Monday, September 26, 2016
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Kerr to manage operations at Lauren Manufacturing
Publication Date: 9/9/2016

NEW PHILADELPHIA, OH - Lauren Manufacturing has named Chris Kerr plant manager of its New Philadelphia, Ohio location.

In this new position, Kerr will oversee day-to-day operations of the manufacturing facility, which engineers custom rubber seals and components for use in a wide range of markets.
Great Lakes Engineering, Inc. Is Unsurpassed in Customer Service
Publication Date: 9/9/2016

GREAT LAKES, MN - Great Lakes Engineering has prided itself on providing exemplary service to customers for more than 30 years, and the company knows it is succeeding when it receives a heartfelt ‘Thank You’ from a satisfied customer!

Visit Noren Products Inc. at The Battery Show 2016
Publication Date: 9/9/2016

MENLO PARK, CA - Noren Products, Inc. will be attending The Battery Show at the Suburban Showplace in Novi, MI from September 13th-15th, located in Booth #2032, to discuss specific thermal challenges. The Noren Products team brings years of thermal knowledge and industry best practices which has built their reputation as an industry leader in thermal solutions for a variety of industries, worldwide.
 
Techcon Systems to Exhibit at FEICA Conference in Vienna, Austria
Publication Date: 9/9/2016

CYPRESS, CA - Techcon Systems, a product group of OK International and a leading provider of fluid dispensing systems and products, is exhibiting at the FEICA 2016 Conference and EXPO, taking place September 7-9, 2016 in Vienna, Austria.
Microscan Releases AutoVISION® Machine Vision Software for MicroHAWK® MV Smart Cameras
Publication Date: 9/9/2016

RENTON, WA - Microscan, a global manufacturer of industrial machine vision solutions for quality control and guidance in factory and clinical automation, announces the latest version of its simplified AutoVISION Machine Vision Software to support new MicroHAWK Smart Cameras, now released and available for order.
U.S.Tech Publisher's Choice: September 2016
Publication Date: 9/8/2016

For our Publisher's Choice article this month we are highlighting a piece by the staff of Cicor Advanced Microelectronics & Substrates GmbH about developments in thick-film ceramic technology, which in combination with new fine-line structuring methods, allow for high-quality and high-density substrates.
Indium Corporation to Lead Special Session on Void Reduction at SMTA International
Publication Date: 9/8/2016

CLINTON, NY - Indium Corporation, the industry leader for void-reducing solutions, will chair a special session focusing on void reduction in bottom-terminated components (BTCs) at the SMTA International Conference on Sept. 29 in Rosemont, Ill.

Voiding is of critical concern in today's electronics assembly arena, especially in BTCs, due to impacts on electrical, thermal, and mechanical performance.
ASM Assembly Systems join new thought-leadership program ‘ScoopTalk’ at SMTA International
Publication Date: 9/8/2016

SMTAI 2016 will see the launch of ScoopTalk, an innovative program of roundtable discussions which brings together the biggest players and brightest minds in the industry to debate the industry's hottest subjects. Today ASM Assembly Systems confirmed their participation as a ‘thought-leader’ sponsor with a drive to debate the smart and connected factory.
 
High Acceleration, High Precision, Brushless Linear Motors From Moticont
Publication Date: 9/8/2016

VAN NUYS, CA - The off-the-shelf, LBIM-021 Series of Linear Three-phase Brushless Servo Motors from Moticont are sized to fit a broad range of linear motion applications. These low cost, compact linear motors feature: High acceleration, high speed, high accuracy, high repeatability, and high precision to less than one micron (0.00004 in.).
 
EMS: New Dry Film Negative Photoresist for MEMS and Wafer-Level Packaging
Publication Date: 9/8/2016

DELAWARE, OH - Engineered Material Systems, Inc., a leading global supplier of negative photo resist materials for MEMS and TSV passivation/sealing applications, is pleased to introduce the DF-3520 dry-film negative photo resist for use in micro-electro mechanical systems (MEMS), wafer-level packaging and CMOS applications (TSV sealing). This material formulation has been optimized for hot roll lamination and processing on MEMS and IC wafers.
 
Ersa to Present on Void Reduction in Reflow Soldering during SMTAI
Publication Date: 9/8/2016

PLYMOUTH, WI - Kurtz Ersa North America, a leading supplier of electronics production equipment, is pleased to announce that Viktoria Rawinski, Assistant to the CEO of the Kurtz Ersa Group and head of the Kurtz Ersa Company Museum and the Corporate History Department, will present the paper entitled, “Void Reduction in Reflow Soldering Processes by Sweep Stimulation of PCB Substrate – Process Integration in Industrial Production,” during SMTA International.
Ironwood Electronics: 30 GHz Bandwidth Socket for IDT's FCCSP 98
Publication Date: 9/8/2016

EAGAN, MN - Ironwood Electronics has recently introduced a new high performance BGA socket for 0.5mm pitch BGA 98 pin IC's. The SG-BGA-7295 socket is designed for IDT's flip chip chip scale package (FCCSP) and operates at bandwidths up to 30 GHz with less than 1dB of insertion loss.
 
Quiptech to Show Getech Automation’s Inline Laser Marking System at SMTA Guadalajara
Publication Date: 9/8/2016

SINGAPORE - Getech Automation Pte Ltd., a leader in the PCB automation and depanelling industry, today announced plans to exhibit at the SMTA Guadalajara Expo & Tech Forum, scheduled to take place Oct. 5-6, 2016 at Hotel Riu Guadalajara. Quiptech, Getech’s distributor in Mexico, will have a GLMS Inline Laser Marking machine on display at the show.
 
 
SCS Sr. Medical Market Specialist to Host ‘Conformal Coatings for Tomorrow’s Medical Technologies’ Webinar
Publication Date: 9/8/2016

INDIANAPOLIS, IN - Specialty Coating Systems (SCS) is pleased to announce that Sr. Medical Market Specialist Dick Molin will host a webinar on Wednesday, Sept. 28, 2016. The webinar, entitled, “Conformal Coatings for Tomorrow's Medical Technologies,” will discuss the chemistry and use of Parylene coatings, and how they differentiate themselves across the medical market. Registration for the webinar is now open at SCSwebinars.com.
Samsung ARTIK 5 and ARTIK 10 Dev Kits for IoT | Digi-Key Daily
Publication Date: 9/7/2016

Essemtec: New Compact Pick-and-Place with Linear Motors to be Displayed at SMTA Guadalajara
Publication Date: 9/7/2016

Essemtec, the Swiss manufacturer of production systems for electronic assembly and packaging, today announced plans to exhibit at the SMTA Guadalajara Expo & Tech Forum, scheduled to take place Oct. 5-6, 2016 at Hotel Riu Guadalajara.
 
SMTA China Announces Winners of the 2016 Annual Awards at SMTA China 10th Anniversary Reception
Publication Date: 9/7/2016

 2016 SMTA China Annual Award Winners at the SMTA China 10th Anniversary Reception
SMTA China held its annual awards presentation at the SMTA China 10th Anniversary Reception, which took place on Tuesday, August 30, 2016 at the Shenzhen Convention & Exhibition Center.

Lin Dong, Section Manager, SMT Engineering of Artesyn Embedded Technologies, was named Officer of the Year. Lin Dong has provided great support to the SMTA China Conference for many years, and also is the long-time Conference Chairman of Technology Conference.
Fancort Industries Introduces New Robotic Soldering & Flux Kits
Publication Date: 9/7/2016

CALDWELL, NJ - Fancort Industries, Inc. announces that it now offers new robotic soldering & flux ‘kits’ that allow integrated soldering and flux dispense on a single robot.
 
IPC & SMTA to Host High-Reliability Cleaning & Conformal Coating Conference
Publication Date: 9/7/2016

ROSEMONT, IL - Industry-leading associations IPC and SMTA jointly announce the High-Reliability Cleaning and Conformal Coating Conference, scheduled to take place October 25-27, 2016 at Hyatt Rosemont, Rosemont, IL. The conference is focused on best practices for designing, cleaning and coating highly dense electronic assemblies to assure reliability in today’s mobile society.
KIC’s MB Allen to Present ‘Optimized Reflow Profiling to Minimize Voiding’ during SMTAI
Publication Date: 9/7/2016

SAN DIEGO, CA - KIC today announced that Marybeth (MB) Allen will present “Optimized Reflow Profiling to Minimize Voiding” during SMTA International. The presentation is scheduled to take place during the IPC Session ‘Lead-Free Symposium,’ Session LF2 on Thursday, Sept. 29, 2016 from 11 a.m.-12 p.m.
 
 
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