Wednesday, June 29, 2016
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IPC Announces Results of the IPC Rework Experience Competition at SMT Hybrid Packaging International Exhibition and Conference 2016
Publication Date: 6/15/2016

BANNOCKBURN, IL - The first ever Rework Experience Competition was held at this year’s SMT Hybrid Packaging international exhibition and conference. This competition tested competitor’s skills in reworking a finished printed circuit board. There were seven total competitors and all seven successfully completed the challenge.
OKW Enclosures, Inc: New High Top RAILTEC C DIN Rail Enclosures
Publication Date: 6/15/2016

BRIDGEVILLE, PA - High top RAILTEC C is suitable for applications including automation, building and safety, HVAC, timers, sensors, relays, lighting controls, subrack interfaces, modules, amplifiers and transformers.

Enclosures lock quickly and easily on to TH35 rails. They are available with a closed or an open front (which has easily removable ridges to give stability during transport).
Computrol Triples Its Medium Volume Inspection Capability with Three Koh Young SPI Systems
Publication Date: 6/15/2016

MERIDIAN, ID - Computrol, Inc., a world-class provider of mid- to low-volume, high-mix electronic manufacturing services to OEMs, has purchased three KY-8030-3 in-line, fully automated SPI systems from Koh Young Technology.

Computrol’s medium-volume customers will benefit from the KY-8030’s rugged dependability and all of the benefits of in-line 3D SPI.
BTU Continues Advanced Research in Electronics Assembly
Publication Date: 6/15/2016

NORTH BILLERICA, MA - BTU International, Inc., a leading supplier of advanced thermal processing equipment for the electronics manufacturing and alternative energy markets, has renewed its membership in the Advanced Research in Electronics Assembly (AREA) Consortium, established by Universal Instruments’ Advanced Process Laboratory (APL).
Plasma Etch, Inc. Announces Semicon West Plasma Ashing Demonstrations
Publication Date: 6/15/2016

CARSON CITY, NV - Plasma Etch, Inc., a leader in plasma treatment, will be providing live demonstrations of the company’s popular PE-50 Plasma Asher at SEMICON West. The demonstrations will be performed at booth number 5872.

This is a great opportunity for manufacturers to get their hands on a working PE-50 Plasma Asher. Company representatives will be on hand to answer questions and provide live demonstrations.
Universal Instruments to Distribute Mentor Graphics Production Plan Tool for Fuzion SMT Platforms
Publication Date: 6/13/2016

WILSONVILLE, OR - Mentor Graphics Corporation (NASDAQ: MENT) today announced that Universal Instruments, a global leader of advanced automation and assembly equipment for the electronics manufacturing industry, will offer the Valor® Production Plan tool to users of Universal Instruments’ Fuzion® surface mount technology (SMT) placement platform.
Nordson DAGE Opens Asian Clean Room Demonstration Facility for XM8000 and Bondtester Wafer Metrology Tools
Publication Date: 6/13/2016

AYLESBURY, UK - Nordson DAGE, a division of Nordson Corporation (NASDAQ: NDSN), and the leaders in X-ray inspection and Bondtesting announces the opening of their Asian clean room demonstration facility. Located south of Seoul, Republic of Korea, close to Incheon International Airport and in the heart of South Korea’s technology base, this 102 m2 clean room and conferencing center provides all of their regional customers with access to Nordson DAGE’s award-winning 4800 advanced automated wafer-level bondtester and XM8000 automatic wafer x-ray metrology tool.
Ersa’s Application / Process Engineer to Present Selective Soldering Techniques
Publication Date: 6/13/2016

PLYMOUTH, WI - Kurtz Ersa North America, a leading supplier of electronics production equipment, is pleased to announce that Joseph Clure, Application / Process Engineer, will present at the Advanced Selective Soldering Process Seminar, scheduled to take place Tuesday, June 28th at Kester’s Global Headquarters in Itasca, IL.
SMTA International Program Finalized and Registration Open
Publication Date: 6/13/2016

ROSEMONT, IL - If you want to get the latest research to help you reduce defects and control your processes, look no further than the SMTA International Technical Conference. Choose from four days of session tracks including Advanced Packaging; Flux, Solder, Adhesives; Inspection Technologies; Manufacturing Excellence; as well as the Harsh Enivronments Symposium, Evolving Technologies Summit, and the Lead-Free Soldering Technology Symposium.
2016 Manufacturing Leadership Award Winners Announced
Publication Date: 6/13/2016

Mill-Max Offers Miniature Receptacles for Diverse Applications
Publication Date: 6/13/2016

OYSTER BAY, NY - For applications requiring miniature receptacles, Mill-Max offers four diverse, off-the-shelf products which will fulfill those needs. These receptacles are suitable for use in high density configurations down to 1 mm pitch.
APEM, Inc. Introduces the AV Security Pushbuttons, Suitable for 250VAC
Publication Date: 6/13/2016

VISTA, CA - APEM, Inc., a leading global manufacturer of high quality man-machine interface products, announces that it has launched its three new models in its AV series switches. The AV series is a wide range of vandal-resistant pushbutton switches that offers the same robustness and aesthetics you’ve come to expect from APEM.
Simplimatic Automation Integrates Puck and Conveyor System for Company in Cincinnati
Publication Date: 6/10/2016

FOREST, VA - Material handling and automation company, Simplimatic Automation, joined forces with sister company, Advantage Puck Technologies (APT), to create a highly-flexible material handling solution for a high-mix factory environment in Cincinnati. The Simplimatic system is designed to dramatically increase manufacturing throughput by using Simpli-Flex® conveyor, a powered lift gate, custom controls, and 10,305 custom molded pucks (huggers/carriers) designed and molded by APT.

PI: New Spherical Electro-ceramic Components Designed for 360 Degree Ultrasonic Applications
Publication Date: 6/9/2016

AUBURN, MA - As a leader in piezo transducers, piezo mechanisms, and precision motion control solutions, PI (Physik Instrumente) offers a line of standard and custom electro-ceramic hemispheres and hollow spheres for applications from echolocation (sonar) to flow measurement.
Excelitas Technologies to Display Latest Innovations at Sensors Expo 2016
Publication Date: 6/9/2016

WHO: Excelitas Technologies® Corp., a global technology leader delivering innovative, customized photonic solutions, will display its latest innovations in sensing and detection technology at the 2016 Sensors Expo & Conference in San Jose, CA.
Johannes Rehm is “Manager of the Year 2016”
Publication Date: 6/9/2016

SEISSEN, GERMANY - Who are the top managers in the electronics industry? The readers of the trade journal “Markt & Technik” were given the choice! Already for the second time, they were able to vote for their favourite managing director in the ten categories passive building components, embedded systems, electromechanics, power supplies, SME distribution, communication, sensor technology, SMT equipment, founders/pioneers of electronics and semiconductors.
TT Electronics Announces Seven-Day Standard Lead Times On All Fully Configurable Temperature, Pressure, Level, and Flow Products
Publication Date: 6/9/2016

WEYBRIDGE, UK - TT Electronics, a global provider of engineered electronics for performance critical applications, today announced the availability of seven-day standard lead times on all of its fully configurable temperature, pressure, level, and flow sensing products, offered under its Roxspur Measurement and Control brand.
Innovative QTS Apshen Stencil Foil Adapter Awarded U.S. Patent
Publication Date: 6/9/2016

MEDWAY, MA - The Apshen Stencil Foil Adapter System developed by Quick Tensioning Systems (QTS), for the DEK® VectorGuard® High Tension stencil frame, has been awarded U.S. Patent #9,351,406, it is announced today.

The QTS Apshen was developed to give DEK® VectorGuard™ High Tension stencil frame system users the ability to choose their own or preferred stencil foil provider, according to Thomas G. Erdmann, CEO and developer of the Apshen.
B&K Precision Offers 100 kHz Handheld LCR Meter with Bench Performance
Publication Date: 6/8/2016

YORBA LINDA, CA - B&K Precision today announced the expansion of its current 878B and 879B 40,000-count handheld LCR meters with the addition of a new 100 kHz model, the 880. This new portable LCR meter can measure inductance, capacitance, and resistance with 0.1% basic impedance accuracy.
Teledyne DALSA’s Smart LWIR Imaging Solutions Featured at Eurosatory 2016
Publication Date: 6/8/2016

WATERLOO, ONTARIO - Teledyne DALSA, a global leader in digital image sensing technology, will showcase its shutterless uncooled infrared camera platform, Calibir, in booth J614 at Eurosatory, an international forum focused on the future of Defense and Security, taking place in PARIS, France from June 13-17.
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