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Friday, February 23, 2018
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Electronic Mfg. Services
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Electronic Mfg. Services
ASM Implements the Smart Factory at IPC APEX 2018
By Gabriela Reckewerth, Senior Director — Global Marketing, ASM
A smart factory cannot be ordered and installed out of the box. SMT equipment supplier ASM has restructured its broad portfolio to offer guidance, based on the experience gathered from many smart factory projects with electronics manufacturers. The company is showcasing its solutions ...
Best Practices in Crimp Applicator Maintenance
By Rob Boyd, Senior Product Manager, Schleuniger, Inc.
One of the most significant factors in crimp quality is the condition of the applicator. With quality standards getting tighter and the implementation of crimp force monitors continuing to rise, applicator maintenance is key to any crimp process. However, many companies neglect this ...
Building Versatility into High-Throughput X-Ray Inspection
By Olaf Szarlan, Public Relations, Viscom AG
3D inspection at high speed is just as important for automated X-ray inspection (AXI) as it is for automated optical inspection (AOI). With time-optimized image acquisition technologies and efficient handling, in-line X-ray performance is increasing. There is also the potential to automate ...
Comet Combines X-Ray, Plasma and E-Beam Technology at Lab One
By Jacob Fattal, Publisher
Combining different equipment and technologies in one place can be a daunting task, but it is one that The Comet Group has met head-on in Silicon Valley. Comet's Lab One comprises three technology groups — YXLON, Plasma Control Technologies (PCT) and ebeam — in one location in ...
Developing a Strategy to Implement Smart Manufacturing
By George Babka, Sales General Manager, Yamaha Motor IM America
Industry 4.0 and smart manufacturing revolve around leveraging advanced technologies to maximize productivity, quality and responsiveness, minimize waste, and meet market demands for rapid delivery and product individualization. Only a smart infrastructure, with digital communications ...
Enhanced Manufacturing Services 4.0 Part 3: Finding Gold in Production and Test Data
By Christophe Lotz, President and CEO, ASTER Technologies, LLC
When looking at quality data from products returned by end users, there is a key metric: no fault found (NFF). According to a report published by consulting firm Accenture, around 70 percent of all product returns in the U.S. were characterized as NFF. Cost-wise, including returns processing ...
INGUN Creates RF Probe for Quantum Computing Applications
By Matthias Zapatka, CTO, INGUN USA, Inc.
Step-by-step, quantum computing architectures are being inched from laboratory-type environments to the full-scale introduction of universal quantum computers. INGUN has helped to develop an interconnect solution which replaces traditional bond wiring. This has paved the way for scalability ...
INOVAR Partners with MIRTEC for Continuous Quality Improvement
By Jed Jones, VP Sales and Marketing, INOVAR, Inc.
To support multiple manufacturing sites and to meet the increasingly complex demands of its customers, EMS provider INOVAR, Inc., partnered with MIRTEC to improve the quality of its products. Recently, the company purchased MIRTEC's 3D AOI and SPI systems for both its Logan, Utah, and ...
Mega Trends from CES and productronica
By Philip Stoten (
Each January, CES, the world's largest consumer electronics show, displays technologies that will drive the electronics manufacturing throughout the year. Just six weeks after productronica in Munich, it was rare to have conversations at both shows that had so much in common. ...
Micro Analog Becomes Largest Speedprint Customer in U.S.
By David Hughes, SMT Industry Analyst
Micro Analog, Inc., (MAI) operates six SMT lines: two high-volume, two medium-volume and two for low-volume, high-mix manufacturing. The high-mix lines account for 70 percent of the company's production changeovers — typically between 18 and 25 per week. With such a mix of products ...
The Soldering Corner: Eliminating Non-Wetting and De-Wetting
By Shantanu Joshi, Regional Sales Manager, Koki Solder America, Inc.
De-wetting occurs when the pad or component lead wets fully, but retracts and leaves large parts of the pad or lead without solder. Non-wetting means that there is no solder on either the lead or the pad. The end result is either a severely weakened or failed electrical and mechanical ...
"Cradle-to-Grave" Soldering Solutions for SMT Assembly
By Michael L. Martel, Contributing Editor
Any U.S. manufacturer who starts out in the PCB assembly industry needs a complex assortment of equipment and materials. This includes a source for solder bar, wire, fluxes, pastes, and more. There is a wide range of choices, but many of them are offshore. To choose a vendor and qualify ...
Agents of Change: What Will Disrupt the SMT Industry in 2018?
By Philip Stoten (
This past year we saw the challenges of the connected factory, breakthroughs in modular and compact production equipment, and the issues surrounding the generation of manufacturing data and how it can be leveraged brought to the fore. These trends are quickly moving from concept to ...
Automated Touchscreen Testing with Air-Activated Capacitive Probes
By Matthias Zapatka, CTO, INGUN USA
Now even the need for human touch is being replaced by test probes. INGUN's new PKS-399 series of air-activated, capacitive test probes mimic human fingers for automated touchscreen testing.
Brigitflex Takes Challenging Boards from Concept to Creation
By Brigitte Lawrence, Brigitflex
It takes a unique perspective and a lot of expertise to build the PCBs that others turn down. These boards often have challenging dimensions, novel materials and embedded elements, but in the end, still have to be delivered functioning to the customer.
Eliminating Harmful Airborne Pollutants in Electronics Assembly
By Stefan Meissner, Head of Corporate Communications, ULT AG, and Arne Neiser, Product Manager Wave and Reflow Soldering Systems, SEHO Systems GmbH
All soldering processes produce airborne pollutants that can have harmful effects on employees, equipment and products. Soldering today comprises a variety of processes, including wave, reflow, dip, hot air, selective, laser, vacuum, and vapor phase soldering.
Seven Manufacturing Industry Predictions for 2018
By Philip Stoten (
This year was a stellar year for the electronics manufacturing industry. Real progress has been made toward the smart factory/Industry 4.0 nirvana that we have been talking about for so long.
Smart Factory Technology is Not Only for the Big Players
By Vitor Barros, General Manager, KIC Europe
Tier one EMS companies are investing heavily in smart technologies. But, how relevant is Industry 4.0 and the smart factory for the average electronics manufacturer? The first question is why? What is the motivation for any investment and what is the justification? Any new trend or ...
Stripping Costs From Photoresist Processing
By Ed Sullivan
Silicon and compound semiconductor wafers undergo many critical procedures during the microfabrication process, including the recurring stripping of photoresist. This is the light-sensitive material (liquid or film) that is deposited during various steps of wafer production. Reexamining ...
Swissbit Enables "IoM Security Ready" Manufacturing
By Hubertus Grobbel, Security Products Manager, Swissbit AG
The progress toward smart factories, intelligent, adaptive production lines, and automated supply chains is picking up steam. Whether we call it IoM (Internet of Manufacturing), IoT (Internet of Things), IIoT (Industrial Internet of Things), or Industry 4.0 — the concept is, at its core, all about ...
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