Monday, May 21, 2018
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Juki Automation Systems Announces Growth in Mexico

MORRISVILLE, NC - Juki Automation Systems (JAS), Inc., a world-leading provider of automated assembly products and systems and part of Juki Automation Systems Corporation, is pleased to announce that it has seen tremendous growth in Mexico since Rene López joined the company in 2015.    
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Indium Corporation to Feature InFORMS® Reinforced Solder Preforms at PCIM Europe

Booth #7-528

CLINTON, NY - Indium Corporation will feature its reinforced solder alloy fabrications, InFORMS®, at PCIM Europe, June 5-7, in Nuremberg, Germany.

Indium Corporation is redefining solder with its InFORMS® solder preforms. InFORMS® are a composite preform consisting of solder with a reinforcing matrix.     
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MicroVision Delivers LiDAR Sensing Samples with New Time-of-Flight ASICS

REDMOND, WA - MicroVision, Inc., a leader in innovative ultra-miniature projection display and sensing technology, today announced that it has provided product samples for customer evaluation that include the company’s latest time-of-flight ASICS. These new ASICS have specialized circuitry that enables MicroVision’s MEMS scanners to be used as LiDAR sensors.     
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Alexander Gerfer appointed to PSMA Board of Directors: CTO of Würth Elektronik eiSos group boosts PSMA Management

WALDENBURG, GERMANY - Alexander Gerfer, CTO of Würth Elektronik eiSos Group, has been appointed to the twelve-strong Board of Directors of the Power Sources Manufacturers Association PSMA. The international association for power electronics has set itself the goal of increasing and propagating knowledge about technologies and developments in the context of energy sources and the transformation of energy.    

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Thermaltronics Introduces the TMT-FE100S Benchtop Fume Extraction System

NEW YORK - Thermaltronics, a fast-growing manufacturer of soldering systems and accessories, introduces a new versatile, benchtop fume extraction system.

The unit, which is certified to TUV NRTL and TUVE CE safety standards, is available in both 110V and 220V versions and unlike most other benchtop units, has an adjustable speed control to allow operators to select the best operating speed, dependent on fume conditions.     

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PATLITE Announces a New Work Light Designed to Efficiently Illuminate Workspaces

The CWF LED Work Light

TORRANCE, CA - PATLITE (U.S.A.) Corporation, a leading provider of innovative LED signal lights, sounders, and network-enabled alerts announces a new product release. The CWF, an industrial-grade LED work light designed to efficiently illuminate workstations, machinery, and control cabinets.    
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SMT Hybrid Packaging 2018 – Innovative Exhibition and Conference provides platform for personal exchange

The SMT Hybrid Packaging will soon be taking place at the Nuremberg exhibition center inviting exhibitors, participants of the conference and visitors to greatly benefit from intensifying personal contacts and the exchange of information available on site.

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Quadruple Industry Recognition for Nordson DAGE Test and Inspection systems at Nepcon China 2018

Aylesbury, Buckinghamshire, UK - Nordson DAGE announces that it was recognized with four awards for its Test and Inspection systems during Nepcon China, the prestigious global exhibition on SMT (surface mount technology) and EMA (electronics manufacturing automation) that brings together all major brands from the electronics manufacturing industry, held in Shanghai 24th – 26th April 2018.    
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High Performance Surface Mount RF Inductors from Gowanda to be Featured at IMS

Gowanda Introduces Six Series with 2X or More Improvement in SRF and Current Rating

Gowanda, N.Y. - Gowanda Electronics, a designer and manufacturer of precision electronic components for broadband radio frequency and power applications, announces the introduction of several High Performance RF Surface Mount Inductor Series.    
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Digicom Electronics and CASPER'S Technology Generate Astronomy and Aerospace Innovation and Collaboration, White Paper Available

Highlights Reconfigurable Open Architecture Computing Hardware (ROACH) and its Innovations

OAKLAND, CA - Digicom Electronics, Inc., a technology and quality driven Electronics Manufacturing Services (EMS) company based in Oakland, CA, announces that the white paper, Digicom Electronics and CASPER'S Technology Open Endless Possibilities for Astronomy and Aerospace Innovation and Collaboration, is now available on the www.Digicom.org website.    
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PDR Announces New Rep in the Northwest

SHINGLE SPRINGS, CA - PDR, an industry recognized leader in IR rework since 1986, is pleased to announce that it has partnered with Powell Industries as its manufacturers’ representative in the Northwest. Based in Tukwila, WA, Mike Powell will represent PDR throughout WA, OR, ID and UT.

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RUSH PCB Announces Ten-Layer High Density Interconnect Board Design Capability

San Jose, CARush PCB Inc., a printed circuit design, fabrication and assembly company located in the heart of Silicon Valley, offers capabilities in the design and manufacturing of multilayer High-Density Interconnect (HDI) PCBs of 10 layers and more.


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Indium Corporation to Introduce Indium Oxide Powder at SVC TechCon 2018

Booth #417

CLINTON, NY - Indium Corporation will introduce its new Indium Oxide High BET powder designed to support emerging applications of the display industry at SVC TechCon from May 5-10 in Orlando, Florida, USA.


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MicroCare Presents its Latest Advancements in Cleaning at SMT Hybrid Packaging

Stand 4-531

MicroCare Europe bvba will showcase its newest electronics cleaning products at the SMT Hybrid Packaging Show in Nuremberg, Germany. The expo runs from 5-7 June 2018. These new circuit cleaners will help companies boost quality, enhance throughput and lower PCB production costs. They also will help clients meet ever-more stringent European regulations.
 

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DfR Solutions to Address Reliability Physics at IMAPS NORDPAC

How design choices and extreme environments impact product performance

BELTSVILLE, MD - DfR Solutions, the leader in quality, reliability, and durability (QRD) solutions for the electronics industry, today announced that it is presenting, Overcoming Human Factors by Utilizing Design Modeling to Improve High Reliability Electronics at The Nordic Conference on Microelectronics Packaging, NordPac 2018, held June 12-14, 2018 in Oulu, Finland.   
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What’s New in Electronics sponsors leading Industry Awards taking place during WNIE Live event in September

London - What’s New in Electronics is pleased to announce that it is to sponsor two awards at the Electronics Industry Awards, designed to recognise the many successes in the electronics industry, celebrating outstanding companies, people and products.

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Efficient Production Solutions from SEHO

Hall 4, Stand 141

SEHO Systems GmbH, a worldwide leading manufacturer of complete solutions for soldering processes and automated production lines, will focus on equipment productivity in Hall 4, Stand 141 at the upcoming SMT/Hybrid/Packaging show, scheduled to take place June 5 - 7, 2018 at the Messe in Nuremberg, Germany.    
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Seika Offers Malcom SPS-2000 Solder Paste Mixer Demo Unit for Evaluations

TORRANCE, CA - Seika Machinery, Inc., a leading provider of advanced machinery, materials and engineering services, today announced that it has a demo unit available for the new Malcom SPS-2000 Solder Paste Mixer. This new version adds a number of new functions to make sure your paste is at its optimum condition for use.


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Latest Research on Conformal Coatings Presented by Dr. Nebioglu of Dymax Corporation at ICULTA-2018

TORRINGTON, CT - Dymax Corporation is proud of the participation of its Senior R&D Manager of the Adhesives team at the International Conference on UV LED Technologies & Applications Conference (ICULTA-2018) in Berlin, Germany. Dr. Nebioglu’s technical presentation, “UV Broad Spectrum & LED Curable 100% Solids Very Low Viscosity Conformal Coating”, was held on Monday, April 23, at 11:45 a.m., as part of the Semiconductors & Devices I session.     

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Indium Corporation’s Greg Wade Earns IPC Leadership Award

CLINTON, NY - Indium Corporation’s Greg Wade, Technical Support Engineer, Global Accounts, was presented with the Committee Leadership Award by the IPC in recognition of his excellence in leadership in the development of the industry standard IPC-7526A, Stencil and Misprinted Board Cleaning Handbook.   
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