Save. Share. Connect.
Friday, July 28, 2017
VOLUME - NUMBER
Test and Automation
PCB and Test
Test and Assembly
SMT and Assembly
Assembly and Production
PCB and Production
Assembly and Production
PCB and Assembly
Assembly and Packaging
PCB and Manufacturing
SMT and Production
Test and Measurement
Components and Distribution
Production and Packaging
A Road Map to Successful Thermal Testing
By David Brehmer, Technical Writer, Exatron
Whether testing one device or millions, the ultimate goals of any thermal testing operation are efficiency, accuracy, and stability. Thermal forcing, clamping, and calibration methods are all variables, but the one common denominator in all test scenarios is the socket. Exatron's new ...
Beyond Debug: XJTAG for Flash Programming and Board Test
By Philip Ling
The JTAG standard, first established by the IEEE 27 years ago, defines an electrical and physical method for connecting JTAG-enabled devices on a PCB, or across multiple PCBs. However, JTAG is not a general-purpose bus. The technology behind the interface differs significantly from ...
Selecting and Optimizing Wet Processing Equipment
By Ed Sullivan
Microfabrication operations such as metal lift-off, stripping, etching, plating/coating, cleaning, and die-bonding are typically wet processing procedures. Yet, selecting the equipment to perform those procedures most efficiently and cost-effectively is often not a simple matter. In ...
Shadow Moiré Measurement Techniques for Discontinuous and Semi-Reflective Surfaces
By Neil Hubble, Director of Engineering, Akrometrix
Flip chip packages are seldom perfectly co-planar; instead, there exists an angle between the die and package substrate, which becomes a critical factor in maintaining product yield and reliability. Point-to-point height measuring quality checks for die tilt can be time-consuming, and ...
The Benefits and Risks of Copper Pillar Bumped Flip Chips: Part 2
By Craig Hillman Ph.D., CEO, DfR Solutions
Copper has inherently higher electrical and thermal conductivity than SnPb or SnAg/SnAgCu solders, by a factor of about 25. Higher conductivities reduce current density and temperature within the interconnect, which are the primary drivers for matter flow and electromigration (EM) failures ...
Using Cell-Aware Scan Diagnosis to Improve Yields
By Matt Knowles, Tessent Silicon Learning Product Marketing Manager, Mentor Graphics
Finding and diagnosing manufacturing defects in a failing device through scan diagnosis has long been a way to improve yields for both high-volume ICs and for new manufacturing processes. Scan diagnosis utilizes a design description, scan test patterns and failure data from a tester ...
Developing Low-Temperature Solder for Sensitive Components
By Steven Teliszewski, Technical Manager, Interflux Electronics
The high temperatures used in today's lead-free soldering processes can do damage to sensitive components and even to PCB substrate materials. Nearly every electronic device has some critical components built into it. These include such components as capacitors, BGAs, fuses, displays ...
Gowanda has a Magnetic Attraction to Industry Firsts
By Denis Kolhagen, VP of Sales, Gowanda Components Group
Until now, off-the-shelf, high-reliability ER (Established Reliability) inductors for RF applications in the military have only been available in through-hole configurations. Gowanda Electronics, a manufacturer of board-level magnetics, has changed this with the introduction of the ...
Machine Learning: A Logistical Advantage
By Ute Häussler, Corporate Communications, FRAMOS
The increasing volume of online retail sales is pushing traditional logistics and intralogistics systems to their limits. Complex or manual sorting processes for items of all shapes and sizes, return rates of up to 60 percent, short delivery times, and high-quality picking processes ...
Simplifying Automated Leakage Current Analysis
By Günther Schindler, Managing Director, Schindler & Schill GmbH
Preserving the dielectric strength of conductive components is largely a matter of positioning them correctly and maintaining the right distances between them. The miniaturization and combination of PCB net classes and stack-ups makes the determination of air and creepage distances ...
Using Reverse Engineering to Predict the Future of Electronics
By Dr. Bill Cardoso, President, Creative Electron, Inc.
The impulse to break a new gadget to "see what's inside" is often one of the first signs of an aspiring engineer. However, teardowns go far beyond pure curiosity: they provide us with critical insights into the nature and construction of these devices.
Wasting No Time: Developments in Rapid Electronic Assembly
By Stanley L. Bentley, P.E., Senior Technical Advisor, RapidProto
Rapid electronic assembly, or RPT (rapid prototyping) for short, was introduced around 1995 as a standalone service by Diversified Systems, Inc. Unlike its mechanical counterpart, RPT is not a "click-and-squirt" process, and can have capital equipment costs as low as $1,000. The general ...
Classifying and Combating Electromagnetic Interference
By Derick Stevens, European FAE Manager, KEMET Corporation
In today's world, many pieces of electronic and electrical equipment operate in close proximity, bringing with them the potential for each device to generate electromagnetic disturbances, interfering with those nearby. Equipment malfunctions caused by interference can have consequences ...
Cutting Costs with Multi-Sourced SMT Replacement Parts
By Alexandra Stovin, SMT Xtra
As the electronics industry becomes more saturated, new companies are finding it more difficult to carve out a competitive niche. With such a variety of players, from multibillion dollar corporations to single-line board shops, it is valuable that some companies offer a range of equipment ...
New Levels of Traceability for Electronics Manufacturing
By Michael Ford, Senior Marketing Development Manager, Mentor Graphics Corp.
The IPC (Association Connecting Electronics Industries
) has developed a new standard and specification for traceability practices. The standard, IPC-1782, defines four levels of material and process traceability. The adoption of IPC-1782 will allow many companies to progress from ...
Product Highlight: INGUN Push-On RF Probes
By Matthias Zapatka, CTO, INGUN
INGUN has developed a new series of RF probes with a locking mechanism that can withstand more than 100,000 mating cycles. Spring-loaded coaxial probes, used to test SMA and other RF connectors, are not particularly new. These probes were introduced by INGUN several years ago as a test ...
Product Highlight: Seica Compact Digital Test System
By Paolo Bertoldo, Product Manager — Digital Test Systems, Seica SpA
Recent innovations in digital components are requiring more sophisticated tests. New logic families with variable voltage levels and single or differential signals are adding to this complexity. At the same time, industrial manufacturing environments require processing capabilities ...
Reducing Stack Height with Low-Profile SMT Connectors
By Glenn Goodman, Senior Development Engineer, Advanced Interconnections Corp.
To fit more functionality into tighter spaces, multiple circuit boards are typically needed. These multiple boards require some form of board-to-board electrical interconnections to link the different functions of each board. Numerous choices are available for these board-to-board interconnections ...
Safeguarding Production by Optimizing Supply Chain
By Nicole Schenk
After years of being only theory, the smart factory is finally within reach. ASM's Munich plant has put the idea into practice through a combination of factory automation, digital supply chain management, an efficient layout, and robust IT systems.
Standalone JTAG Test and Programming Solutions
By Peter van den Eijnden, Managing Director, JTAG Technologies
In collaboration with several leading fixture manufacturers, JTAG has developed special solutions to simplify the integration of its controllers into a range of test fixtures. These solutions are based on the fixture model of the company's mixed-signal controller, JT 5705/FXT. The integration ...
© 2015 USTECH. All Rights Reserved. |
Contact Us: 610-783-6100 | firstname.lastname@example.org
powered by GIM