Saturday, May 28, 2016
VOLUME - NUMBER
Advertisements
HOME / CURRENT ISSUE >  Industry Articles >  Components and Distribution > 
Novel Guide Rails Aid Aircraft Noise Research
Publication Date: 11/20/2013


Aircraft noise is a major concern of students in the University of California at Irvine's Aeroacoustic Laboratory. Students within UCI's Aeroacoustic Laboratory recently worked with DryLin® T Profile Rail rail guides donated by plastics innovator igus®, Inc. as part of The Geared ...
Pointing a Finger at Touch Screen Displays
Publication Date: 11/20/2013


Touch panel displays are an important part of many of today's electronic products. They provide a control interface for a wide range of electronic devices, as well as operating information for users in such products as portable computers and cellular telephones. Of course, as touch ...
Select an Economical Cleaning Technology
Publication Date: 11/20/2013


Choosing a new cleaning process can be a challenge for any production engineer. Any new cleaning process is expected to be fast, safe, sustainable, versatile, and affordable, and to clean more with less. Industry regulators are constantly imposing new air-quality rules, new shipping ...
Watch Out, 450mm Wafers Are Coming
Publication Date: 11/20/2013


Silicon is a key component in semiconductor manufacturing, and the diameters of silicon wafers have grown steadily over the years to keep pace with customer demands for higher volumes of devices at lower prices. Production equipment is available for wafers as large as 300mm diameter ...
Alumina-Based Resistors Aid Medical Applications
Publication Date: 5/23/2013

Medical electronic equipment, such as the defibrillator, depends on surge resistors for protection and reliable operation. In fact, many industries rely on such resistors, but in medical applications these components can spell a matter of life or death. Medical equipment manufacturers have used a variety ...
Build HDI Structures With Thin Films and Low-Temperature Sintering Paste
Publication Date: 5/23/2013


Growing demands for increased circuit functionality continue to drive the need for improved printed-circuit-board (PCB) fabrication capabilities. As packaged and chip electronic devices grow in complexity, so too do the circuit boards on which they are mounted. PCB fabrication must improve ...
How DNA Marking Helps DLA Fight Counterfeiting
Publication Date: 5/23/2013


Counterfeit electronics in the supply chain has become a major concern for the United States Department of Defense (DoD), in particular for the Defense Logistics Agency (DLA) charged with procuring electronic components, devices, and materials for US military applications. An investigation ...
Identify Imitations To Avoid Counterfeit Parts
Publication Date: 5/23/2013


Counterfeit merchandise is a growing, global problem across almost all industries. The broad range of counterfeit parts and products indicates that counterfeiters are increasingly targeting markets for luxury items and consumer goods. Counterfeiting costs Americans billions of dollars a ...
Is This the Right Way to Eliminate Counterfeits?
Publication Date: 5/23/2013


In an effort to stop or at least minimize the threat of counterfeit parts making their way into our military hardware, the DLA (Defense Logistics Agency) has mandated the use of DNA markings on approved products. The trouble is, original component manufacturers usually produce their semiconductors ...
Production in China Still Provides Great Benefits
Publication Date: 5/23/2013


China has been an important manufacturing location for this company, with an office in China since 1989. It is an active part of the world and a location that has an important role for many businesses, but working with China can change almost every day. Keeping up with those changes is ...
Trojan Horse Partnerships Are Key to Success in Printed Electronics
Publication Date: 5/23/2013

Boston, MA — The traditional electronics partnership model of suppliers soliciting and meeting specs from brand owners and end users breaks down in emerging electronics applications like printed, flexible, and organic electronics (PFOE). Instead, material suppliers and manufacturers need to use new relationships ...
Screening Counterfeits with AXI
Publication Date: 10/24/2012


Counterfeit parts come in many colors. The electronics supply chain has been infiltrated with unfit, substandard, misrepresented, and parts intentionally counterfeited — predominately from China. What's worse, these components have made their way into electronic assemblies manufactured ...
Choosing the Right Optical Inspection System
Publication Date: 10/24/2012


Picking the right AOI system means a lot of work based on the many different criteria and options. Every AOI company will tell you there's no need to look further; their machine is as good as it gets.
The Role of Pre-Heating in Electronics Rework
Publication Date: 10/24/2012


The Electronics industry, like any other, has been cyclical in its evolution. Through-hole, surface mount, single-sided, multi- layer, complexity and density have all changed and evolved and then changed again. Just as one methodology and approach seems to take root, the next big thing ...
Being Active with Passives
Publication Date: 10/24/2012


It looks like a sleepy little town in Western New York State's Allegeny Mountains, but it's home to an electronics manufacturing company whose products are in great demand worldwide — even shipping components to China (see U.S. Tech Oct. 2010: "Not a Foreign Concept, Gowanda ...
Reclaiming Costly Components Without Losing Quality
Publication Date: 10/24/2012


Today's demanding rework applications require reliable solutions that directly address the specific challenges involved with each type of rework process. Having to scrap boards and components can greatly impact the profitability of any job and is avoided whenever possible. Therefore ...
Stencil Printing Challenges for Small Devices
Publication Date: 5/1/2012


The very small form factor of today's QFNs (quad flatpack, no leads), DFNs (dual flatpack, no leads), and µBGAs allows for smaller packages, and thus smaller electronic devices with more overall functionality, especially in the newer mobile devices. QFNs stand out because they provide  better grounding and better heat sink thermal properties compared to other SMT packages. Most QFNs have a metal pad on the underside for grounding and heat conduction. DFNs have a...
An Integrated Approach to Device Programming
Publication Date: 5/1/2012


Human error. It's always lurking there in the shadows, ready to reach in when a library file for a programmable device is selected. Pick the wrong one, and you may end up with a mistake that can cost the company millions of dollars. It has happened, and sadly not just once or twice ...
PCBA Bonepiles: The Neglected Green Revenue Stream Rehabilitated
Publication Date: 5/1/2012


Bonepiles. Everybody's got them. They're collections of PCB assemblies that are defective and can't be rescued. In today's fast-paced, production-oriented, revenue-driven environment, when an assembled board is deemed unrepairable, it frequently is written off and placed into a "bonepile ...
Are Your Materials Really Halogen-Free?
Publication Date: 5/1/2012


Though there is no official, government-mandated requirement forcing the production of halogen-free products and, therefore, the use of halogen-free materials, the electronics industry has arguably moved in that direction. This industry-sponsored effort is being driven primarily by ...
 
 
search login