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Sunday, October 23, 2016
VOLUME - NUMBER
PCB and Test
Test and Assembly
SMT and Assembly
Assembly and Production
PCB and Production
Assembly and Production
PCB and Assembly
Assembly and Packaging
PCB and Manufacturing
SMT and Production
Test and Measurement
Components and Distribution
Production and Packaging
Taking Charge of ESD Caused by Tapes and Labels
By Dave Genest, Marketing Communications Manager, Polyonics, Inc.
Electrostatic discharge (ESD) is present in everyday life, and its effects range from mildly unpleasant to extremely dangerous. From taking static-charged clothes out of the dryer to touching a lamp after shuffling your feet across a rug in dry weather, to storm clouds creating lightning ...
Ultrasonic Welding Meets Needs of Complex Automotive Electronics
By Melissa Alleman, Vice President, Sonobond Ultrasonics
Sonobond Ultrasonic's metal welding technology has been developing alongside the growing number of increasingly complex electronic components, especially those in the automotive industry. The company offers wire-to-terminal welders that produce single point ground terminals, and can ...
When Lightning Strikes — Keeping Aircraft Flying
By Jason Evans and Joseph Kane, MK Test Systems, Ltd.
If you travel regularly by air, then it is quite likely that while flying through a thunderstorm your plane was struck by lightning. You probably weren't aware of it, and that is the way it should be. A lightning strike is a safety-critical event and happens so frequently that it can ...
A Practical Guide to Managing Material Cost
By Ben Khoshnood, President, Inovaxe Corp.
Many years ago, I ran a high-mix, low- to mid-volume EMS business. Like everyone else, surprise shortages were driving the million dollar SMT lines to screeching halts. Often the familiar sound of "cha-ching" would stop, and everyone scrambled to find the part that was supposed to be ...
Combining Thin-Layer and PCB Technology in Microelectronics
By Ursula Gore, Cicor Americas, Inc.
The boundaries between thin-layer and printed circuit technology in microelectronics are becoming increasingly blurred. At the same time, the demand for thin-layer circuits and miniaturized components continues to grow. Cicor, an industrial provider of advanced microelectronics, uses ...
Embedded Components: The New Frontier for PCBs
By Walter Gueili, Seica S.p.A., Strambino, Italy
Less is more. At least in the size of the printed circuits for most devices we make today. As the race to make things smaller continues, manufacturers have begun to build previously surface-mounted components into the layers of a PCB. Over the last few years, embedding components in ...
Faster Product Cycles: Can Your Supply Chain Keep Up?
By Stefan Merlau, Global Product Manager SMT, Heraeus Electronics
There is a popular adage when it comes to business: cheap, fast, or good — pick two. The electronics market is demanding ever-faster development, greater performance and cost-efficiency from every product. To better deliver in all three of these areas, solid collaboration and commitment ...
Mission-Critical Applications: Qual-Pro Advanced 3D Inspection
By Steve Wongsonvanee, Pemtron Technology and Michael McCallion, Qual-Pro
America's space program is moving ahead on several fronts in an effort to rid NASA of its dependence on Russian Soyez spacecraft. An important part of this program is the Boeing Starliner, a spacecraft that will ultimately do the kinds of jobs that had been handled by the now-retired ...
New Jetting Technology for Fluid Dispensing
By Garrett Wong and Roberta Foster-Smith, Nordson ASYMTEK
In jetting, fluid is rapidly ejected through a nozzle and uses momentum to break free in discrete droplets. Jetting has evolved to become a standard production process in the industry, and now accommodates a wide variety of fluids and applications. Everything from more intricate, emerging ...
Predicting Assembly Yields by Viscosity Measurement
Mitch Holtzer, Global Director of Customer Technical Support, Alpha Assembly Solutions
According to dozens of published surface-mount process studies, up to 80 percent of defects occur when solder paste is stencil-printed onto a bare board. Many of the problems can be traced back to the interaction of the process equipment and the flow quality of the solder paste. In ...
Saki Celebrates Over Two Decades of Technology and Expansion
By Michael Skinner, Assistant Editor
"When we began, AOI was a luxury", says Jodie Akiyama, CEO of Saki. "Now it's a necessity." In 1994, Sakie (Jodie) and Yoshihiro Akiyama founded Saki Corporation in Japan. At the time, the electronics inspection market was dominated by large corporations that offered AOI technology, but ...
Sharpening the Competitive Edge: Lenze Americas and Samsung
By Don Lockard, Yankee Soldering,Vince Parente and Nick Siciliano, Lenze Americas
In the early 1990s, PCB manufacturing floated overseas, lured by cheap labor and free trade. Now, many plants in the U.S. using the same equipment and paying more for labor, produce little by comparison. The industry in the U.S. consists mainly of those PCB assemblies that are not ...
Choosing the Right Lighting for Machine Vision Applications
By John Lewis, Global Content Marketing Manager — Vision, Cognex Corporation
Machine vision systems create images by analyzing the reflected light from an object; not the object itself. A good image is the result of proper focus and illumination. Images with poor contrast and uneven illumination require much more effort from the imaging computer, which increases ...
From Asset-centric Management to Service-centric Relationships
By Pasi Roppanan, Director of Customer Service Solutions, JOT Automation
As technology has advanced, consumers have grown to expect more. Companies are pushed to create the most powerful, eye-catching smart device; of better quality than competitors, and at a lower price to the customer. In this competitive market, manufacturers must maximize output while ...
Improving Traditional Test Methods
Process inspections, including solder paste inspection (SPI), automated optical inspection (AOI), and X-ray, are able to detect most assembly errors — but others may lurk under the surface. SPI detects if solder paste is missing on certain pads, AOI is capable of identifying missing, misaligned, ...
Leading the Way…With Test and Measurement Solutions
By Richard Russo, Marketing Manager, Advanced Test Equipment Rentals, San Diego, CA
Renting test equipment can result in numerous benefits for a company, including saving in capital expenses by not having to buy the test equipment and not having to store the equipment when it is not being used, or having to upgrade equipment that becomes obsolete with age. Renting ...
Piezo Mechanisms in Optics and Laser Technology
By Stefan Vorndran, Scott Jordan and Steffen Arnold, Physik Instrumente L.P.
The delivery of a laser beam requires precise motion of optical components. Piezo mechanisms provide just this. Piezoelectric systems are currently the gold standard of motion control, because of their speed and precision. Laser systems engineers have a large toolbox of options at their ...
Saving Valuable Time in SMT and Test Programming
By Michael Ford, Mentor Graphics
It can take many days for a team to prepare a line for production. First, information is gathered. This includes the details of each placement, test and inspection requirement. The data are often collected in a mass of different formats, both digital and physical, as a designer tries ...
The Evolution of Cleaning Methods in PCB Rework
By Robert Roush and Paul Wood, Metcal
The rework process has long consisted of three steps: removal of the inoperative component, cleaning of residual solder from the ball grid assembly (BGA) pads which held the component in place, and replacement with a new component to create a viable, working PCB. The first and third ...
DC/DC Converters: It's Not Your Father's Input Voltage Anymore!
By Dennis Kelemen, Administrator, Power Products
Solar, wind turbines, and AC inputs for high-power industrial use are all part of today's design mainstream. This includes 480VAC that can be converted to approximately 680VDC, which is closely tied to great technical leaps in the battery industry. Improved power and reliability are ...
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