Thursday, July 28, 2016
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IBL Technologies Brings Its Economy Vapor Phase Soldering System to the PHASE 4, Inc. Mini Show
Publication Date: 7/13/2016

BURNSVILLE, MN  ― IBL Technologies, LLC has announced its participation in the PHASE 4, Inc. Mini-show & Technical conference, scheduled to take place August 9-11, 2016 at TechShop in Chandler, AZ. Jochen Lipp, CEO of IBL Technologies, will be available to demonstrate the redesigned SV260 Economy Vapor Phase Soldering Machine for small series and prototyping.

Tanaka Kikinzoku Kogyo Provides Flexible Touch Panel Market with Silver Nanoparticle Ink-Printed Film
Publication Date: 7/12/2016

Tanaka Kikinzoku Kogyo K.K. (Head office: Chiyoda-ku, Tokyo; Representative Director & CEO: Akira Tanae), the manufacturing business of Tanaka Precious Metals, announced today a collaboration with several technology research institutes in Japan to commercialize a fabricated conductive film for touch panel sensors. The film is manufactured from a transparent flexible substrate printed with silver nanoparticle ink to form ultrafine wiring of 0.8 microns wide (1 micron is one-thousandth of a millimeter). This new product will be exhibited at the SEMICON West exhibition to be held on July 12-14.

Schleuniger EcoStrip 9380 – Welcome to the Future of Entry Level Cut & Strip
Publication Date: 7/12/2016

Manchester, NH - At the 2015 productronica trade fair, Schleuniger debuted the new EcoStrip 9380, the company’s latest innovation in its cut and strip product family. This capable, entry level machine for professional demands once again confirmed Schleuniger’s number one position in this market segment. 
SEICA announces further expansion in China
Publication Date: 7/12/2016

Strambino, Italy  - SEICA’s Chinese subsidiary, Seica Electronics (Suzhou), has doubled the size of their technical support team in the first half of 2016, and is looking to continue the trend in the near term. The Seica support team provide 24/7 technical support to the installed base in China, and is able to supply test application programs and fixtures directly from our Chinese offices.

MVP to Demo Microelectronics and Packaging Inspection Toolbox for AOI at Semicon West 2016
Publication Date: 7/11/2016

Carlsbad, CA Machine Vision Products (MVP) today announced it would be demonstrating their diverse inspection toolbox on the MVP 850 Platform for Microelectronics and Packaging at the Semicon West 2016 exhibition. Applications will include Lead Frame inspection for die placement, epoxy and wire bond as well as demonstrating new surface inspection capabilities. The exhibition is at the Moscone Center in San Francisco from July 12-14 2016. Machine Vision Products are exhibiting at booth #6471 in the North Hall. 

Eunil Adds ECM-1100 to Coating Master ECM Series
Publication Date: 7/11/2016

CHULA VISTA, CA - Eunil, a worldwide producer of factory automation and a manufacturer of SMT peripheral equipment, has released its latest in-line coating machine, the ECM-1100, as part of the Coating Master ECM Series.

Dazor Lighting Solutions Introduces New Digital Magnification System
Publication Date: 7/8/2016

ST. LOUIS, MO - Dazor Lighting Solutions has released a new low-cost digital bench-top magnification system, CODA. This streamlined and easy-to-use system is designed to provide the ultimate in magnification simplicity for production, quality control, and other inspection applications. 


Nicomatic Celebrates 40 Years in Business with New Logo Release
Publication Date: 7/8/2016

Warminster, PA - Nicomatic has a recent update to their brand image, with Friday July 8th 2016 marking their 40th anniversary, they have announced a new logo.  This is the first official new logo since Nicomatic came to the market in 1976.  With their in-house design and great use of negative space, Nicomatic moves towards a sleek and stylish look; showing the evolution of the company from passive components to more technology driven “smart” products.  The future is bright and Nicomatic shows they are here to stay.
Nordson ASYMTEK Teams with Parker Chomerics for High-volume, Precision Conductive Coating Spray Application
Publication Date: 7/8/2016

Carlsbad, CA - Nordson ASYMTEK, a Nordson company, and Parker Chomerics, a Division of Parker Hannifin Corporation, are partnering at SEMICON West in Parker Chomerics' booth #6557 to demonstrate precision, high-volume spray applications for EMI coating solutions. One specific solution uses Nordson ASYMTEK's Select Coat® Conformal Coating System with a DispenseJet® applicator to apply thin coatings of Parker Chomerics' new CHO-SHIELD-604 conductive coating to achieve a target thickness of 25 µm. SEMICON West is being held at Moscone Center, San Francisco, CA,July 12-14, 2016.
Seika Machinery Now Carries the Malcom SWB-2 Automatic Wetting Balance Tester
Publication Date: 7/8/2016

TORRANCE, CA  — Seika Machinery, Inc., a leading provider of advanced machinery, materials and engineering services, has just introduced the Malcom SWB-2 Automatic Wetting Balance Tester. The automated solution has been designed for measuring the wetting force of your through-hole components using wave solder.

STI Announces Mel Parrish’s Retirement
Publication Date: 7/8/2016

MADISON, AL STI Electronics, Inc., a full service organization providing training services, training materials, analytical/failure analysis, prototyping, and small-to-medium volume contract PCB assembly, today announced the retirement of Mel Parrish. 

Libra Industries Renews ITAR Registration for All Manufacturing Facilities
Publication Date: 7/7/2016

MENTOR, OH  ― Libra Industries, a privately held electronics manufacturing services (EMS) provider, is pleased to announce that it has renewed its ITAR registration for its Dallas and Ohio facilities. Libra Industries has worked hard to earn and maintain an impressive array of certifications and registrations in addition to ITAR, including ISO 9001:2008 and ISO 13485-2012, AS9100C:2009, UL, CSA and FDA.

Engineered Material Systems to Showcase Adhesives for Stringing and Shingling Next-Generation Solar Modules at Intersolar North America
Publication Date: 7/7/2016

DELAWARE, OH Engineered Material Systems, Inc. (EMS), a leading global supplier of conductive interconnect materials for photovoltaic applications, will exhibit its new 561-400 series Low-Cost Snap Cure Conductive Adhesives at Intersolar North America, scheduled to take place July 12-14 in San Francisco, CA. The 561-400 series is designed for stringing and shingling crystalline silicon and heterojunction solar modules. 

Kolb Cleaning Technology intros new Concentrate Multi-purpose detergent - MultiEx VRSP-CN
Publication Date: 7/7/2016

LONGMONT, CO - Kolb Cleaning Technology has just released a new concentrated cleaning detergent, MultiEx® VRSP-CN. The Kolb MultiEx VRSP-CN is an aqueous, alkaline broadband, multifunctional detergent well suited for multiple cleaning tasks including PCBs, stencils, solder carriers and frames, and production tools.
Ersa Delivers Quality Selective Soldering in a Small Footprint
Publication Date: 7/7/2016

PLYMOUTH, WIKurtz Ersa North America, a leading supplier of electronics production equipment, is pleased to announce that it will exhibit at the SMTA Ohio Expo & Tech Forum, scheduled to take place Thursday, Aug. 4, 2016 at the Embassy Suites Cleveland Rockside in Cleveland, OH. Ersa’s team will showcase the Smartflow 2020.

SHENMAO Introduces BGA and Micro BGA Bumping Solder Paste At Semicon West 2016 Booth # 6467 in San Francisco
Publication Date: 7/7/2016

SAN JOSE, CA - SHENMAO Bumping Solder Paste PF608-PI-21 (Sn/Ag4.0/Cu0.5/x) and PF606-P-BS1 (Sn/Ag3.0/Cu0.5/x) aim to decrease voids in wafer bumping process. SHENMAO MICRO MATERIAL INSTITUTE applications engineers focused on developing the Bumping Solder Paste Formula with excellent stencil printing transfer rate and the lowest Void to optimize manufacturing process performance. The world’s largest IC Packaging and Test Service OSAT utilize SHENMAO Bumping Solder Paste in production.

Mitch Holtzer of Alpha to Present on Ionic Contamination and SIR Testing at Upcoming SMTA Ohio Expo & Tech Forum
Publication Date: 7/6/2016

SOMERSET, NJ - Alpha Assembly Solutions, the world leader in the production of electronic soldering and bonding materials, is participating in the upcoming SMTA Ohio Expo & Tech Forum on August 4th in Cleveland, Ohio as both an exhibitor and technical presenter.

KIC: Find Out How to Reduce Production Costs at SMTA Chihuahua
Publication Date: 7/6/2016

SAN DIEGO, CA - KIC today announced that it will exhibit at the SMTA Chihuahua Expo & Tech Forum, scheduled to take place Thursday, July 14 at the Casa Grande Hotel in Chihuahua, Mexico. Miguel Carbajal, KIC’s Sales Manager in Mexico, will be available to discuss KIC’s smart oven technologies.
OKW: New DIN Rail Enclosures With Integrated Terminal Blocks
Publication Date: 7/6/2016

BRIDGEVILLE, PA - OKW has extended its RAILTEC C DIN rail enclosures range with a new CV version that features four integrated terminal blocks.

New RAILTEC CV can be specified for a wide range of applications including automation, building technology, safety systems and HVAC – notably time controllers, sensors, relays, signal distributors and lighting controls.

STI Receives Prime Contract Award for SeaPort-e
Publication Date: 7/6/2016

MADISON, AL - STI Electronics, Inc., a full service organization providing training services, training materials, analytical/failure analysis, prototyping, and small-to-medium volume contract PCB assembly, is pleased to announce that it has received a prime contract award for SeaPort-e.
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