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Wednesday, January 17, 2018
VOLUME - NUMBER
PCB and AUTOMATION
Test and Automation
PCB and Test
Test and Assembly
SMT and Assembly
Assembly and Production
PCB and Production
Assembly and Production
PCB and Assembly
Assembly and Packaging
PCB and Manufacturing
SMT and Production
Test and Measurement
Components and Distribution
Production and Packaging
Wasting No Time: Developments in Rapid Electronic Assembly
By Stanley L. Bentley, P.E., Senior Technical Advisor, RapidProto
Rapid electronic assembly, or RPT (rapid prototyping) for short, was introduced around 1995 as a standalone service by Diversified Systems, Inc. Unlike its mechanical counterpart, RPT is not a "click-and-squirt" process, and can have capital equipment costs as low as $1,000. The general ...
Classifying and Combating Electromagnetic Interference
By Derick Stevens, European FAE Manager, KEMET Corporation
In today's world, many pieces of electronic and electrical equipment operate in close proximity, bringing with them the potential for each device to generate electromagnetic disturbances, interfering with those nearby. Equipment malfunctions caused by interference can have consequences ...
Cutting Costs with Multi-Sourced SMT Replacement Parts
By Alexandra Stovin, SMT Xtra
As the electronics industry becomes more saturated, new companies are finding it more difficult to carve out a competitive niche. With such a variety of players, from multibillion dollar corporations to single-line board shops, it is valuable that some companies offer a range of equipment ...
New Levels of Traceability for Electronics Manufacturing
By Michael Ford, Senior Marketing Development Manager, Mentor Graphics Corp.
The IPC (Association Connecting Electronics Industries
) has developed a new standard and specification for traceability practices. The standard, IPC-1782, defines four levels of material and process traceability. The adoption of IPC-1782 will allow many companies to progress from ...
Product Highlight: INGUN Push-On RF Probes
By Matthias Zapatka, CTO, INGUN
INGUN has developed a new series of RF probes with a locking mechanism that can withstand more than 100,000 mating cycles. Spring-loaded coaxial probes, used to test SMA and other RF connectors, are not particularly new. These probes were introduced by INGUN several years ago as a test ...
Product Highlight: Seica Compact Digital Test System
By Paolo Bertoldo, Product Manager — Digital Test Systems, Seica SpA
Recent innovations in digital components are requiring more sophisticated tests. New logic families with variable voltage levels and single or differential signals are adding to this complexity. At the same time, industrial manufacturing environments require processing capabilities ...
Reducing Stack Height with Low-Profile SMT Connectors
By Glenn Goodman, Senior Development Engineer, Advanced Interconnections Corp.
To fit more functionality into tighter spaces, multiple circuit boards are typically needed. These multiple boards require some form of board-to-board electrical interconnections to link the different functions of each board. Numerous choices are available for these board-to-board interconnections ...
Safeguarding Production by Optimizing Supply Chain
By Nicole Schenk
After years of being only theory, the smart factory is finally within reach. ASM's Munich plant has put the idea into practice through a combination of factory automation, digital supply chain management, an efficient layout, and robust IT systems.
Standalone JTAG Test and Programming Solutions
By Peter van den Eijnden, Managing Director, JTAG Technologies
In collaboration with several leading fixture manufacturers, JTAG has developed special solutions to simplify the integration of its controllers into a range of test fixtures. These solutions are based on the fixture model of the company's mixed-signal controller, JT 5705/FXT. The integration ...
The Impact of LV 214-4: German Automotive OEM Connector Test Spec
By Rob Boyd, Senior Production Manager, Schleuniger
Standards and specifications from various organizations provide guidelines by which manufacturers can measure different areas of quality, while also providing the end user with the assurance that they are purchasing a trustworthy, long-lasting product. Within the wire processing industry ...
Viessmann Targets Energy Efficiency in Reflow Soldering
By Volker Feyerabend, Managing Director, APROS Int. Consulting + Company Services
For high-mix/low-volume manufacturers, energy efficiency is a key issue. One of these energy-hungry areas is the reflow soldering process. The Viessmann Group, a German-based manufacturer of HVAC systems, has spent the better part of the last decade streamlining the energy usage of ...
Accuracy in 3D AOI Enables M2M Communications
By Yasuo Watabe, Sales Promotion Group Leader, Saki Corporation
There have been many obstacles to overcome in the process of developing machine-to-machine (M2M) communications. But, with more diversity in electronics, increased global competition, and demand for shorter lead times, M2M communications are becoming a necessity.
Electrically Testing Long Cables
By Christopher E. Strangio, Founder and President, CAMI Research, Inc.
Despite a growing number of applications for fiber optics in communications, we continue to employ copper conductors to deliver power, effect electrical control and inexpensively carry signal data. And as long as the industry demands copper cables, they will require testing to ensure ...
From Selective to Fully-Intelligent Fluxing
By Will Hunter, Area Director — North America, mta automation
Citing issues with quality and the messiness of the process, many companies are moving away from wave soldering. Ironically, these problems are not caused by the wave soldering itself. In all likelihood, the inconspicuous fluxer is the source of most of the problems. Most issues arise ...
Industry Voices: Perspectives on the Internet of Manufacturing
By Philip Stoten (
We've been hearing about Industry 4.0, the Industrial Internet of Things (IIoT), and the Internet of Manufacturing (IoM) for some time, but the concept is finally being realized. The smart factory movement is poised to completely overhaul conventional manufacturing. We asked a number ...
JTAG Integrated with PCB Design Tools Broadens Capabilities
By Philip Ling
Many engineers think that JTAG is simply an interface for inserting breakpoints to debug the software running on a CPU. It may surprise them to learn that JTAG is included in many integrated devices that do not have a debug interface. While this includes FPGAs and CPUs, it also extends ...
Probing the Future of Battery Array Testing
By Jasmin Bauer, Marketing, Acculogic, Inc.
Acculogic has developed a novel way to test battery arrays, using its automated flying probe system, the Flying Scorpion. With a marked increase in demand for batteries on the horizon, such as for electric vehicles (EVs), mobile energy storage, solar power, and energy-efficient homes ...
The Benefits and Risks of Copper Pillar Bumped Flip Chips
By Craig Hillman Ph.D., CEO, DfR Solutions
Traditional solder bumps are being bumped aside by copper pillar technology. Used as a first-level interconnect, copper pillar technology is increasing in popularity as a way to deal with decreasing feature sizes on silicon, mobile device form factors, and other technical challenges ...
Are All Cleaning Wipes Created Equal?
By Mike Jones, MicroCare Corp.
Wipes are used across almost every type of industry for a huge variety of cleaning tasks. In fact, wipes are so widely available that it is all too easy to take them for granted and to treat them as little more than a throwaway commodity. Like Rodney Dangerfield might have put it, wipes ...
ASM Presents World-Class Placement for Mid-Speed Applications
By Nick Crocker, E by SIPLACE Business Development Manager, ASM
Mid-speed, high-mix manufacturers have often found themselves between a rock and a hard place when deciding on the best placement technology for a dynamic assembly environment. While many features of higher-speed systems, such as vision inspection, placement head flexibility and easy ...
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