Monday, December 5, 2016
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Viscom Selected by Cirtronics as 3D AOI Supplier

Duluth, GA — Viscom has installed several of its S3088 ultra blue AOI systems in Cirtronics' facility in Milford, NH. Cirtronics has added one of the machines to each of its production lines in its 175,000 ft2 manufacturing space.
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Wacker Adds to Lumisil Line of Encapsulants

Adrian, MI — Wacker is unveiling two new encapsulation compounds for LEDs. The Lumisil® 740 and 770 cure to form highly-transparent silicone elastomers. Both silicones withstand exceptionally high operating temperatures and strong light radiation without yellowing or becoming brittle, making them ...
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X-FAB Deploys High Temperature Implanter

Lubbock, TX — X-FAB Silicon Foundries has reached a milestone in its establishment of a semiconductor foundry that supports 6 in. (152 mm) silicon carbide (SiC) wafer production. The company, in collaboration with the U.S. Department of Energy (DoE) and the PowerAmerica Institute, has deployed a ...
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Yamaha Improves Mounting Platform Software

Kennesaw, GA — Yamaha Motor Corporation has introduced new software developments for its SMT placement systems designed to improve productivity and simplify maintenance. These include improvements in nozzle care, a maintenance monitor, e-Vision, and a new grouping optimization.
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ACT Intros Releasable Cable Ties

Gardner, MA — Advanced Cable Ties now offers releasable cable ties, which are useful for cable, wire or hose bundling that requires easy access for the addition or removal of cables. Created for applications that require customization and possible changes after bundling, a one-piece, extended pawl ...
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Adhesive from DELO Coats Chips in MEMS Sensors

Sudbury, MA — DELO now offers a new glob top adhesive with enhanced flow properties. Delomonopox GE4825 has been developed to easily coat chips in MEMS sensors and other semiconductors with a uniform thickness of less than 100 µm and not extend beyond the chip's edges. The black-colored adhesive ...
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Dymax Intros Fast-Curing PCB Mask

Torrington, CT — Dymax Corporation recently introduced its SpeedMask® 9-20479-B-Rev-A, a blue, light-curable, removable mask for PCB connectors and board-level protection. The SpeedMask resin has been designed for the protection of electronic components and assemblies, provides protection during ...
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Engineered Materials Intros Conductive Adhesive

Delaware, OH — Engineered Materials Systems has introduced a new conductive adhesive for die attach applications with small-to-medium sized die. The EMS-561-338 is stress-absorbing to withstand the rigors of thermal cycling and cures in less than a minute at 150°C (302°F). The material demonstrates ...
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Epoxies Offers UL 94-V-0 Rated Potting Compounds

Cranston, RI — Today's electronic assemblies must perform in some of the harshest environments. Many high-value designs require the use of an Underwriters Laboratory (UL) listed potting and encapsulating compound.
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Grieve Intros Electric Top-Loading Oven

Round Lake, IL — Grieve has introduced its No. 955, a 500°F (260°C) electrically-heated, top-loading oven designed for electronic component testing. The unit's workspace measures 26 x 2 x 2 ft (7.92 x 0.6 x 0.6m). Heating the oven are 70 kW Nichrome wire elements, while a series of four, 2 hp ...
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Jensen Offers Customizable Toolkits

North Andover, MA — Jensen Tools + Supply (formerly known as Stanley Supply & Services) has introduced its latest version of Jensen toolkits designed specifically for professional field service technicians.
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Matrox Adds 3D Profiling to Frame Grabber Line

Montreal, Quebec, Canada — Matrox has added to its Radient line of frame grabbers with its eV-CXP, the first in the series to include onboard 3D profiling. Offering the flexibility to work with any camera using a CoaXPress® interface, the PCIe frame grabber is capable of performing the laser line ...
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Nordson MARCH: Treatment Uniformity for Wafer Processing

Concord, CA — Nordson MARCH has introduced a plasma confinement ring for wafer processing and wafer fan-out applications. The ring concentrates and focuses the plasma directly over the wafer to speed up the etching process, provide uniform plasma coverage, and to isolate the plasma on the wafer itself ...
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Panasonic Launches High-Speed Odd-Form Placement System

Rolling Meadows, IL — Panasonic Factory Solutions Company of America has introduced its NPM-VF, a high-speed, odd-form placement machine designed to help manufacturers offset the increasing cost of global labor for complex manual assembly. The system, built on the company's NPM platform, introduces ...
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Plasma-Therm Offers Vacuum Plasma Systems

St. Petersburg, FL — The company's vacuum plasma systems are highly versatile, compact, field-proven tools for all plasma processing applications. The Apex SLR® ICP (inductively-coupled plasma) is capable of etching a wide range of materials for semiconductor devices and other types of nanotechnology ...
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Plato Launches New Website and Catalog

Kennesaw, GA — Plato® has launched a new website that allows customers to locate products and specifications quickly and easily. Product categories include soldering tips, robotic soldering tips, soldering tools, soldering accessories, and custom development. The custom development section allows ...
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PVA Releases Progressive Cavity Pump

Cohoes, NY — Precision Valve & Automation (PVA) has released its ProFlow 1K progressive cavity pump. The pump is designed to apply small volume lines or dots in applications requiring a high level of volumetric control. Like the VPX-450, the ProFlow 1K uses a progressive cavity principle, employing a proprietary ...
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Teledyne DALSA Intros Advanced CMOS TDI Cameras

Waterloo, Ontario, Canada — Teledyne DALSA has added multi-line CMOS TDI cameras to its Piranha XL family. The new models are optimized to provide high performance and high-speed color imaging.
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Cornell Dubilier Intros Hermetically-Sealed Capacitors

Liberty, SC — Cornell Dubilier Electronics, Inc. (CDE) has released its Slimpack, type MLSH, the first in a series of hermetically-sealed aluminum electrolytic capacitors that the company plans to introduce over the next several months. With its glass-to-metal seal that prevents it from drying out ...
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Data I/O Adds Lumen X to PSV5000 System

Redmond, WA — Data I/O Corporation has integrated its LumenX programming platform into the PSV5000 automated programming system. The LumenX programming platform has been optimized for the latest generation of eMMC, SD, and SPI NOR flash devices. The LumenX programmer combined with the PSV5000 system delivers ...
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