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Monday, June 26, 2017
VOLUME - NUMBER
PCB and Test
Test and Assembly
SMT and Assembly
Assembly and Production
PCB and Production
Assembly and Production
PCB and Assembly
Assembly and Packaging
PCB and Manufacturing
SMT and Production
Test and Measurement
Components and Distribution
Production and Packaging
Developing Low-Temperature Solder for Sensitive Components
By Steven Teliszewski, Technical Manager, Interflux Electronics
The high temperatures used in today's lead-free soldering processes can do damage to sensitive components and even to PCB substrate materials. Nearly every electronic device has some critical components built into it. These include such components as capacitors, BGAs, fuses, displays ...
Gowanda has a Magnetic Attraction to Industry Firsts
By Denis Kolhagen, VP of Sales, Gowanda Components Group
Until now, off-the-shelf, high-reliability ER (Established Reliability) inductors for RF applications in the military have only been available in through-hole configurations. Gowanda Electronics, a manufacturer of board-level magnetics, has changed this with the introduction of the ...
Machine Learning: A Logistical Advantage
By Ute Häussler, Corporate Communications, FRAMOS
The increasing volume of online retail sales is pushing traditional logistics and intralogistics systems to their limits. Complex or manual sorting processes for items of all shapes and sizes, return rates of up to 60 percent, short delivery times, and high-quality picking processes ...
Simplifying Automated Leakage Current Analysis
By Günther Schindler, Managing Director, Schindler & Schill GmbH
Preserving the dielectric strength of conductive components is largely a matter of positioning them correctly and maintaining the right distances between them. The miniaturization and combination of PCB net classes and stack-ups makes the determination of air and creepage distances ...
Using Reverse Engineering to Predict the Future of Electronics
By Dr. Bill Cardoso, President, Creative Electron, Inc.
The impulse to break a new gadget to "see what's inside" is often one of the first signs of an aspiring engineer. However, teardowns go far beyond pure curiosity: they provide us with critical insights into the nature and construction of these devices.
Wasting No Time: Developments in Rapid Electronic Assembly
By Stanley L. Bentley, P.E., Senior Technical Advisor, RapidProto
Rapid electronic assembly, or RPT (rapid prototyping) for short, was introduced around 1995 as a standalone service by Diversified Systems, Inc. Unlike its mechanical counterpart, RPT is not a "click-and-squirt" process, and can have capital equipment costs as low as $1,000. The general ...
Classifying and Combating Electromagnetic Interference
By Derick Stevens, European FAE Manager, KEMET Corporation
In today's world, many pieces of electronic and electrical equipment operate in close proximity, bringing with them the potential for each device to generate electromagnetic disturbances, interfering with those nearby. Equipment malfunctions caused by interference can have consequences ...
Cutting Costs with Multi-Sourced SMT Replacement Parts
By Alexandra Stovin, SMT Xtra
As the electronics industry becomes more saturated, new companies are finding it more difficult to carve out a competitive niche. With such a variety of players, from multibillion dollar corporations to single-line board shops, it is valuable that some companies offer a range of equipment ...
New Levels of Traceability for Electronics Manufacturing
By Michael Ford, Senior Marketing Development Manager, Mentor Graphics Corp.
The IPC (Association Connecting Electronics Industries
) has developed a new standard and specification for traceability practices. The standard, IPC-1782, defines four levels of material and process traceability. The adoption of IPC-1782 will allow many companies to progress from ...
Product Highlight: INGUN Push-On RF Probes
By Matthias Zapatka, CTO, INGUN
INGUN has developed a new series of RF probes with a locking mechanism that can withstand more than 100,000 mating cycles. Spring-loaded coaxial probes, used to test SMA and other RF connectors, are not particularly new. These probes were introduced by INGUN several years ago as a test ...
Product Highlight: Seica Compact Digital Test System
By Paolo Bertoldo, Product Manager — Digital Test Systems, Seica SpA
Recent innovations in digital components are requiring more sophisticated tests. New logic families with variable voltage levels and single or differential signals are adding to this complexity. At the same time, industrial manufacturing environments require processing capabilities ...
Reducing Stack Height with Low-Profile SMT Connectors
By Glenn Goodman, Senior Development Engineer, Advanced Interconnections Corp.
To fit more functionality into tighter spaces, multiple circuit boards are typically needed. These multiple boards require some form of board-to-board electrical interconnections to link the different functions of each board. Numerous choices are available for these board-to-board interconnections ...
Safeguarding Production by Optimizing Supply Chain
By Nicole Schenk
After years of being only theory, the smart factory is finally within reach. ASM's Munich plant has put the idea into practice through a combination of factory automation, digital supply chain management, an efficient layout, and robust IT systems.
Standalone JTAG Test and Programming Solutions
By Peter van den Eijnden, Managing Director, JTAG Technologies
In collaboration with several leading fixture manufacturers, JTAG has developed special solutions to simplify the integration of its controllers into a range of test fixtures. These solutions are based on the fixture model of the company's mixed-signal controller, JT 5705/FXT. The integration ...
The Impact of LV 214-4: German Automotive OEM Connector Test Spec
By Rob Boyd, Senior Production Manager, Schleuniger
Standards and specifications from various organizations provide guidelines by which manufacturers can measure different areas of quality, while also providing the end user with the assurance that they are purchasing a trustworthy, long-lasting product. Within the wire processing industry ...
Viessmann Targets Energy Efficiency in Reflow Soldering
By Volker Feyerabend, Managing Director, APROS Int. Consulting + Company Services
For high-mix/low-volume manufacturers, energy efficiency is a key issue. One of these energy-hungry areas is the reflow soldering process. The Viessmann Group, a German-based manufacturer of HVAC systems, has spent the better part of the last decade streamlining the energy usage of ...
Accuracy in 3D AOI Enables M2M Communications
By Yasuo Watabe, Sales Promotion Group Leader, Saki Corporation
There have been many obstacles to overcome in the process of developing machine-to-machine (M2M) communications. But, with more diversity in electronics, increased global competition, and demand for shorter lead times, M2M communications are becoming a necessity.
Electrically Testing Long Cables
By Christopher E. Strangio, Founder and President, CAMI Research, Inc.
Despite a growing number of applications for fiber optics in communications, we continue to employ copper conductors to deliver power, effect electrical control and inexpensively carry signal data. And as long as the industry demands copper cables, they will require testing to ensure ...
From Selective to Fully-Intelligent Fluxing
By Will Hunter, Area Director — North America, mta automation
Citing issues with quality and the messiness of the process, many companies are moving away from wave soldering. Ironically, these problems are not caused by the wave soldering itself. In all likelihood, the inconspicuous fluxer is the source of most of the problems. Most issues arise ...
Industry Voices: Perspectives on the Internet of Manufacturing
By Philip Stoten (
We've been hearing about Industry 4.0, the Industrial Internet of Things (IIoT), and the Internet of Manufacturing (IoM) for some time, but the concept is finally being realized. The smart factory movement is poised to completely overhaul conventional manufacturing. We asked a number ...
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