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Thursday, April 19, 2018
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Electronic Mfg. Services
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Electronic Mfg. Services
ASM Presents Smart Factory Solutions for Eight Central Workflows
By Eric Zhao, Senior Manager Regional Marketing, Greater China, ASM
At NEPCON China 2018, ASM is inviting visitors to "Check in to the Smart Factory," and will present its extensive portfolio of hardware, software and process support products. The focus will be on eight central workflows in electronics production: planning, virtual production, process ...
Commercially Available, Hands-Free MIC Device Assembly
By Jim Angeloni, COO — Defense and Aerospace Operations, NEO Tech
The reliability of gallium nitride (GaN) device technology has improved significantly, making it a viable technology for both military and commercial microwave integrated circuit (MIC) applications. IC manufacturers are migrating to GaN and other advanced semiconductor compounds to ...
EAO Creates Tailored HMI Solution for KOR Engineering
By John J. Pannone, VP Sales — HMI Systems, EAO Corporation
KOR Engineering approached EAO Corporation with a simple components order for a new control panel designed for new labeling and packaging machinery. EAO quickly learned that the request was to fulfill an original need of individual controls for panels located in several operational ...
EDM Partners with Nordson YESTECH for Cutting-Edge 3D AOI
By Rebekah Taylor, Business Development Manager, Electronic Design & Manufacturing, Inc.
Some inspection tasks, such as coplanarity inspection of chips, lead banks and BGAs, are not possible with 2D automated optical inspection (AOI). Electronic Design & Manufacturing (EDM), recently added a Nordson YESTECH FX-940 ULTRA 3D AOI system to its production facility in Lynchburg ...
Long-Term Component Storage Prevents Obsolescence Issues
By Holger Krumme, Dipl.-Ing., Managing Director — Technical Operations, HTV Halbleiter-Test & Vertriebs GmbH
During product development, or even shortly after launch, single components often go obsolete. Decisions about how to proceed then have to be made, including the option to redesign the product, or make a last-time buy (LTB) to ensure the availability of the required parts until the ...
New Approach to IGBT Control: Electrical Plugging — Optical Transmission
By Rainer Bussmann, Senior Product Manager, and Jonas Diekmann, Special Editor, HARTING Electronics
Industrial drive engineering, with its automated manufacturing processes, would not be possible without electric motors. IGBT (insulated-gate bipolar transistor) semiconductor elements control powerful electrical drives that are connected by polymer optical fibers for the necessary ...
Sanmina Achieves 10-Day Lead Times for Industrial Systems OEM
By Gelston Howell, Senior VP of Marketing, Sanmina
A global industrial systems company was struggling to meet customer demand for its family of complex electromechanical controls. Supply chain challenges included long component lead times and management of several system variants. Sanmina redesigned the company's global supply chain ...
Test Research: Yield Management System for the Smart Factory
By Robert Yebra Liriano, Technical Marketing Writer, Test Research, Inc.
Industry 4.0, the current trend of automation and data exchange in manufacturing technologies, includes cyber-physical systems, the Internet of Things (IoT) and
Triangulating BGA Faults with Boundary Scan
By Ryan Jones, Senior Technical Marketing Engineer, Corelis, Inc.
Visual inspection and electrical testing can be highly successful at identifying board-level defects after assembly, but sometimes detection alone is not enough. Today's fine-pitch ball grid array (BGA) devices, in particular, present real problems. There is often no physical or visible ...
ASM Implements the Smart Factory at IPC APEX 2018
By Gabriela Reckewerth, Senior Director — Global Marketing, ASM
A smart factory cannot be ordered and installed out of the box. SMT equipment supplier ASM has restructured its broad portfolio to offer guidance, based on the experience gathered from many smart factory projects with electronics manufacturers. The company is showcasing its solutions ...
Best Practices in Crimp Applicator Maintenance
By Rob Boyd, Senior Product Manager, Schleuniger, Inc.
One of the most significant factors in crimp quality is the condition of the applicator. With quality standards getting tighter and the implementation of crimp force monitors continuing to rise, applicator maintenance is key to any crimp process. However, many companies neglect this ...
Building Versatility into High-Throughput X-Ray Inspection
By Olaf Szarlan, Public Relations, Viscom AG
3D inspection at high speed is just as important for automated X-ray inspection (AXI) as it is for automated optical inspection (AOI). With time-optimized image acquisition technologies and efficient handling, in-line X-ray performance is increasing. There is also the potential to automate ...
Comet Combines X-Ray, Plasma and E-Beam Technology at Lab One
By Jacob Fattal, Publisher
Combining different equipment and technologies in one place can be a daunting task, but it is one that The Comet Group has met head-on in Silicon Valley. Comet's Lab One comprises three technology groups — YXLON, Plasma Control Technologies (PCT) and ebeam — in one location in ...
Developing a Strategy to Implement Smart Manufacturing
By George Babka, Sales General Manager, Yamaha Motor IM America
Industry 4.0 and smart manufacturing revolve around leveraging advanced technologies to maximize productivity, quality and responsiveness, minimize waste, and meet market demands for rapid delivery and product individualization. Only a smart infrastructure, with digital communications ...
Enhanced Manufacturing Services 4.0 Part 3: Finding Gold in Production and Test Data
By Christophe Lotz, President and CEO, ASTER Technologies, LLC
When looking at quality data from products returned by end users, there is a key metric: no fault found (NFF). According to a report published by consulting firm Accenture, around 70 percent of all product returns in the U.S. were characterized as NFF. Cost-wise, including returns processing ...
INGUN Creates RF Probe for Quantum Computing Applications
By Matthias Zapatka, CTO, INGUN USA, Inc.
Step-by-step, quantum computing architectures are being inched from laboratory-type environments to the full-scale introduction of universal quantum computers. INGUN has helped to develop an interconnect solution which replaces traditional bond wiring. This has paved the way for scalability ...
INOVAR Partners with MIRTEC for Continuous Quality Improvement
By Jed Jones, VP Sales and Marketing, INOVAR, Inc.
To support multiple manufacturing sites and to meet the increasingly complex demands of its customers, EMS provider INOVAR, Inc., partnered with MIRTEC to improve the quality of its products. Recently, the company purchased MIRTEC's 3D AOI and SPI systems for both its Logan, Utah, and ...
Mega Trends from CES and productronica
By Philip Stoten (
Each January, CES, the world's largest consumer electronics show, displays technologies that will drive the electronics manufacturing throughout the year. Just six weeks after productronica in Munich, it was rare to have conversations at both shows that had so much in common. ...
Micro Analog Becomes Largest Speedprint Customer in U.S.
By David Hughes, SMT Industry Analyst
Micro Analog, Inc., (MAI) operates six SMT lines: two high-volume, two medium-volume and two for low-volume, high-mix manufacturing. The high-mix lines account for 70 percent of the company's production changeovers — typically between 18 and 25 per week. With such a mix of products ...
The Soldering Corner: Eliminating Non-Wetting and De-Wetting
By Shantanu Joshi, Regional Sales Manager, Koki Solder America, Inc.
De-wetting occurs when the pad or component lead wets fully, but retracts and leaves large parts of the pad or lead without solder. Non-wetting means that there is no solder on either the lead or the pad. The end result is either a severely weakened or failed electrical and mechanical ...
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