Monday, February 27, 2017
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The New Metcal Connection Validation™ Receives a 2017 NPI Award
Publication Date: 2/15/2017

CYPRESS, CA - Metcal announces that it has been awarded a 2017 NPI Award in the category of Soldering – Hand Tools for its CV-5200 Connection Validation™ Soldering Station, as selected by an independent panel of practicing industry engineers.
 
Mirtec Wins Prestigious 2017 Service Excellence Award For Test & Inspection
Publication Date: 2/15/2017

OXFORD, CT - MIRTEC, “The Global Leader in Inspection Technology,” announces that it received the prestigious 2017 Service Excellence Award (SEA) from Circuits Assembly magazine in the Test and Inspection category.
 
KYZEN Is Two for Two with the 2017 NPI Awards for the ANALYST™ and DS3522 DuoSolvent™
Publication Date: 2/15/2017

NASHVILLE, TN - KYZEN today announced that it received two 2017 NPI Awards. The company was awarded in the category of Process Control Tools for the new ANALYST™ Real-Time Concentration Monitoring & Reporting System, and Cleaning Materials for the KYZEN® DS3522 DuoSolvent™ Cleaning Agent.
 
Würth Elektronik eiSos Presents the WE-CMB HV Power Line Choke
Publication Date: 2/15/2017

WALDENBURG, GERMANY - A rated voltage three times higher than the voltage of the existing family of WE-CMB chokes – this is the outstanding feature of the current-compensated power line chokes of the WE-CMB HV series offered by Würth Elektronik eiSos.
 
Breaking News: Bill Astle Promoted to President of Juki
Publication Date: 2/14/2017

MORRISVILLE, NC - Juki Corporation (Tama Center – Tokyo, Japan) and Juki Automation Systems (Morrisville, NC) are pleased to announce that William D. (Bill) Astle has been promoted to President of Juki Automation Systems, Inc. effective immediately. Bill has been serving as General Manager of JAS for the last three years. Robert J Black, Jr., former President and CEO, will remain with the company as CEO.
Phoenix Contact Achieves Traceability Success with Mentor Graphics Valor IoT Manufacturing Solution
Publication Date: 2/14/2017

WILSONVILLE, OR - Mentor Graphics Corporation today announced that Phoenix Contact, the German-based market leader of device connectors, electronic components and industrial automation technologies, has adopted the Mentor Graphics® Valor IoT Manufacturing solution for factory automation.
 
EMS Specialist Ryder Industries Receives ISO 16949 Certification at Xinfeng Plant
Publication Date: 2/14/2017

MANTECA, CA - Ryder Industries Ltd, a Swiss-owned pure EMS company with two manufacturing plants in China and a hub in Hong Kong, has announced that it has been successful in obtaining ISO 16949 certification.
 
Indium Corporation Names Nash as Product Manager – PCB Solder Paste
Publication Date: 2/14/2017

CLINTON, NY - Indium Corporation has named Chris Nash as Product Manager for PCB Assembly Materials.

Nash is responsible for managing new solder paste product development, including strategy guidance and execution, directed to sales to the printed circuit board industry.
 
Curtiss-Wright Acquires Para Tech Coating
Publication Date: 2/14/2017

PARAMUS, N.J. - Curtiss-Wright’s Surface Technologies (CWST) division announced today that it has completed the acquisition of the net assets of Para Tech Coating, Inc. (“Para Tech”).
 
BTU’s Fred Dimock Announces Participation in “Making Reflow Ovens Smart” Panel Session at APEX
Publication Date: 2/14/2017

NORTH BILLERICA, MA - BTU International, Inc., a leading supplier of advanced thermal processing equipment for the electronics manufacturing and alternative energy markets, is pleased to announce that Fred Dimock, Manager of Process Technology, will participate in a reflow panel during the IPC APEX EXPO.
 
Nordson ASYMTEK's Redesigned EasyCoat 6 Conformal Coating Software Delivers a Rich Feature Set and Simplifies Programming
Publication Date: 2/13/2017

CARLSBAD, CA - Nordson ASYMTEK, a Nordson company, introduces its upgraded EasyCoat® 6 software for its Select Coat® SL-940 conformal coating system.
 
KYZEN to Launch the New Industry 4.0 Enabled KYZEN ANALYST™ at productronica China
Publication Date: 2/13/2017

NASHVILLE, TN - KYZEN today announced plans to introduce the new KYZEN ANALYST™ in Stand E3-3200 at productronica China, scheduled to take place March 14-16, 2017 at the Shanghai New International Expo Centre.
Digi-Key: Infineon DPS310 Digital Barometric Pressure Sensors
Publication Date: 2/13/2017

Metcal Introduces the Next Big Step in Process Control: Connection Validation™
Publication Date: 2/13/2017

CYPRESS, CA - Metcal’s CV-5200 Connection Validation™ Soldering Station provides real-time closed loop feedback on intermetallic compound formation— the world’s first. Plus, a new communication port enables process traceability and firmware upgrades.
Machine Vision Products to demonstrate Flexible AOI Solutions and advanced software products at IPC APEX EXPO 2017
Publication Date: 2/13/2017

CARLSBAD, CA - Machine Vision Products (MVP), a leader in Automated Optical Inspection will be demonstrating AOI solutions for SMT and Microelectronics, 3D AOI and advanced software products at IPC APEX EXPO 2017 at the San Diego Convention Center from February 14 to 16. MVP is exhibiting at Booth #2509.
Koh Young Technology Exhibiting 'True 3D Powered by Intelligent Platform for Smart Factory' at APEX 2017
Publication Date: 2/9/2017

SEOUL, KOREA - Koh Young Technology will exhibit its world-leading 3D AOI and SPI solutions with the new theme ‘True 3D now powered by Intelligent Platform for Smart Factory’ in Booth #801 at IPC/APEX next week in San Diego, California, USA.
PI: Miniature Linear Positioning Stage for Single and Multi-Axis Applications
Publication Date: 2/9/2017

AUBURN, MA - The L-402 compact linear stage is the newest addition to the suite of motion control solutions available from precision positioning systems industry leader PI (Physik Instrumente).
 
TopLine Offers Bonding Wire for Universities, Labs, Small-volume Users
Publication Date: 2/9/2017

IRVINE, CA - TopLine, a leading designer and manufacturer of semiconductor packages and PCB assemblies, has started a new service that makes it much easier for Universities, research facilities, laboratories, and small-volume users to obtain bonding wire manufactured by Tanaka, www.TanakaWire.com.
 
U.S. Tech Publisher's Choice: February 2017
Publication Date: 2/9/2017

Our U.S. Tech Publisher's Choice article this month is a piece by Manual Schwarzenbolz, product manager at Rehm Thermal Systems, on recent advances in the field of electronics conformal coating. In the article, entitled "Using Conformal Coating to Protect Sensitive Electronics," Schwarzenbolz discusses utilizing automated conformal coating systems to replace time-consuming manual processes.
 
Indium Corporation Expert to Present at EPP InnovationsFORUM, Germany
Publication Date: 2/9/2017

CLINTON, NY - Indium Corporation’s Andreas Karch, Regional Technical Manager for Germany, Austria and Switzerland, will present at the EPP InnovationsFORUM on March 9 in Böblingen, Germany.


 
 
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