Tuesday, February 21, 2017
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Ersa Announces Official Launch of the VERSAFLEX-Ultra Selective Solder Module
Publication Date: 2/2/2017

PLYMOUTH, WI - Kurtz Ersa North America, a leading supplier of electronics production equipment, today announced plans to launch the new VERSAFLEX-Ultra selective solder module. The system will be displayed in Booth #3111 at the 2017 IPC APEX EXPO, scheduled to take place Feb. 14-16, 2017 at the San Diego Convention Center in Calif. Live demonstrations will take place every two hours during the three-day event.
Ironwood Electronics: 27 GHz Bandwidth Open Top Socket for BGA121
Publication Date: 2/2/2017

EAGAN, MN - Ironwood Electronics has recently introduced a new high performance BGA socket for 1mm pitch, 121 pin BGA IC's. The SG-BGA-6457 socket is designed for IC size - 12x12mm package size and operates at bandwidths up to 27 GHz with less than 1dB of insertion loss. The contact resistance is typically 20 milliohms per pin.
 
SEIKA: New Bubble Washer System for Stubborn Flux Cleans Five Times Faster than Immersion Cleansing
Publication Date: 2/2/2017

TORRANCE, CA - Seika Machinery, Inc., a leading provider of advanced machinery, materials and engineering services, now carries the SAWA PIBW-T100L Bubble Washer System. The system provides effective cleansing with the surface active agent-free electrolysis water and eco-friendly SAWA Pica SNW-H20 alkaline solvent.
Mill-Max: New Spring Loaded Pins with Removable Pick and Place Caps For Automated Assembly
Publication Date: 2/1/2017

OYSTER BAY, NY - Mill-Max announces a new option for automated assembly of spring-loaded pins with the introduction of removable pick & place caps. The new 806 series features standard Mill-Max spring pins with removable caps which keep parts centered in the carrier tape pocket, present a large round target surface for vacuum pick up and are easily removed after the soldering process.
Metcal Announces Major Rebranding on Milestone 35th Anniversary
Publication Date: 2/1/2017

CYPRESS, CA - With the upcoming introduction of a game-changing technology, new investments in technology and engineering, and a deep product pipeline, Metcal announces a revitalization of its brand and further strengthens its position as the industry innovator.
MDM-West 2017: WACKER Showcases Self-Adhesive Liquid Silicone Rubber with a Low-Friction Surface
Publication Date: 2/1/2017

ADRIAN, MI - At this year’s MDM-West and as previously introduced at COMPAMED medical-technology trade fair this past November in Dusseldorf, WACKER, the Munich-based chemical group, is showcasing a new self-adhesive liquid silicone rubber (LSR) that has a low coefficient of friction. SILPURAN® 6760/50 cures to form an elastomer with a low-friction surface; a property which enables self-adhesive LSR’s to be used in novel applications.
RIGOL Expands Internet of Things Solutions with new ASK/FSK Demodulation Analysis Software
Publication Date: 2/1/2017

BEAVERTON, OR - RIGOL Technologies, Inc. announces an expansion of its Internet of Things test portfolio. The new S1220 Software, along with RIGOL's DSA800 Series spectrum analyzer gives engineers integrating ASK/FSK modulated signals into their designs a new powerful and affordable solution to speed their debug activities and reduce time to market.
 
ULT: Accessory Kit Complements Extraction and Ionization System for Electrostatically Charged Surfaces
Publication Date: 2/1/2017

LOEBAU, GERMANY - In addition to the JUMBO Elephant extraction and ionization unit, ULT offers an accessory kit, consisting of various test and measurement devices as well as cleaning tools.

One of these is the ‘Ion Check Set’, which includes a functional tester for ionization systems (Ion Check) and a measuring probe for high voltage power supply check (Ion Check Test Probe).
 
EMC (Elite Materials Company) & Technica USA to present full line of EMC materials at DesignCon 2017
Publication Date: 1/31/2017

SAN JOSE, CA - In conjunction with Technica USA, EMC plans to present their full line of laminate materials at DesignCon 2017, booth #202.

EMC will be presenting several new products at this year’s conference. The focus will primarily be on the halogen free EM890 and the halogenated EM891 ultra high speed materials for 100 and 200GbE applications as well as the EM 370Z, a halogen free very low CTE material for automotive and EV/HEV applications.
Gen3 Systems to Present Research Conducted with Robert Bosch at APEX
Publication Date: 1/31/2017

FARNBOROUGH, UK ― Gen3 Systems Limited, a specialist British manufacturer and distributor, is pleased to announce that its Production Manager Mark Routley will present the paper titled “Process Control of Ionic Contamination achieving 6-Sigma Criteria in the assembly of Electronic Circuits” alongside Dr Pierre Eckold of Robert Bosch at the upcoming IPC APEX EXPO. The presentation will be held during the session titled “Corrosion/Cleanliness/SIR Reliability” on Wednesday the 15th February between 10:30 – 12:00pm in location 3.
Schaefer Megomat USA, Inc., Appoints Todd Miller as General Manager
Publication Date: 1/31/2017

PEWAUKEE, WI - Schaefer Megomat USA, Inc. has promoted Todd Miller to the position of General Manager. Mr. Miller will lead the company’s North American division.

Mr. Miller joined the company in 1997 beginning his career with Megomat part-time in shipping and receiving. Over time, he has worked in and with each department as his role continued to expand.
 
Keystone Electronics Expands and Moves Warehouse
Publication Date: 1/31/2017

ASTORIA, NY - Keystone Electronics has moved its warehouse and QC Lab to a new state-of-the-art facility in New Hyde Park, NY.

This new fulfillment center incorporates Keystone’s finished goods inventory as well as its Quality Control lab and staff. The facility is a U.S. Green building, having achieved Gold Level LEED Certification from the U.S Green Building Council.
Nordson ASYMTEK Exhibits Innovative Technologies for Dispensing and Conformal Coating Systems at IPC APEX 2017 Booth 1611
Publication Date: 1/31/2017

CARLSBAD, CA - Nordson ASYMTEK, a Nordson company, will exhibit its latest and most popular technologies for fluid dispensing, jetting, conformal coating, and hot bar soldering in booth 1611 at the IPC APEX tradeshow, in San Diego, California, being held February 14-16, 2017. ASYMTEK is joining its sister Nordson companies to support IPC as it celebrates its 60th year in the electronics manufacturing industry.
LPKF: Rapid Prototyping of Printed Circuit Boards at Satellite 2017
Publication Date: 1/31/2017

Tualatin, Ore., February 2017 — LPKF Laser & Electronics has announced it will exhibit at the Satellite 2017 exhibition, which takes place March 7-9 at the Walter E. Washington Convention Center in Washington, D.C. LPKF provides in-house rapid PCB prototyping systems for a variety of applications and will demonstrate the ProtoMat E44.
Fuji Joins IPC/APEX Expo, San Diego CA
Publication Date: 1/31/2017

VERNON HILLS, IL - The APEX 2017 exhibition is just around the corner and of course Fuji will be there. This year's show runs for three days from February 14th to 16th and will be held at the San Diego Convention Center
Fuji booth: 1917
 
KYZEN: See Dr. Mike Bixenman in the Technical Conference at APEX!
Publication Date: 1/31/2017

NASHVILLE, TN - KYZEN is pleased to announce that Dr. Mike Bixenman will present two papers at the upcoming IPC APEX EXPO at the San Diego Convention Center. “Electrochemical Methods to Measure the Corrosion Potential of Flux Residues” will be presented during Session S04 on Tuesday, Feb. 14, 2017 from 1:30-3 p.m.
 
Nano Dimension Combines Electronic Components within Printed Circuit Boards as part of the Printing Process
Publication Date: 1/30/2017

NESS ZIONA, ISRAEL - Nano Dimension Ltd., a leader in the field of 3D printed electronics, announced today that its wholly owned subsidiary, Nano Dimension Technologies Ltd., has successfully 3D printed electrical circuits, in which it embedded electrical components, through placement, as an integral part of the printing process. The company's 3D printer - the DragonFly 2020 - enables 3D printing of PCBs with conductive ink and dielectric ink.
Aven Introduces Cyclops HDMI Digital Microscope
Publication Date: 1/30/2017

ANN ARBOR, MI - The innovative Cyclops HDMI Digital Microscope connects directly to any monitor through a convenient 1080p HDMI output allowing operators to see high quality images while looking straight ahead at a large screen. This system reduces eye strain and neck fatigue associated with frequent microscope use. Operators may connect their Cyclops to any HD monitor to study 1080p images (monitor not included). The HDMI output and 2-megapixel sensor provides users with exceptionally crisp, high resolution, stunning, HD picture quality.
 
Ventec International Expands USA Manufacturing Capacity With Investment in New Equipment
Publication Date: 1/30/2017

FULLERTON, CA - Ventec International Group, a world leader in the production of polyimide & high reliability epoxy laminates and prepregs, has increased the manufacturing capacity at its Chicago facility (700 Lee Street, Elk Grove Village, IL) with major investment into new state-of-the-art equipment for laminate/prepregs as well as its newest ranges of PCB base-materials including complementary products such as flex- & rigid-flex circuit board materials, back-up, entry & routing materials, foils and coatings.
Schleuniger, Inc. to Exhibit Wire Processing Solutions at EPTECH Electronics Trade Shows
Publication Date: 1/30/2017

MANCHESTER, NH - Schleuniger, Inc., a leading international manufacturer of high-precision wire processing machines, will exhibit the latest in wire processing solutions at the EPTECH series of professional electronics shows across Canada. Schleuniger will be at EPTECH Montreal / Pointe-Claire on Tuesday, April 25, 2017 and EPTECH Markham on Thursday, April 27, 2017.
 
 
 
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