Thursday, January 19, 2017
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New Vishay Semiconductor Hybrid SSRs Distributed Through New Yorker Electronics
Publication Date: 1/6/2017

NORTHVALE, NJ – New Yorker Electronics is now distributing the Vishay Semiconductor Hybrid Solid-State Relays (SSRs) in the new VOR1121A6, VOR1121B6, VOR2121A8 and VOR2121B8 relay models. Vishay’s newest additions to its VOR family of hybrid SSRs are designed to deliver superior electrical characteristics for telecommunications, industrial, security system and metering applications. Compared to similar solutions, the new Vishay Semiconductors 1 Form A VORs provide faster operation with TON 0.20ms and TOFF 0.03ms, a wide temperature range of -40°C to +100°C and a higher load voltage of 250V.
Live Report from Philip Stoten: 2017 CES Opens in Las Vegas
Publication Date: 1/5/2017

Philip Stoten reports from the floor at the opening of the 50th anniversary CES in Las Vegas. Phil highlights some of the more interesting technology start-ups exhibiting this year.
EMS: New Dry Film Negative Photoresist for MEMS and Wafer-Level Packaging
Publication Date: 1/5/2017

DELAWARE, OH - Engineered Material Systems, Inc., a leading global supplier of negative photoresist materials for MEMS and TSV passivation/sealing applications, is pleased to introduce the DF-3560 dry-film negative photoresist for use in micro-electro mechanical systems (MEMS), wafer-level packaging and CMOS applications (TSV sealing). This material formulation has been optimized for hot roll lamination and processing on MEMS and IC wafers.
Guylaine Guerette Joins MicroCare
Publication Date: 1/5/2017

NEW BRITAIN, CT - MicroCare is pleased to announce that Ms. Guylaine Guerette has joined the MicroCare management team in the newly created position of Senior Marketing Manager.

Ms. Guerette has spent eighteen years in marketing at Brady Corporation (Branford, CT). At that company, she managed multi-channel marketing programs and led the deployment of sophisticated marketing campaigns for various Brady Workplace Safety sub-brands.
Universal Instruments and Cogiscan join forces to provide Factory-Wide Traceability & Connectivity
Publication Date: 1/5/2017

BROMONT, CANADA - Cogiscan Inc., the leading Track, Trace and Control (TTC) solutions provider for the electronics manufacturing industry, announced that it was chosen by Universal Instruments to support traceability and connectivity requirements for one of its major customers.
New representative for Rehm Thermal Systems
Publication Date: 1/5/2017

BLAUBEUREN, GERMANY - Exmore is taking care of Rehm products in Belgium, the Netherlands and Luxemburg as of 1st January 2017. With Exmore, our customers in the Benelux have immediately a direct contact person in all matters relating to sales, service or spare parts management of the complete product portfolio of Rehm.
Ironwood Electronics: 75GHz Clamshell Socket for NXP's BGA141
Publication Date: 1/5/2017

EAGAN, MN - Ironwood Electronics has recently introduced a new BGA socket design using high performance elastomer capable of 75GHz, very low inductance and wide temperature applications. The GT-BGA-2061 socket is designed for 10x10 mm package size and operates at bandwidths up to 75GHz with less than 1dB of insertion loss.
Bosch Connected Devices and Solutions showcases sensor solutions for connected mobility, Industry 4.0 and logistics
Publication Date: 1/5/2017

REUTLINGEN, GERMANY - Bosch Connected Devices and Solutions showcases three innovative sensor-based solutions at the 2017 International CES in Las Vegas, USA. The devices help improve comfort, convenience and accountability, and new extension boards simplify the development of Internet of Things (IoT) applications.
FLIR Launches Five New Thermal Cameras at CES 2017: Third Generation FLIR ONEs, FLIR Duo Thermal/Visible Drone Cameras, and FLIR C3 Rugged Pro Camera
Publication Date: 1/4/2017

WILSONVILLE, OR - FLIR Systems, Inc. announced today the launch of five new thermal imaging cameras at the 2017 Consumer Electronics Show (CES), including two new third generation FLIR ONE thermal camera attachments for smartphones, two new dual sensor thermal cameras for drones, and a ruggedized compact thermal camera for home and building inspectors. All five products feature FLIR Lepton®, FLIR’s revolutionary thermal microcamera core, and FLIR’s patented multispectral dynamic imaging (MSX®) technology, which dramatically improves image quality and readability by dynamically embossing high-fidelity, visible-light details onto the thermal imagery.
Akrometrix Announces First Shipment of FOWLP Panel Warpage Metrology System
Publication Date: 1/4/2017

ATLANTA, GA - Akrometrix, LLC, the leading provider of thermal warpage and strain metrology equipment to both the front- and back-end semiconductor and electronics industries, today announced the shipment of its first warpage metrology system specifically designed for FOWLP Panel applications – the AKM600P – to a key customer in Asia.
Nathan Trotter & Co. Acquires LOCTITE® Solder Bar Division of Henkel Electronics
Publication Date: 1/4/2017

Coatesville, PA Nathan Trotter & Co. Inc. has acquired the LOCTITE® solder bar division of Henkel Electronics. Prior to the acquisition, Nathan Trotter produced all LOCTITE® solder bar sold in North America on behalf of Henkel Electronics. Effective immediately, LOCTITE® solder bar will be produced and sold under the Nathan Trotter name.  Nathan Trotter has partnered with E-Tronix ( as the master representative to facilitate the transition. 
DKL Metals Celebrates 30 Years Of Solder Manufacture in the UK
Publication Date: 1/3/2017

WEST LOTHIAN, SCOTLAND - DKL Metals Ltd., the largest UK solder manufacturer in electronics, is pleased to announce the company’s 30-year anniversary. As the UK’s foremost producer of lead-free solders and tin-lead alloys for the European industry, DKL produces ultra-pure solder alloys for the electronics assembly and HASL industry.

Colin Longworth, Managing Director commented, “We are proud to have served the electronics industry in the U.K. and Ireland for last 30 years and look forward to another 30 working together, developing new products to suit the ever-changing requirements of the electronics industry.”

Eplan Harness proD 2.6: New tools and convenience,from design to manufacturing
Publication Date: 1/3/2017

SCHAUMBURG, GERMANY - The new EPLAN Harness proD version 2.6is intuitive 3D/2D software that covers all of today´s requirements for convenient, high quality wiring and wire harness engineering. New features include enhanced automaticwire dimensioning andintuitive routing of wires with predefined lengths. Open interfaces allow for true collaboration between mechanical and electrical engineering.
Mouser Electronics Named Distributor of the Year EMEA Catalog Partner by Bourns
Publication Date: 1/3/2017

RIVERSIDE, CA - Mouser Electronics, Inc. has been named as Distributor of the Year (Catalog Partner) in EMEA by Bourns, Inc., a leading manufacturer and supplier of electronic components. The award recognizes Mouser’s outstanding contributions from January 2015 to June 2016 as one of Bourns’ leading distributors, contributing to outstanding percentage of sales (POS) growth of the company’s business in Europe.
KIC Celebrates 40 Years of Helping Manufacturers Improve Quality & Reduce Costs Through Thermal Process Optimization
Publication Date: 1/3/2017

SAN DIEGO, CA - KIC today announces its 40th year anniversary in the thermal processing business, helping manufacturers improve quality while reducing costs. A key to KIC’s success is the ability to provide value to its customers by giving them real-time and historic thermal process data that allows the manufacturer to make better decisions, faster.

Keystone Electronics: New Quick and Reliable “i-Clamp” IDC Wire Connectors
Publication Date: 1/3/2017

ASTORIA, NY - “i-Clamp” Insulation Displacement Connectors (IDC) for wire connectivity are the latest additions to Keystone Electronics full line of interconnect components and electronic hardware.

These new devices provide a tamper proof, quick and reliable method for wire connections without stripping wires. The “i-Clamp” IDCs cleanly pierce the wire insulation and make a secure connection in one easy step.
Virtual Industries Announces 30 Years as a Leading Supplier of Manual Vacuum Handling Solutions
Publication Date: 1/3/2017

COLORADO SPRINGS, CO - Virtual Industries Inc. today announced its 30th year as a leading supplier of manual vacuum handling solutions to the world’s high technology firms.

The company’s patented ESD-safe products are used by CLASS I cleanroom personnel, electronic assemblers, semiconductor manufacturers, Universities and scientists around the world. Virtual Industries develops innovative, ergonomic, manual vacuum tweezers and pick-up tips based on customer feedback.
Indium Corporation VP of Technology Elevated to IEEE Fellow
Publication Date: 1/3/2017

CLINTON, NY - Indium Corporation’s Dr. Ning-Cheng Lee, Vice President of Technology, has been bestowed the prestigious title of Fellow of the Institute of Electrical & Electronics Engineers (IEEE) for his leadership in surface mount technology and interconnect materials.

IEEE is the world’s largest technical professional association with more than 400,000 members in 160 countries.
CalcuQuote to Exhibit RFQ Risk Assessment Module at IPC APEX Expo 2017
Publication Date: 12/29/2016

DALLAS, TX - CalcuQuote will exhibit at IPC APEX Expo in San Diego from February 14-16, 2017. The request for quote (RFQ) management system for Electronics Manufacturing Services (EMS) industry will highlight its quote risk assessment for contract manufacturers (CM). This feature enables manufacturers doing printed circuit board assemblies (PCBA) to evaluate and record risk items related to financial, quality, capacity and other criteria.
LPKF: Laser Solutions for the Medical Device Industry at MD&M West
Publication Date: 12/28/2016

TUALATIN, OR - LPKF Laser & Electronics has announced it will exhibit at the 2017 MD&M West Exposition, which takes place February 7-9 at the Anaheim Convention Center in Anaheim, Calif. LPKF, a manufacturer of laser systems for a variety of applications, will showcase its solutions for the medical device industry in booth 1650.
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