Saturday, July 23, 2016
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Digi-Key Daily | Microchip Xpress Dev Board
Publication Date: 7/5/2016

Microchip has moved their well known MPLAB IDE to the cloud as the simplified MPLAB XPress and the MPLAB XPress Development board provides the perfect environment to explore this simplified IDE. With a library of Microchip-validated code to pull from, designers can get a head start on creating a wide range of custom applications. The MPLAB Xpress requires no downloads, software or drivers to get started, and allows users to compile their code in the cloud for free. The development board is based around the 28 pin PIC16F18855 8-bit microcontroller, has all pins broken out, features LEDs, a pushbutton switch, potentiometer and is connected to the computer via USB.
ULT Now Provides Effective and Variable Removal of Odours, Gases and Vapours – with Explosion Protection
Publication Date: 7/5/2016

Loebau, Germany - ULT AG provides its extraction and filtration system the ACD 1200 in various models for a wide range of applications. A variety of filtration packages is available for tasks such as bonding, varnishing, laminating, printing, cleaning or moulding. Dependent upon the extraction capacity required, the unit might feature different vacuum modules.   
Juki Announces SPI to Screen Printer Closed-Loop Package
Publication Date: 7/5/2016

MORRISVILLE, NC - Juki Automation Systems (JAS), Inc., a world-leading provider of automated assembly products and systems and part of Juki Automation Systems Corporation, is pleased to announce its Special SPI to Screen Printer Bundle Closed Loop Package. The package includes the state-of-the-art GL Plus Screen Printer coupled with the CyberOptics SE500-II. The closed-loop package increases first-pass yields by automatically correcting the x-y registration on the screen printer with measurements off of the SPI.

U.S.Tech Publisher’s Choice: July 2016
Publication Date: 7/5/2016

This month, our publisher’s choice is a piece written by Peter van den Eijnden, managing director of JTAG Technologies, on the development of JTAG/boundary-scan from birth to its current success as an alternate test method to in-circuit testing (ICT). He traces the roots of the technology to the mid-1980s and discusses its growth as well as the standards it has been built upon.
Avnet Appoints Steve Gomez New Vice President of Sales in the Americas
Publication Date: 7/5/2016

PHOENIX, AZ —Avnet, Inc. (NYSE: AVT), a leading global technology distributor, today announced the promotion of Steve Gomez to senior vice president of sales, Avnet Electronics Marketing Americas, effective immediately. Most recently, Gomez served as vice president, area director of the West and Latin America areas within the region.
PACE Worldwide Moves to Permanent Corporate Headquarters
Publication Date: 7/5/2016

VASS, NC - PACE Worldwide is pleased to announce the move of our primary manufacturing location in Southern Pines NC to our new home about 5 minutes away in Vass NC. After 9 years of leasing the Southern Pines facility, PACE has decided to purchase a permanent home, which will serve as Corporate Headquarters.
Mycronic Receives Order for an Advanced Prexision-80 Mask Writer
Publication Date: 7/1/2016

TAUBY, SWEDEN - Mycronic AB (publ), has received an order for a Prexision-80 (P-80) mask writer for advanced display applications from a customer in Asia. The system is scheduled to be delivered around year-end 2017.

Mycronic offers mask writers for manufacturing of photomasks within different fields of application. These areas are display manufacturing (for TV, smart phones and tablets among other things) and applications within the multi-purpose market.
Successful ASM Roadshow in Manaus
Publication Date: 7/1/2016

MANAUS, BRAZIL - ASM Assembly Systems with their Partners Easy have just completed another roadshow in Manaus, Brazil. The event was hosted in the facility of EASY, an ASM partner in the city of Manaus. EASY and ASM provide sales, service, applications and spare parts support from this building for SIPLACE and DEK customers in the Manaus area.
Ventec International Group announces ISO 9001:2015 certification for its German Facility
Publication Date: 7/1/2016

KIRCHHEIMBOLANDEN, GERMANY - Ventec International Group, a world leader in the production of polyimide & high reliability epoxy laminates and prepregs, is proud to announce that its Central European facility located in Kirchheimbolanden, Germany has received certification under the ISO 9001:2015 quality management standard.
Mercury Systems Receives $7.9M Order for Integrated Microwave Assemblies for Unmanned Airborne Electronic Warfare Jamming Application
Publication Date: 7/1/2016

CHELMSFORD, MA - Mercury Systems, Inc. (NASDAQ:MRCY) (, announced it received a $7.9 million follow-on order from a leading defense prime contractor for integrated microwave assemblies (IMAs) for an unmanned electronic warfare (EW) jamming application. The order was booked in the Company’s fiscal 2016 fourth quarter and is expected to be shipped over the next several quarters.
Avnet Receives Semiconductor Distributor of the Year Award from Vishay
Publication Date: 6/30/2016

PHOENIX, AZ - Avnet, Inc. (NYSE: AVT), a leading global technology distributor, recently received the Distributor of the Year for Semiconductor Products in the Americas from Vishay Intertechnology, Inc. The award was based on sales records for the fiscal year ending March 31. This is the second time in five years that Avnet’s superior sales performance has earned it Distributor of the Year honors from Vishay.
Sono-Tek Corporation to Introduce Game-Changing Photoresist Ultrasonic Coating System at SEMICON West
Publication Date: 6/30/2016

MILTON, NY - Sono-Tek Corporation (OTC BB: SOTK) today announced plans to unveil a new photoresist ultrasonic coating system in Booth #2146 at SEMICON West, scheduled to take place July 12-14th at the Moscone Center in San Francisco, CA. The new photoresist coating system, SPT200, has been designed specifically to meet the unique challenges of coating high aspect ratios and deep well topographies such as MEMS wafers with photoresist.
Henkel’s High Compliance GAP PAD HC 5.0 Provides Excellent Thermal Management Performance for Applications with Increased Power Densities
Publication Date: 6/30/2016

IRVINE, CA - Henkel Adhesive Technologies’ Electronics business has developed and launched the latest product in its line of award-winning GAP PAD thermal interface materials (TIMs). The new GAP PAD HC 5.0 is designed to manage the heat generated by today’s reduced form factor, high power density components.
Juki Offers 3600 7" Reel Storage Capacity
Publication Date: 6/30/2016

MORRISVILLE, NC - Juki Automation Systems (JAS), Inc., a world-leading provider of automated assembly products and systems and part of Juki Automation Systems Corporation, is pleased to announce that its ISM UltraFlex 3600 Intelligent Storage System provides automatic kitting for the next run on placement machines.
Temperature & Humidity Logging Is Now Available on Seika’s McDry Cabinets
Publication Date: 6/30/2016

TORRANCE, CA - Seika Machinery, Inc., a leading provider of advanced machinery, materials and engineering services, today announced that Dickson Data’s TM325 Display Temperature & Humidity Logger is now available for all McDry cabinets.
SHENMAO Exhibits at SEMICON WEST: Introduces BGA and Micro BGA Solder Spheres
Publication Date: 6/30/2016

SAN JOSE, CA - SHENMAO BGA Solder Spheres for PBGA, CBGA, TBGA, CSP and Flip Chip Assemblies are made by UMT (Ultra Micron Technology) from highly pure metals produced to various exact Alloy compositions using Piezoelectric Droplet Jet Technology in high volumes to accurate diameter uniformity, bright shiny surface finishes and high quality sphericity.
IPC Releases PCB Industry Results for May 2016
Publication Date: 6/29/2016

BANNOCKBURN, IL - IPC — Association Connecting Electronics Industries® announced today the May 2016 findings from its monthly North American Printed Circuit Board (PCB) Statistical Program. Sales and orders in May continued ahead of last year’s levels, but at slower rates than in recent month. The book-to-bill ratio also declined slightly but remains positive at 1.01.
CyberOptics Introduces Large Particle Sensing Functionality in Next-Generation WaferSense and ReticleSense Airborne Particle Sensors
Publication Date: 6/29/2016

Minneapolis, MN - CyberOptics® Corporation (NASDAQ: CYBE), a leading global developer and manufacturer of high precision 3D sensing technology solutions, announces it will showcase its next-generation Advanced Airborne Particle Sensors, that incorporate large particle sensing capability. Both the WaferSense® and ReticleSense® Airborne Particle Sensors (APS2, APSR and APSRQ) will be able to measure small and large particles.
Wuerth Elektronik eiSos Opens Ultramodern Logistics Centre
Publication Date: 6/29/2016

 Inauguration of the new logistics center of Würth Elektronik eiSos in Waldenburg, Germany.
WALDENBURG, GERMANY - June 28, 2016 saw the opening of the extension of the Würth Elektronik eiSos GmbH & Co. KG company’s logistics centre. Attended by representatives from politics and commerce and from the Würth Group, the manufacturer of electronic and electromechanical components celebrated the completion of a major project, which doubles the company’s warehouse capacities. 14,000 different items will now be directly available ex stocks, and state-of-the-art technology now makes it possible for 4,000 picks to be made each day.
Henkel Launches Adhesives Recycling Program
Publication Date: 6/29/2016

TRENTON, NJ - Henkel, a leading manufacturer of adhesives, sealants and functional coatings, including the Loctite® brand, is partnering with TerraCycle to become the first company to offer a recycling solution for anaerobic adhesives. Through the Adhesive Recycling Program, Henkel customers can purchase a postage-paid recycling box that they fill with empty Loctite adhesive containers and send to TerraCycle for processing.
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