voltage and amperage, cooling requirements, size, and regulatory certifications. If the criteria for choosing a ...
The Benefits of Soldering with Vacuum Profiles
Publication Date: 3/18/2015


Forming solder joints is a critical part of printed-circuit-board (PCB) manufacturing and is impacted by a large number of parameters. A workgroup on solder voids prepared an overview of these factors to provide a greater understanding of the problem. However, the overview only included ...
Combining 2D and 3D AOI Inspection: The Most Effective Inspection
Publication Date: 12/5/2014


Automated optical inspection (AOI) has become an essential tool in today's surface-mount-technology (SMT) manufacturing environment. Growing trends towards the use of smaller components, more advanced component packaging, finer lead pitches, and higher printed-circuit-board (PCB) densities ...
ECU: Replacing Legacy Equipment with High-Performance Capability
Publication Date: 12/5/2014


Upgrading production equipment can usually support higher manufacturing volumes and increased capacity. For that reason, Engineering Concepts Unlimited, Inc. (ECU) in Fishers, IN recently purchased a second Sigma modular mounter from Hitachi High Technologies America (www.hitachi-hta ...
 
 
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