Tuesday, February 21, 2017
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Ultra Low Voiding Solder Paste from FCT Solder
Publication Date: 2/7/2017

GREELEY, CO - The AMP One solder paste from FCT Assembly, is redefining the voiding standard for PCB Assembly. By combining industry low levels of voiding performance with excellent activity and decreasing the potential for solder balling and graping, AMP One delivers assemblers an unmatched ability to amplify their process window while ultimately achieving higher yields.

PVA to Feature the Latest in Automated Dispensing and Coating Systems at the IPC APEX Expo 2017
Publication Date: 2/7/2017

COHOES, NY - Global manufacturer and supplier of conformal coating and precision dispensing systems, PVA (Precision Valve & Automation, Inc.), will be bringing the latest in automated dispensing and coating equipment to the IPC APEX Expo, February 14th – 17th in San Diego, California.
Panasonic to Highlight Smart Factory Solutions at APEX 2017
Publication Date: 2/7/2017

ROLLING MEADOWS, IL - Panasonic Factory Solutions Company of America will premiere Smart Factory Solutions for “Any Mix Any Volume” at IPC APEX 2017 in booth #1542 on February 14-16 in San Diego, CA.
Mobile Process Monitoring with the New Viscom App
Publication Date: 2/7/2017

DULUTH, GA - With the newest vVision release, Viscom offers an intelligent software solution for mobile devices. This brings even greater versatility to the inspection of electronic assemblies. The user is given an overview of the widest range of key figures from his production process, and can retrieve information about products faster than ever.
Nordson MARCH's New Plasma Polymerization Deposition Systems Deposit Materials During Precision Manufacturing Processes
Publication Date: 2/7/2017

CONCORD, CA - Nordson MARCH, a Nordson company, a global leader in plasma cleaning and surface treatment technology, introduces its PD Series Plasma Deposition Systems family, which uses plasma polymerization to deposit thin films uniformly during precision manufacturing and assembly processes to change the surface characteristics of a substrate.
Entegris Announces Higher-Purity Gas Purification System Platform with Expanded Manufacturing in Asia
Publication Date: 2/7/2017

BILLERICA, MA - Entegris, Inc., a leader in specialty chemicals and advanced materials handling solutions for the microelectronics industry, announced today it has introduced a new platform for advanced gas purification that improves wafer yields for semiconductor and LED applications. The new family of GateKeeper® Gas Purification Systems (GPS) applies new purification media to provide best-in-class gas purity at a wide range of flow rates with a reduced equipment footprint.
KIC Brings on New R&D Manager
Publication Date: 2/7/2017

SAN DIEGO, CA - KIC today announced that it has hired Bill Kazmierowicz. Kazmierowicz will develop new products and services, using the latest technologies, techniques and materials.

Kazmierowicz brings enterprise software development expertise to lead KIC’s Research and Development Department. A career defense contractor, Kazmierowicz spent the last nine years running an integrated product team, building modeling and simulation software for the DoD.
Speedprint Technology Launches S-Track, Industry’s First Printer-Based Traceability Package at APEX. 2017
Publication Date: 2/7/2017

Speedprint S-Track barcode label placement and traceability package  

Tampa, FL - SMT screen printing specialist Speedprint Technologies announces the launch of a sophisticated barcode traceability package integrated into its SP710 printer platform, on booth #523 at APEX 2017 in San Diego. The new S-Track system is an industry first and completely unique in featuring pick & place technology inside a screen printer. S-Track places barcode labels on boards while still in the printer ...

New iineo+ Placement Platform Launching at APEX Expo 2017.
Publication Date: 2/7/2017

The new iineo+ placement platform from Europlacer launching at APEX 2017.  
Tampa, FL - Europlacer Americas announces the launch of a new pick & place platform, positioned at the top of its product range, on booth #2733 at APEX 2017 in San Diego. The new system is called iineo+. Based on the company’s industry-leading iineo machine, the new iineo+ platform includes an integrated component electrical tester, ...
Technica USA to present full line of products at the upcoming IPC/APEX Expo
Publication Date: 2/7/2017

San Jose, CA - Technica USA plans to present their full line of material and equipment products for both the PCB fabrication and SMT segments of their business at the 2017 IPC/APEX Expo in booth #3449.

In the PCB fabrication portion of their booth, Technica will be featuring Chime Ball Technolgy’s (CBT) latest in Maskless Lithography...

Alpha Introduces Latest VOC-Free, Zero-Halogen Liquid Soldering Flux
Publication Date: 2/6/2017

SOMERSET, NJ - Alpha Assembly Solutions, the world leader in the production of electronic soldering and bonding materials, is introducing ALPHA® EF-2100, their latest VOC-free, zero-halogen liquid soldering flux designed to meet current REACH and RoHS legislation.

“ALPHA® EF-2100 shows stable performance compared to EF-2210, Alpha’s leading VOC-free flux,” said Mike Previti, Global Product Manager for Soldering Fluxes.
Scienscope Expands Its Field Service/Applications Team
Publication Date: 2/6/2017

CHINO, CA - Scienscope International, a complete inspection solutions provider, today announced the hire of Danny Lumbreras as the newest addition to its Field Service/Applications team. Lumbreras will be based out of Scienscope’s Chino office.

Lumbreras joins Scienscope’s Field Service/Applications team with a history of working in SMT and TH manufacturing on various types of equipment including PCB manufacturing and machine maintenance.
Rehm: Clean soldering systems through pyrolysis technology
Publication Date: 2/6/2017

BLAUBEUREN, GERMANY - As with many thermal processes, soldering fumes, aerosols and solid particles (residues) that must be removed from the process cycle are also produced when soldering electronic assemblies. Rehm Thermal Systems has established effective residue management for reflow convection soldering with the VisionXP+.
Management Changes at Europlacer HQ.
Publication Date: 2/6/2017

Andy Jones, Europlacer’s Business Development and UK Sales Manager. 
Dorset, UK - Andy Jones has been promoted from UK General Sales Manager at Europlacer Distribution to Business Development and UK Sales Manager for Europlacer. In this expanded role, he takes charge of the global marketing budget while retaining responsibility for growing the UK sales of Europlacer’s own products and its distributed product ranges.
TRI Hosts 2017 Innovation Seminars in Taiwan, Suzhou and Shenzhen
Publication Date: 2/6/2017

TAIPEI, TAIWAN - Test Research, Inc. (TRI) will feature its new generation of SPI, AOI, AXI and ICT inspection solutions at a series of technology seminars held in Shenzhen, Suzhou and Taiwan. Each of the one-day events will focus on latest technology innovations in TRI's comprehensive PCBA test and inspection portfolio, including the YMS 4.0 solution for Industry 4.0 smart manufacturing.

Digi-Key: Analog Devices ADF7030-1 Sub-GHz Radio Transceiver IC
Publication Date: 2/6/2017

Aerospace Supplier Quality System Certification (AS9100 Rev C) Audit Success at Ventec's UK Facility
Publication Date: 2/6/2017

SUZHOU, CHINA - Ventec International, a world leader in the production of polyimide & high reliability epoxy laminates and prepregs, is proud to announce that its European Headquarters in the United Kingdom continues to be fully accredited to AS9100 Revision C, in accordance with the Aerospace Supplier Quality System Certification Scheme.
Treston: New Improvements to Configurator Tool
Publication Date: 2/3/2017

CANTON, GA - Treston Inc has recently implemented some improvements to the 3D Configurator workstation design tool. An updated layout offers further ease of use, with new bench platforms and accessory options. Among these additions are: MultiLine bench platform, packing bench and accessories, and new ergonomic chair offering.
Mirae MAI odd placement machine to be introduced by Apex FA at the 2017 IPC Expo in booth #2633.
Publication Date: 2/3/2017

LANHAM, MD - Apex Factory Automation will be introducing the new Mirae MAI machine to the North American Market at the IPC Expo February 14-16th in San Diego:

The Mirae MAI is a flexible hybrid machine which uses SMT Mounter technology to perform odd part insertion and placement.
Indium Corporation Products “Live@APEX”
Publication Date: 2/2/2017

CLINTON, NY - Indium Corporation will be running its low-voiding solder products “Live@APEX” in more than 20 partner booths throughout the IPC APEX Expo technical conference on Feb. 14-16 in San Diego, Calif.

“Live@APEX,” a joint effort between Indium Corporation and its industry partners, accurately and honestly depicts the performance of the company’s materials in real time.
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