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Excelitas Technologies to Display Latest Innovations at Sensors Expo 2016
Publication Date: 6/9/2016

WHO: Excelitas Technologies® Corp., a global technology leader delivering innovative, customized photonic solutions, will display its latest innovations in sensing and detection technology at the 2016 Sensors Expo & Conference in San Jose, CA.
Johannes Rehm is “Manager of the Year 2016”
Publication Date: 6/9/2016

SEISSEN, GERMANY - Who are the top managers in the electronics industry? The readers of the trade journal “Markt & Technik” were given the choice! Already for the second time, they were able to vote for their favourite managing director in the ten categories passive building components, embedded systems, electromechanics, power supplies, SME distribution, communication, sensor technology, SMT equipment, founders/pioneers of electronics and semiconductors.
TT Electronics Announces Seven-Day Standard Lead Times On All Fully Configurable Temperature, Pressure, Level, and Flow Products
Publication Date: 6/9/2016

WEYBRIDGE, UK - TT Electronics, a global provider of engineered electronics for performance critical applications, today announced the availability of seven-day standard lead times on all of its fully configurable temperature, pressure, level, and flow sensing products, offered under its Roxspur Measurement and Control brand.
Innovative QTS Apshen Stencil Foil Adapter Awarded U.S. Patent
Publication Date: 6/9/2016

MEDWAY, MA - The Apshen Stencil Foil Adapter System developed by Quick Tensioning Systems (QTS), for the DEK® VectorGuard® High Tension stencil frame, has been awarded U.S. Patent #9,351,406, it is announced today.

The QTS Apshen was developed to give DEK® VectorGuard™ High Tension stencil frame system users the ability to choose their own or preferred stencil foil provider, according to Thomas G. Erdmann, CEO and developer of the Apshen.
B&K Precision Offers 100 kHz Handheld LCR Meter with Bench Performance
Publication Date: 6/8/2016

YORBA LINDA, CA - B&K Precision today announced the expansion of its current 878B and 879B 40,000-count handheld LCR meters with the addition of a new 100 kHz model, the 880. This new portable LCR meter can measure inductance, capacitance, and resistance with 0.1% basic impedance accuracy.
Teledyne DALSA’s Smart LWIR Imaging Solutions Featured at Eurosatory 2016
Publication Date: 6/8/2016

WATERLOO, ONTARIO - Teledyne DALSA, a global leader in digital image sensing technology, will showcase its shutterless uncooled infrared camera platform, Calibir, in booth J614 at Eurosatory, an international forum focused on the future of Defense and Security, taking place in PARIS, France from June 13-17.
Songwon & Heraeus join forces to develop and market high end specialty chemicals for the electronics industry
Publication Date: 6/7/2016

ULSAN, KOREA - Songwon and Heraeus announced today that they have signed a co-operation agreement to jointly develop and market high end specialty chemicals for the electronics industry.

This new co-operation combines Songwon's strong expertise in R&D and chemical manufacturing with Heraeus' technical capabilities and high reputation in the electronics chemical industry, thereby broadening both companies' access to the global electronics market.
Indium Corporation’s Lasky to Present at SMTA Boston Meeting
Publication Date: 6/7/2016

CLINTON, NY - Indium Corporation’s Dr. Ron Lasky, Senior Technologist, will present The Status of Lead-Free Implementation Ten Years into RoHS and Future Technology Trends at the Boston SMTA Chapter’s Technical Tutorial on June 14 in Wilmington, Mass.

Dr. Lasky will review the impacts that RoHS has had over the past 10 years.
 
U.S.Tech Publisher's Choice: June 2016
Publication Date: 6/6/2016

Our Publisher's Choice for the month of June is an article by Jason Evans and Joseph Kane of MK Test Systems Ltd. on methods of testing electrical grounding loops in aircraft. Lightning striking a plane in flight is a fairly common occurrence as the authors point out. It is therefore critical to know that the electrical systems in the aircraft are protected from an external current and can handle such a massive surge of electricity safely.
ALPHA® Argomax® 9000 Silver Sintering Preforms Wins Prestigious Award at JPCA Show in Japan
Publication Date: 6/6/2016

SOMERSET, NJ - Alpha Assembly Solutions, the world leader in the production of electronic soldering materials, is pleased to announce that ALPHA® Argomax® 9000 Silver Sintering Preforms won the award under the materials category of Sangyo Times. This prestigious award was presented to Alpha by Semiconductor Device Newspaper - Sangyo Times Inc. on June 1 at the 22nd Semiconductor of the Year 2016 in Tokyo Big Sight during the JPCA show.
NEO Tech to Showcase Leading Medical Design & Manufacturing Solutions at MD&M East 2016 Exhibition
Publication Date: 6/6/2016

CHATSWORTH, CA – NEO Tech, a leading provider of manufacturing technology and supply chain solutions for brand name OEMs in the industrial, medical and mil/aero markets, announces that it will highlight its numerous medical design and manufacturing service solutions in booth 1252 at the 2016 MD&M East Exhibition, scheduled to take place June 14-16 at the Jacob K. Javits Convention Center in New York.
Polyonics Next Generation High Resolution PCB Label Materials
Publication Date: 6/6/2016

WESTMORELAND, NH - Polyonics high-gloss thermal transfer printable label materials are designed for printing high resolution 600dpi barcode labels. The next generation top coats on the XF-528 (1mil) and XF-529 (2mil) materials provide up to 25% higher gloss values than the competition. This translates into increased smoothness ensuring greater ink contact and improved adhesion.
 
New sales representative at Rehm
Publication Date: 6/3/2016

BLAUBEUREN, GERMANY - As a leading manufacturer of efficient production equipment for the electronics and solar industries, Rehm Thermal Systems is an established name in the national and international markets. With two new representatives for Sales Germany South East and Sales Central Eastern Europe, Rehm expands its worldwide network for sales and service.
 
Ironwood Electronics: 30 GHz Bandwidth Socket for BGA1086 Package
Publication Date: 6/3/2016

EAGAN, MN - Ironwood Electronics has recently introduced a new high performance elastomer socket for 0.65mm pitch BGA package. The SG-BGA-9002 socket is designed for a 25mmx25mm package size and operates at bandwidths up to 30 GHz with less than 1dB of insertion loss (GSSG configuration).
 
FlexLink Will Demonstrate Innovation in Product Carrier Solutions at Automatica 2016
Publication Date: 6/3/2016

GOTEBORG, SWEDEN - FlexLink will demonstrate its ongoing development of a new product carrier puck system, enabling shorter throughput time in production lines. The smart electric handling functions for pucks and pallets offer quick routing into machine cells and other equipment, low maintenance and low power consumption.
 
Porvair: Filtration leader strengthens its position in microelectronics market
Publication Date: 6/3/2016

ASHLAND, VA - An international leader in filtration and separation has unveiled its new microelectronics product range, opening up fresh market opportunities and extending sales channels for pre-existing lines.

Porvair Filtration Group sees microelectronics as a new and exciting market, driven by the need for efficient, low power, low cost devices - and a key growth target as it looks to enhance its status as a quality supplier of filters to the semiconductor industry.
OK International Relocates to New State-of-the-Art Headquarters
Publication Date: 6/2/2016

CYPRESS, CA - OK International, a subsidiary of Dover Corporation, has moved into its new, state-of-the-art world headquarters in Cypress, Calif. OK International, parent company of Metcal, Techcon Systems, Quant 3D and Proworks Software, is the main tenant in the 100,550 ft2 building.
Indium Corporation’s Andy Mackie Named to IMAPS Global Business Council Steering Committee
Publication Date: 6/2/2016

CLINTON, NY - Indium Corporation’s Andy C. Mackie, PhD, MSc, Senior Product Manager for Semiconductor and Advanced Assembly Materials, has been named to the International Microelectronics Assembly and Packaging Society (IMAPS) Global Business Council Steering Committee.

The Global Business Council Steering Committee consists of diverse and dynamic business leaders who share expertise in microelectronics and packaging technologies.
Avnet Celebrates 30-Year Collaboration with ebm-papst in the Americas
Publication Date: 6/2/2016

PHOENIX & FARMINGTON, CT - Avnet, Inc. (NYSE: AVT), a leading global technology distributor, and ebm-papst Inc., a top manufacturer of motors, fans and blowers, recently marked the milestone 30-year anniversary of their business relationship.
Alpha Assembly Solutions to Present PV Product Technologies at Intersolar Europe in Munich, Germany
Publication Date: 6/2/2016

SOMERSET, NJ - Alpha Assembly Solutions, the world leader in the development of non-hazardous solder and electronic assembly materials for photovoltaic manufacturing and assembly, plans to showcase their vast product offering at the Intersolar Europe show taking place June 22 – 24 in Munich, Germany.

 
 
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