Sunday, February 25, 2018
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TopLine 2018 Product Guide Now Available

Irvine, CA — TopLine has finished its 2018 product guide, which contains 160 pages of updated information. TopLine manufactures a wide range of daisy chain semiconductor packages for process development, experimentation, machine evaluation, solder training, and SMT assembly practice.
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Transition Automation: Double-Edged Squeegee Assembly

Tyngsborough, MA — Transition Automation has introduced its precision Permalex® Edge metal squeegee assembly designed to improve the printing performance of single-squeegee Yamaha printers. The new squeegee assembly design eliminates fasteners altogether, constituting a major improvement over first ...
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ULT Opens Subsidiary in United States

Mequon, WI — Fume extraction specialist ULT has opened a subsidiary in the U.S. ULT, LLC, is directed by Wolfgang Kohler, and has its headquarters in Mequon, Wisconsin, about 20 mi (32.2 km) north of Milwaukee.
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Versa Electronics Achieves New ISO Certification

Minneapolis, MN — In accordance with ISO 9001:2015, and based on the recently completed assessment by its registrar, Orion Registrar, Inc., Versa Electronics is on the leading edge of a group of companies that decided to complete transition to the new ISO 9001:2015 standard in 2017. Many of Orion's customers ...
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Viscom Optimizes Inspection with vVision 2.4

Duluth, GA — Viscom has released its vVision 2.4 operating system. Among the latest enhancements are time-saving inspection program creation, especially for new and special components, and comprehensive 3D advancements, such as 3D solder joint inspection for chips.
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Aegis Upgrades FactoryLogix MES Platform

Horsham, PA — Aegis Software has launched its FactoryLogix® version 2017.1. The new version contains many noteworthy advancements across the entire platform. As customers demand higher quality at faster speeds and lower costs, manufacturers are constantly looking for new ways to optimize quality and resources ...
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Alpha Intros Low-Temperature Solder Wire

Somerset, NJ — Alpha Assembly Solutions has introduced a low-temperature, solid solder wire designed for long-term reliability. At an attractive price point, ALPHA® Sn42 Bi57.6 Ag0.4 is a lead-free solder wire primarily designed for the rework and touch up of low-temperature-based electronic assemblies ...
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Amerway Specializes in High-Purity Solder Products

Altoona, PA — Amerway is now offering a wide variety of custom, high-purity anodes and alloy products engineered for highly-specialized soldering applications. These products are designed for the SMT market, as well as for other industrial markets.
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Applied Energy Systems Enables Onsite Gas Mixing

Malvern, PA — Applied Energy Systems (AES) is now offering its SEMI-GAS® Xturion Blixer to support various processes that require forming gas mixtures. The Blixer is designed to provide a cost-effective alternative to premixed gas cylinders by enabling users to blend their own mixtures ...
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Ascentech Installs Gen3 Testers at Amphenol Borisch

Chester, CT — Ascentech, LLC, has installed two Gen3 Systems CM33L+ ionic contamination testers at Amphenol Borisch Technologies (ABT), a vertically-integrated electronics design and manufacturing firm. Ascentech is the North American distributor for Gen3 Systems.
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Data I/O: Security Support for Maxim's DeepCover

Redmond, WA — Data I/O Corporation has introduced security provisioning support for the DS28C36 and DS2476 DeepCover® secure authentication ICs from Maxim Integrated Products, Inc., on the SentriX security provisioning platform.
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Dow Intros New Thermally Conductive Compound

Midland, MI — Dow Corning has introduced its Dow Corning® TC-5888 thermally conductive compound. The latest addition to the company's growing portfolio of solutions for thermal management, the new material is tailored to address the design and manufacturing challenges associated with high ...
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ECD Offers Range of Thermal Profiling Solutions

Milwaukie, OR — ECD® is now offering a full range of thermal profiling and verification solutions, including its M.O.L.E® thermal profilers, wave soldering test pallets, and oven performance verification tools. The company has also introduced a scalable monitoring system that is designed to provide ...
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EMS Debuts Adhesive for Camera Module Lens Holders

Delaware, OH — Engineered Materials Systems has launched its 631-68, a UV-cured adhesive for bonding camera module lens holders. The new material is designed to adhere to the engineered plastics used in lens holder assemblies. These materials are engineered to withstand circuit board reliability ...
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EpoxySet Presents Conductive Non-Silicone Grease

Lincoln, RI — EpoxySet is now offering its CTG-81, an electrically and thermally conductive, non-silicone grease. This grease offers exceptional heat dissipation with a thermal conductivity of 7.2 W/m-K and an electrical resistance of less than 0.01 Ωcm.
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EUTECT Offers Controlled Laser Soldering

Dusslingen, Germany — In order to accommodate the manufacturing process needs of ever-smaller components, EUTECT is now offering controlled, pinpoint-accurate, fast laser soldering. With laser soldering, direct mechanical contact with the soldering point is eliminated. This makes laser soldering ...
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Fujipoly Expands Sarcon Product Line of TIMs

Carteret, NJ — Sarcon® 20GAR from Fujipoly® is a high-performance, glass fabric reinforced thermal interface material (TIM) that is designed for complex die-cut shapes. It has a thermal conductivity of 3.0 W/m-K, while exhibiting a thermal resistance of only 0.17°Cin2/W.
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Heraeus Selects ASM's E by SIPLACE for New Lab

Conshohocken, PA — ASM Assembly Systems has supplied Heraeus with an E by SIPLACE component placement system. The system is located at Heraeus' state-of-the-art SMT applications lab, recently opened in Conshohocken, Pennsylvania.
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Inventec Intros Co-Solvent for Challenging Defluxing

Deep River, CT — Inventec's Topklean EL20 product range includes co-solvent agents, used with mixed or separated HFEs (hydrofluoroether) in vapor phase cleaning systems to remove solder fluxes. This is done before application of conformal coatings, underfills or wirebonding processes.
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JTAG Visualizer Update Adds Faster Debugging

Easton, MD — JTAG Technologies has introduced the latest version of its Visualizer graphical viewing software tool for PCB layouts and schematics. The program allows users to quickly assess fault coverage data and to pinpoint test faults.
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