Tuesday, March 28, 2017
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Hanwha Techwin Expands SMT Engineering Support Team
Publication Date: 3/6/2017

IRVINE, CA- Hanwha Techwin Automation Americas, Inc., formerly Samsung C&T Automation, today announced the expansion of the SMT engineering support team for SMT business development by 140 personnel globally.

Alpha’s Gyan Dutt and RPI’s Robert Karlicek Co-Chair iNEMI Solid State Illumination Roadmap
Publication Date: 3/6/2017

SOMERSET, NJ - Alpha Assembly Solutions, the world leader in the production of electronic soldering and bonding materials, and the Lighting Enabled Systems and Applications Center (LESA), A National Science Foundation Engineering Research Center at Rensselaer Polytechnic Institute (RPI), are pleased to announce that Gyan Dutt, Technical Marketing Manager at Alpha and Dr. Robert Karlicek, Director of LESA at RPI, have co-chaired the 2017 iNEMI Solid State Illumination Industry Roadmap.
PI: OEM Driver for Miniature Positioning Systems is Small and Affordable
Publication Date: 3/6/2017

AUBURN, MA – PI (Physik Instrumente) LP, known industry- wide for precision motion components, systems, and solutions, announces a new OEM driver for miniaturized piezo inertia positioning stages.
 
Rehm presents VisionXC at the AMPER in Brno
Publication Date: 3/6/2017

BLAUBEUREN, GERMANY -  The AMPER in the Czech city of Brno is one the largest trade events for the electronics industry in Europe. Rehm Thermal Systems will also be exhibiting this year from 21 to 24 March 2017 with innovative solutions at stand F 2.12.
 
Ersa to Participate in Advanced Process Technologies’ Puerto Rico Tech Expo
Publication Date: 3/6/2017

PLYMOUTH, WI - Kurtz Ersa North America, a leading supplier of electronics production equipment, today announced plans to exhibit at the Puerto Rico Technology Expo on Wednesday, March 15, 2017 at the Courtyard by Marriott Isla Verde Beach Resort.
 
Ironwood Electronics: Socket your SOIC24 using Extreme Temperature Socket with Superior Electrical Performance
Publication Date: 3/6/2017

EAGAN, MN - Ironwood Electronics recently introduced a new socket addressing high performance requirements for Burn-in and Test applications - SBT-SOIC-2000. The contactor is a stamped spring pin with 31 gram actuation force per ball and cycle life of 125,000 insertions.
 
ACE to Conduct March 14-15 Introductory Selective Soldering Workshop
Publication Date: 3/3/2017

SPOKANE VALLEY, WA - ACE Production Technologies, a Nordson SELECT company, and a leading supplier of selective soldering systems, is pleased to announce that registration is now open and seats are available for its upcoming March 14-15, 2017 introductory selective soldering workshop.

Mill-Max: New Low Profile Target Connectors
Publication Date: 3/3/2017

OYSTER BAY, NY - Mill-Max is excited to announce the release of our lowest profile target connectors with an above board height of only .087” (2,21mm). Target connectors are used in place of SMT pads on a PCB as the mating surface for spring-loaded pins.
 
Harting: Rapid Vibration-proof Connection with Just One Click – M12 PushPull
Publication Date: 3/3/2017

ELGIN, IL - Simple and reliable connectivity with fast and easy connection in high vibration environments - this is the idea behind the HARTING M12 PushPull. The M12 PushPull brings the benefits of the HARTING PushPull in the form factor of an M12.
Nordson ASYMTEK to Present Paper on Dispensing for Chip-on-Wafer Packaging and Poster on Coating Applications for EMI Shielding at IMAPS Device Packaging Conference
Publication Date: 3/3/2017

CARLSBAD, CA - Nordson ASYMTEK, a Nordson company, a global leader in dispensing, jetting, and coating equipment and technologies, will present a technical paper and poster session at the IMAPS Device Packaging Conference being held at the WeKoPa Resort & Casino in Scottsdale/Fountain Hills, Arizona, March 7-9, 2017.
TopLine Acquires Vibration Damping Technology from NASA
Publication Date: 3/2/2017

At APEX 2017, TopLine displayed its recently acquired PID board vibration damping technology. The technology has applications wherever boards are subject to a high degree of bending or repeated flexing. The technology was developed by NASA and transferred to TopLine in 2016.
HTV: Services Regarding Electronic Components
Publication Date: 3/2/2017

BENSHEIM, GERMANY - As one of the worldwide market leaders in the field of testing, programming, Long-Term Conservation and -Storage, analytics as well as processing of electronic components the HTV-group of companies will present a variety from its wide range of partly unique services in hall 4, booth 549 at SMT 2017:
 
Würth Elektronik eiSos at the embedded world 2017 exhibition
Publication Date: 3/2/2017

Würth Elektronik eiSos will present the WE-MAPI SMD storage choke, the world’s smallest wrapped metal alloy power inductor.
WALDENBURG, GERMANY - Würth Elektronik eiSos, one of the leading European suppliers of electronic and electromechanical components, is taking the stage at the embedded world exhibition in Nuremberg (14 to 16 March 2017). The focus of the presentation at Stand 3-359 in Hall 3 will be on miniature components for embedded applications.
 
Interplex: New High Density SMT Solderless Edge Card Connectors Address the Needs of Compact Multi-PCB Applications
Publication Date: 3/2/2017

ATTLEBORO, MA - Emerging requirements for interconnecting small PCBs in miniaturized applications, such as mobile handsets, tablets, wearables, Internet of Things (IoT) etc., have led to new SMT press-fit interconnects that provide higher density.
Engineers and Students From Across the World Compete to Build a Brighter Future
Publication Date: 3/2/2017

NEW YORK, NY - The 15th annual "Create the Future" Design Contest (www.createthefuturecontest.com) is now open for submissions and runs through July 1, 2017. Contestants are asked to submit innovative product design ideas that benefit society and the economy for the opportunity to receive global recognition and win a cash prize of $20,000 USD.
Computrol Speeds Up Production with VJ Electronix XQuik II
Publication Date: 3/2/2017

MERIDIAN, ID - Computrol, Inc., a world-class provider of mid- to low-volume, high-mix electronic manufacturing services to OEMs, today announced that it has purchased and installed an XQuik II with AccuCount Technology from VJ Electronix.
 
Vi TECHNOLOGY held successful Open Days in Hungary
Publication Date: 3/1/2017

SAINT-EGREVE, FRANCE - Vi TECHNOLOGY, a leading provider of inspection solutions for PCB assembly, is pleased to announce that it participated in AMTEST’s recent open days at the AMTEST facility in Budapest, Hungary.
Tech-Etch: Photo Etching Thin Titanium Components
Publication Date: 3/1/2017

PLYMOUTH, MA - Tech-Etch specializes in the photo chemical etching of titanium. Because of its low weight, strength and corrosion resistance, titanium is used in everything from jet engines to eyeglass frames.
 
Komax Systems Is Offering a Channel Mixer That Is Designed for New Water Treatment Methods
Publication Date: 3/1/2017

HUNTINGTON BEACH, CA - The water treatment needs of today's society are rapidly changing, and Komax is working to meet that change with a unique Channel Mixer design created for today's municipalities and organizations.
Entegris Introduces Purasol™ Solvent Purifiers for Total Metal Removal
Publication Date: 3/1/2017

BILLERICA, MA - Entegris Inc., a leader in specialty chemicals and advanced materials handling solutions for the microelectronics industry, today introduced Purasol™, a first-of-its-kind solvent purifier that removes a wide variety of metal microcontaminants found in organic solvents used in ultraclean chemical manufacturing processes.
 
 
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