Saturday, October 22, 2016
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WACKER Expands US-based Research and Development Capacities for Silicones
Publication Date: 10/7/2016

 WACKER’s US subsidiary Wacker Chemical Corporation runs a technical center as part of its offices and manufacturing facility at its headquarters located in Adrian, Michigan. The company will expand its research capacities by establishing additional R&D labs in Ann Arbor, MI.
(Photo: WACKER)
Munich, Germany / Adrian, MI – WACKER, the Munich based chemical company, is expanding its research and development facilities for silicones by establishing a new R&D center located in Ann Arbor, MI, USA. The facility is dedicated to support WACKER’s overall business and product development in the North, Central and South America regions. In a first phase, the Group is investing a single digit million US-dollar figure mainly
for equipment and installation of the labs. The facility will officially open in the first half of 2017.
IBL Technologies Offers Special Pricing on SLC509 Vapor Phase Soldering Demo Units
Publication Date: 10/7/2016

BURNSVILLE, MN ― IBL Technologies, LLC today announced a special offer on its SLC509 demo units. A limited quantity of reflow vapor phase soldering systems are available for a low price of $49,950.00 through December 31, 2016 (or while supplies last). The demo units have less than 20 hours of operation.

Live Webinar: QFN: Design - Cleaning – Reliability
Publication Date: 10/6/2016

NASHVILLE, TN KYZEN is pleased to announce that Dr. Mike Bixenman and a panel of experts will participate in an informative webinar on Thursday, Oct. 13, 2016. The webinar, entitled, “QFN: Design - Cleaning - Reliability: What you can't see can cause failure!” will be hosted by Global SMT & Packaging Magazine. 

Augmented reality app brings display to life
Publication Date: 10/6/2016

Gilching, Germany - ELECTRONIC ASSEMBLY is using augmented reality (AR) to bring its new uniTFT display module to the attention of potential users. The free app provides an unprecedented means of displaying in-depth information on what is probably the most innovative display module in the world. It is based on the print advert that is to appear as part of an advertising campaign across a large range of media for the uniTFT but is also available for downloading on the website.

Successful Technology Day hosted by Rehm Thermal Systems
Publication Date: 10/6/2016

 Workshops in the manufacturing hall
Blaubeuren, Germany - “Manufacturing in the age of digital transformation” was the theme of this year’s Technology Day on 29 September 2016 at Rehm Thermal Systems. With almost 150 guests, including regional and international clients, distributors and partner firms, the event was a resounding success. In presentations, interesting workshop sessions and at info points, Rehm took visitors on a journey through the manufacturing of tomorrow and presented the latest in innovative plant technology and the latest software tools.
Nordson ASYMTEK Receives 2016 Global Technology Award for the IntelliJet Jet Dispensing System
Publication Date: 10/6/2016

 Joe Stockunas, vice president, Advanced Technology, Nordson Corporation, accepts award
Carlsbad, CA, - Nordson ASYMTEK, a Nordson company, the global leader in dispensing, jetting, and coating equipment and technologies, has been honored with the 2016 Global Technology Award in the dispensing category for its IntelliJet® Jetting System that is used for electronics manufacturing processes. The award was presented at the SMTA International conference in Rosemont, Illinois, on September 27, 2016.
Indium Corporation Details the Versatility of Indium Alloys
Publication Date: 10/5/2016

Clinton, NY - Indium Corporation's newest informational video provides an overview of the versatility of indium when alloyed with other metals. 

This brief video, which can be found at, features Indium Corporation’s Indium and Bismuth Product Manager Carol Gowans as she explains how vast temperature ranges enable indium and indium alloys to be used for many diverse applications. 

Nordson DAGE Receives a Global Technology Award for Inspection – X-ray
Publication Date: 10/5/2016

Aylesbury, Buckinghamshire, UK — Nordson DAGE, a division of Nordson Corporation, announces that it was awarded a 2016 Global Technology Award in the category of Inspection – X-ray for its Quadra™ 7. The award, sponsored by Global SMT and Packaging Magazine, was presented to Joseph Stockunas, Vice President, Advanced Technology, Nordson Corporation during a Tuesday, Sept. 27, 2016 ceremony that took place at the Donald Stephens Convention Center in Rosemont, IL during SMTA International.

PI's New High-Speed, NanoCube 3-Axis Piezo Motion Stage
Publication Date: 10/5/2016

Auburn, MA – The new P-616 NanoCube® XYZ piezo scanner is a redesign of PI’s successful P-611, 3D positioning stage. Now based on a parallel-kinematic design, with only one lightweight moving platform for all 3 axes, higher precision and dynamics are available in a more compact package. As the newest miniature multi-axis stage from PI, the P-616 NanoCube is also the smallest and lightest system with capacitive feedback delivering 100µm travel range.


TRI Receives 2016 Global Technology Award for TR5001 SII ICT
Publication Date: 10/5/2016

Taipei, Taiwan - Test Research, Inc. (TRI), a leading test and inspection system provider for the SMT industry announces that the company’s new generation ICT tester, TR5001 SII Series, received a 2016 Global Technology Award at a ceremony held during the 2016 SMTA International show in Rosemont, IL.
Inaugural ‘ScoopTalk’ Takes Event Video to the Next Level
Publication Date: 10/5/2016

ROSEMONT, IL - Last week at SMTAI in Chicago, Scoop joined forces with leading industry publications EMSNow, Mexico EMS and U.S. Tech to host the inaugural ScoopTalk, an innovative program of roundtable discussions which brought together the biggest players and brightest minds in the industry to debate the industry's hottest subjects. Scoop interviewed a number of executives but the real stories were told during the six ScoopTalk panel discussions moderated by Philip Stoten, Kim Sauer and Gayle Paterson, taking event video to the next level.

Small Footprint Selective Soldering System at SMTA LA/Orange County Expo
Publication Date: 10/4/2016

Plymouth, WIKurtz Ersa North America, a leading supplier of electronics production equipment, is pleased to announce that it will exhibit at the SMTA LA/Orange County Expo & Tech Forum, scheduled to take place Thursday, October 20, 2016 at The Grand Event Center in Long Beach. Ersa’s team will highlight the Smartflow 2020 and Hotflow 3/20 Reflow system.

YAMAHA Takes Home Coveted Global Technology Award at SMTAI for Revolutionary Z:TA-R / YSM40R Modular Surface Mounter
Publication Date: 10/4/2016

 George Babka, Sales General Manager (L) and Ed Nauss, Global Account Manager, Yamaha Motor Corporation USA, with the Global Technology Award

Rosemont, IL Yamaha Motor Corporation, USA won a coveted Global Technology Award for the company’s new ultra‐high‐speed Z:TA-R / YSM40R modular surface mounter, which boasts the world’s fastest placement rates and area productivity at 200,000 CPH. The award was presented to the company on Tuesday, September 27th, 2016 at the SMTAI 2016 Conference and Exhibition at the Donald Stephens Convention Center in Rosemont, Illinois and was accepted by George Babka, Sales General Manager.

NEO Tech Earns Prestigious Raytheon Supplier Award for Third Time
Publication Date: 10/4/2016

CHATSWORTH, CA – NEO Tech, a leading provider of manufacturing technology and supply chain solutions for brand name OEMs in the industrial, medical and mil/aero markets, announces that it has won the Raytheon IDS Supplier 4 Star Award for performance throughout 2015. The award was presented to the company during the IDS Supplier Conference that took place in Danvers, MA. This award marks the third consecutive year that NEO Tech has won the award.

New ACCU-CAL™ 160 Radiometer Helps Ensure Consistent Production Quality
Publication Date: 10/4/2016

Torrington, CT –. Dymax Corporation offers ACCU-CAL, a new radiometer that simplifies validation and monitoring of UV or LED light-curing up to 10W/cm2 emitted from stationary light-curing flood lamps or lamps used in conveyorized processes. It provides a quantifiable measurement that verifies if the light-curing process is operating within qualified parameters, to reveal the optimal time for bulb replacement for a UV-light curing device.

WACKER Presents New Silicone Rubber Grades for Encapsulating LEDs at K2016: 20th International Trade Fair for Plastics and Rubber
Publication Date: 10/4/2016

 At the K 2016 International Trade Fair for Plastics Rubber, WACKER will be showcasing the new NRI encapsulants LUMISIL® 740 and LUMISIL® 770. The silicone grades effectively protect the sensitive LED semiconductor chip against environmental influences.
Munich, Germany - WACKER, the Munich-based chemical company, will unveil two new encapsulation compounds for light-emitting diodes (LED) at the 20th International Trade Fair for Plastics and Rubber K 2016 in Düsseldorf, Germany. The encapsulants LUMISIL® 740 and LUMISIL® 770 cure to form highly transparent silicone elastomers. Both silicones withstand exceptionally high operating temperatures and strong light radiation without yellowing or becoming brittle. They are thus ideal for encapsulating high-performance LEDs. K 2016 will take place from October 19 to 26, 2016.

Plexus Names Steve Frisch Chief Operating Officer
Publication Date: 10/4/2016

NEENAH, WI - Plexus Corp., a leading engineering, manufacturing and aftermarket services provider, today announced the appointment of Steve Frisch, 50, to Executive Vice President and Chief Operating Officer. With his promotion to Chief Operating Officer, Mr. Frisch assumes responsibilities for Plexus’ global manufacturing and engineering operations, go-to-market, supply chain, and quality functions.
Engineered Material Systems Introduces New Dam and Fill Chip Encapsulants for Smart Card Assembly Applications
Publication Date: 10/4/2016

DELAWARE, OH Engineered Material Systems, a leading global supplier of electronic materials for circuit assembly applications, is pleased to debut its 640-35 (dam) and 640-46 (fill) dam and fill UV cured chip encapsulants for chip-on-board smart card applications.  

Vi TECHNOLOGY Named Best European Product at SMTAI
Publication Date: 9/30/2016

Saint-Egrève, FranceVi TECHNOLOGY, a leading provider of inspection solutions for PCB assembly, announces that it was awarded a 2016 Global Technology Award in the category of Best Product – Europe for its K Series3D AOI system. The award was presented to the company during a Tuesday, Sept. 27, 2016 ceremony that took place at the Donald Stephens Convention Center in Rosemont, IL during SMTA International. K Series3D also is available as a cost-effective 3D AOI upgrade to existing 5K, 7K and 9K systems.

Indium Corporation to Present at NEPCON Vietnam 2016
Publication Date: 9/30/2016

CLINTON, NY - Indium Corporation experts will share their knowledge and expertise at NEPCON Vietnam, Oct. 6-8, in Ho Chi Minh City, Vietnam.

Jonas Sjoberg, Technical Manager, will present DfX for High-Density Assemblies, which covers the basic principles and understanding of manufacturability (DfM) and reliability (DfR). 

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