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PI: Fast, Extremely Stable, Quiet- Compact Linear Positioning Stage driven by Ultrasonic Piezo Linear Motor
Publication Date: 5/12/2016

AUBURN, MA - Ultrasonic piezomotors are small and provide motion with high resolution, as well as an extremely wide dynamic range from microns/second to 100’s of millimeters/second.
Fernando Gomez Returns To Cascade Systems Technology as President
Publication Date: 5/12/2016

HILLSBORO, OR - A familiar face has returned to Cascade Systems Technology (CST), the premier contract manufacturing company in Oregon. Cascade welcomes back Fernando Gomez as Company President, where he previously served as Operations Manager. Gomez was attracted back because of staff dedication, commitment of Senior Leadership to employees and customers, and enjoyment of finding innovative solutions.
Built-in Laser Pointer now an Option for Optilia M Series Inspection Systems
Publication Date: 5/12/2016

SOLLENTUNA, SWEDEN - Integral Laser Pointers are now an available option on economical M Series inspection systems, Optilia Instruments announced today. Although Optilia has always included integral laser pointers as a standard feature of the high end W Series, due to customer demand, the optional feature is now available for the M Series as well.
Sonics Announces new Packaging Technology Manager
Publication Date: 5/12/2016

NEWTON, CT - Sonics & Materials, Inc. is pleased to announce that Bill Aurand is their new Packaging Technology Manager, expanding the company’s commitment to the flexible packaging market, with a focus on the development of innovative technologies and equipment designed specifically for the packaging industry.
U.S.Tech Publisher’s Choice: May 2016
Publication Date: 5/11/2016

For this month’s Publisher’s Choice, we’ve chosen to highlight an article by Jonathan Knotts, Brian Violette and Daniel Morgan of Creative Materials, Inc., entitled “Compliance: A Tough Approach to Replacing Conventional SMT Adhesives”. In the article, they discuss alternative, compliant, high-strength materials that can be used in place of traditional adhesives. These include liquid and paste processes, as well as electrically conductive adhesives (ECAs), which have much to offer when used instead of the usual solder attachments.
IEWC Announces Paul Sullivan As Senior Vice President, North American Sales
Publication Date: 5/11/2016

MILWAUKEE, WI - IEWC is pleased to announce the appointment of Paul Sullivan as Senior Vice President, North American Sales. With over 40 years of progressive sales experience, Paul brings a wealth of commercial knowledge and business acumen to the role that will help ensure a successful future for IEWC.
Alpha Assembly Solutions to Showcase Environmental Friendly PV Soldering Materials at SNEC PV Power Expo in Shanghai
Publication Date: 5/11/2016

SOMERSET, NJ - Alpha Assembly Solutions, the world leader in the development of non-hazardous solder and electronic assembly materials for photovoltaic manufacturing and assembly, plans to showcase their vast product offering at the SNEC PV Power Expo taking place May 24th – 26th in Shanghai, China.
SEMICON West Expands to Take on the Extended Supply Chain Forum
Publication Date: 5/11/2016

SAN JOSE, CA - To meet the changing needs of today’s increasingly interconnected supply chain, SEMICON West has added eight vertically integrated forums to its 2016 lineup. The forums are designed to connect communities of interest, enabling business and technical professionals to collaborate and identify new opportunities. Forums feature technical experts, analysts, and leaders from many of the biggest names in electronics, including Cisco, Intel, and Samsung. To pre-register for SEMICON West, visit www.semiconwest.org by June 3 and save.
Melexis Leads New Wave of TPMS Innovation with World’s Smallest & Lowest Power Sensor Device
Publication Date: 5/11/2016

TESSENDERLO, BELGIUM - Melexis, a global microelectronics engineering company, continues to make major advances in tire pressure monitoring system (TPMS) technology with the introduction of its 3rd generation TPMS IC - the MLX91804.
SunEdison Semiconductor Reports First Quarter 2016 Results
Publication Date: 5/11/2016

ST. PETERS, MO - SunEdison Semiconductor Limited (NASDAQ:SEMI) ("SunEdison Semiconductor" or the “Company”) today reported financial results for the first quarter ended March 31, 2016.

All Flex Hires Industry Expert Glenn Menear
Publication Date: 5/11/2016

NORTHFIELD, MN - All Flex, manufacturer of flexible printed circuits and flexible heaters, has hired Glenn Menear to join the applications engineering sales team. Menear has been in the flexible circuit industry in for nearly four decades and is a recognized expert with extensive technical knowledge. As a program manager he will promote All Flex capabilities and provide engineering applications support within the seasoned team of engineers in the sales department.
Würth Elektronik eiSos expands its WR-TBL terminal block product family
Publication Date: 5/11/2016

Waldenburg,Germany – Würth Elektronik eiSos is launching a series of new ter-minal blocks. The WR-TBL termi-nal blocks incorporate a special feature that uses the insulation-displacement technique so that the cables no longer need be stripped.

Mentor Graphics Valor Production Plan Tool Achieves SAP Certification as Powered by SAP NetWeaver
Publication Date: 5/11/2016

WILSONVILLE, OR — Mentor Graphics Corporation (NASDAQ: MENT) today announced that its Valor® Production Plan software has been certified by SAP as powered by the SAP® NetWeaver® technology platform. The integration of the Valor Production Plan tool with SAP NetWeaver streamlines PCB assembly planning, including surface mount technology (SMT), manual assembly and test, helping to improve manufacturing efficiency and reduce operational cost. The Valor Production Plan solution can add finite printed circuit board (PCB) production planning to the SAP® ERP application.
Vitronics Soltec Receives Awards from SMTA China for Centurion Reflow Soldering Platform and Selective Soldering Technology
Publication Date: 5/10/2016

OOSTERHOUT, THE NETHERLANDS - ITW EAE’s Vitronics Soltec received recognition for the SMTA China Best Exhibit Technology which featured the new Centurion reflow oven. This award recognizes NEPCON exhibitors who display outstanding equipment. Vitronics Soltec was also honored by SMTA for the most Outstanding Paper of the TC1 Technology Conference.
 
New Cicoil Flat Cables Website
Publication Date: 5/10/2016

VALENCIA, CA - Cicoil, the leading manufacturer of Flexible Flat Cables and Assemblies, is pleased to announce its New Website, featuring the company's entire product catalog, complete with part number and keyword searches for all 750+ standard bulk cables and fully terminated cable assemblies.
 
Count On Tools, Inc. Introduces the MYDATA Agilis Feeder Repair Set
Publication Date: 5/10/2016

GAINESVILLE, GA - Count On Tools, Inc. (COT), a leading provider of precision components and SMT spare parts, introduces the new MYDATA Agilis Feeder Repair Set. This option allows customers to convert any Agilis feeder to any of the four sizes to reduce overall feeder count and maximize production capabilities.
WACKER Presents New Gap Filler for Electronics Applications
Publication Date: 5/10/2016

 
 The heat-conducting SEMICOSIL 961TC silicone filler from WACKER is applied directly to the heat sink. (Photo: Wacker Chemie AG)
MUNICH, GERMANY - WACKER, the Munich-based chemical company, will showcase a new heat-conducting silicone-based gap filler material for the electronics industry at the Power Conversion and Intelligent Motion electronics tradeshow PCIM Europe. Available under the tradename SEMICOSIL® 961 TC, the silicone rubber is ideal as an interface material for thermally connecting electronic circuits, ensuring effective heat management.
Avnet Expands IoT Solutions’ Portfolio with New LSR Wireless Shield and TiWiConnect Reference Design
Publication Date: 5/10/2016

PHOENIX, AZ - Avnet, Inc. (NYSE: AVT), a leading global technology distributor, today introduced the new LSR Wireless Shield, a low-cost platform with customizable sensor/peripheral capabilities for the prototyping of wireless connected Internet of Things (IoT) products using SmartFusion™2 system-on-chip (SoC) field programmable gate arrays (FPGAs) from Microsemi Corporation (Nasdaq: MSCC).
ASTEELFLASH MEXICO RECEIVES AUTOMOTIVE ISO/TS 16949 CERTIFICATION
Publication Date: 5/9/2016

PARIS, France – Asteelflash Mexico, subsidiary of Asteelflash Group - the 17th global Electronic Manufacturing Services(EMS) provider - received the industry specific automotive certification ISO/TS16949 on April 28th.
 
This achievement insures that Asteelflash Mexico design, development, manufacturing and testing processes meet the highest standards of excellence in the automotive industry.
 
Engineered Material Systems to Showcase Adhesives for Stringing and Shingling Next Generation Solar Modules at Intersolar/EU PVSEC
Publication Date: 5/9/2016

DELAWARE, OH - Engineered Material Systems, Inc. (EMS), a leading global supplier of conductive interconnect materials for photovoltaic applications, will exhibit its new 561-400 series Low-Cost Snap Cure Conductive Adhesives at the Intersolar/EU PVSEC show, scheduled to take place June 23-25, 2016 in Munich.
 
 
 
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