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Saturday, March 24, 2018
VOLUME - NUMBER
PCB and AUTOMATION
Test and Automation
PCB and Test
Test and Assembly
SMT and Assembly
Assembly and Production
PCB and Production
Assembly and Production
PCB and Assembly
Assembly and Packaging
PCB and Manufacturing
SMT and Production
Test and Measurement
Components and Distribution
Production and Packaging
The Art of Efficient Enameled-Copper Wire Soldering
By Florian Schildein
Tightening thermal requirements for copper wire and connectors, especially in the automotive supply and consumer goods industries, are driving innovation in selective soldering. For more than 20 years, EUTECT
GmbH has been developing and manufacturing selective soldering modules ...
Ultra-Low Frequency Vibration Isolation Stabilizes Scanning Tunneling Microscopy
By Patrick Roberts
The tunable microwave-frequency alternating current scanning tunneling microscope (ACSTM) can record local spectra and local chemical information on insulator surfaces, much like the conventional STM can do for metals and semiconductors. Spectroscopy in the microwave frequency range ...
Creating an Efficient Convection Soldering System with Vacuum and Pyrolysis
By Dr. Hans Bell, Jochen Burkhardt, Marcel Kneer, and Paul Wild, Rehm Thermal Systems
Demand for power electronics systems, such as IGBTs (insulated-gate bipolar transistors), is on the rise. The booming markets of e-mobility, LED-based lighting, photovoltaics, and wind power systems require fast, efficient, high-power electrical switching.
Creating the Best User Experience for Wire Processing Equipment
By Patrick Moroney, Product Marketing Manager, Komax Wire
As consumers, we pay attention to the look and feel of our smartphones, car interiors, kitchen appliances, keyboards, and apps. In fact, when we encounter substandard design, we notice it right away. We demand and expect a good user experience from the products we use in our personal ...
EMI Shielding: Improving Sidewall Coverage with Tilt Spray Coating
By Mike Szuch, Akira Morita and Garret Wong, Nordson ASYMTEK; Mike Sakaguchi and Hiroaki Umeda, Tatsuta Electric Wire & Cable Company Limited
EMI shielding has always been an important component of RF devices, but the demands of today's Bluetooth, Wi-Fi, 3G, LTE, wearable, and IoT devices have created a special set of hurdles for the manufacturing engineer. These devices rely on different radio frequencies that can interfere ...
Enhanced Manufacturing Services 4.0: Philosophy and DfT 4.0
By Chrisophe Lotz, President and CEO, Aster Technologies
Industry 4.0 is the widely-used name for the current trend of automation and data exchange in manufacturing. The concept is being applied by many in order to create the smart factory. Within the modular elements of smart factories, cyber-physical systems monitor physical processes, ...
QA on the Fly - Fast, Accurate AOI and XYZ Measurement
By Dr. Subodh Kulkarni, President and CEO, CyberOptics Corporation
In general, you can have very fast sensors that are not so accurate, or very accurate sensors that are not so fast. Having both at the same time has been critical to CyberOptics' development.
The Economics of Die Attach Voiding in LED Assemblies
By Griffin Lemaster, Dr. Bill Cardoso and Dr. Glen Thomas, Creative Electron, Inc.
Improvements in high-brightness LED technologies are making these devices useful for general illumination. But, before LEDs can completely replace outmoded light sources, their thermal management schemes need to be further developed to ensure consistent color quality and long operational ...
Ambient Shadow Moiré Warpage Measurements Reduce Defect Rates
By Eric Moen, Vice President of Sales and Marketing, Akrometrix
The electronics assembly industry is being challenged with materials, components and assemblies that are more prone to warpage-induced defects both pre-reflow and in-between reflow stages. The majority of traditional warpage and deformation testing has taken place in a controlled environment ...
Flexible Industrial PC Production with SEHO Selective Soldering
By Heike Schlessmann, Marketing Manager, SEHO Systems
In 1983, Siemens Karlsruhe began manufacturing augmented standard PC technology to meet its customers' demanding industrial requirements. The operation has grown to become a 4,500-employee operation, the fifth-largest Siemens AG location in Germany. Optimized production steps carefully ...
Magnetic Attraction: Combining M12 Connectors with Transformers
By Jonas Diekmann, Technical Editor, HARTING Electronics
Transformers play a major role in today's Ethernet communications technology; without them, broadband data transfer with high signal integrity would be nearly impossible. Typically, network devices and cabling sections have to be galvanically isolated from each other in order to protect ...
Smart Reflow: Industry 4.0 is Actually Delivering
By Vitor Barros, General Manager, KIC Europe
Some companies may find the change to Industry 4.0 overwhelming, though it is one of the most exciting developments in the manufacturing industry in decades. It promises vast improvements for both manufacturers and their customers.
Smarter, Faster, Leaner: The Democratization of DFM
By Patrick McGoff, Valor Product Manager, Mentor — A Siemens Business
Design for manufacturing (DFM) software for printed circuit boards has been around since the mid-1990s. It began with bareboard fabricators who wanted to make sure that they fully understood the design they received, in order to avoid any manufacturing issues. When PCB designers got ...
Visual Work Instructions are the GPS of Manufacturing
By Berenice Mengo, Online Marketing Specialist, VKS
Operating in a high-mix, low-volume environment, effectively navigating the manufacturing process can be complex and difficult. But there are reliable solutions to help steer manufacturers toward the most efficient processes. One of these is the company Visual Knowledge Share (VKS) ...
X-ray Uncovers the Best and Worst of BGA Assembly
By Dr. Bill Cardoso, President, Creative Electron, Inc.
BGA technology is touted as the ideal interconnect solution because it uses solder balls as leads to provide a reasonable level of self-alignment. That means that there is some tolerance in the placement accuracy, which is a direct function of the size and density of the BGA.
Benchmarking RFID Readers for Maximum Tag Performance
By Klaus Schoeke, VP of Technical Sales, FEIG Electronics
From trains and warehouses to hospitals and libraries, RFID systems are delivering greater efficiency, security and productivity to workplaces around the world. With the growing popularity of products and solutions that offer the convenient connectivity made possible by the Internet ...
Breaking Records: Koh Young Delivers 10,000th Inspection System
By Jenny Yuh, Marketing Assistant, Koh Young Technology
Koh Young Technology, one of the fastest-growing 3D inspection systems providers worldwide, recently delivered its 10,000th inspection system, a Zenith AOI machine, to a large Chinese automotive supplier. The Zenith system is designed to measure the true profilometric shape of components ...
Industry Voices: A Breakout Year for the IoM
By Michael Skinner, Associate Editor
From every corner of the electronics manufacturing industry we are hearing about the Internet of Manufacturing (IoM) or one of its various appellations, including Industry 4.0 and the Industrial Internet of Things (IIoT). This trend is changing rows of discrete machines into efficient ...
Managing Thermal Energy with a Finely-Tuned Adhesive
By Laurie Gibbons, Business Development Manager, Permabond
Heat, vibration, moisture, and dust can all wreak havoc in electrical systems. With the miniaturization of components, heat or thermal management becomes an even more critical factor in the design process. Managing heat in processing, heat dissipation, and thermal expansion and contraction ...
Progressive Cavity Pumps Enable Vital Precision and Repeatability
By Can La, Product Manager, Techcon Systems
Up until roughly five years ago, operators of manual and automated dispensing lines had little ability to achieve highly-accurate, consistent application of adhesives, epoxies and other fluids. This was especially difficult for small depositions, when working with viscous materials ...
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