Tuesday, September 27, 2016
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ELANTAS: Join Us at the 2016 SMTA International Show in Chicago Sept 27-28, 2016
Publication Date: 9/14/2016

Come visit with us in Booth #320 and learn about our ELAN-Tron® , ELAN-Cast® , and Bectron® resins for Conformal Coatings

These resins are specially designed for easy dip or spray application to printed circuit boards and surface mount devices.

Engineered Materials Systems Introduces Fast Cure Conductive Adhesive for Small to Medium Size Chip Bonding
Publication Date: 9/14/2016

DELAWARE, OH - Engineered Materials Systems, a leading global supplier of conductive interconnect materials for electronics applications, today announced its new EMS 561-338 Fast Cure Conductive Adhesive for die attach applications with small to medium size die. EMS 561-338 is designed to cure in less than one minute at 150ºC.
Buy One ERSA i-CON 1 or i-CON NANO – Get One Free
Publication Date: 9/14/2016

PLYMOUTH, WI - Kurtz Ersa North America, a leading supplier of electronics production equipment, is pleased to announce two new product promotions: buy one ERSA i-CON 1, get one free and; buy one i-CON NANO, get one free. The two promotions will run in parallel, effective Oct. 1, 2016 through Dec. 31, 2016.
Mouser and Dell OEM Solutions Sign Distribution Agreement
Publication Date: 9/13/2016

MANSFIELD, TX - Mouser Electronics, Inc. has signed a distribution agreement with Dell OEM Solutions, which combines Dell’s portfolio, a rich partner ecosystem, deep vertical and domain expertise, and a collaborative approach to provide end-to-end Internet of Things (IoT) solutions.
 
ELANTAS: Come Visit With Us at the ECCE Show in Milwaukee, September 18-22, 2016
Publication Date: 9/13/2016

Please join us at ECCE 2016, the world's leading technical conference and exposition for energy conversion, sponsored by the IEEE Power Electronics Society (PELS) and the IEEE Industrial Application Society (IAS).

SHENMAO Exhibits at SMTA International at Donald E Stephens Convention Center, Rosemont, Il September 27-28, 2016 Booth # 800
Publication Date: 9/13/2016

SHENMAO America, Inc. is the American subsidiary of SHENMAO Technology, Inc. of TaoYuan City 328, Taiwan. Shenmao is a global leader in solder materials with 10 manufacturing, technical and sales support facilities located around the world. SHENMAO America, Inc. manufactures solder paste in San Jose, CA, U.S.A., supporting a wide range of products for the PCBA and Semiconductor Industries.
Acculogic to Offer Its Comprehensive Line of Boundary Scan Test Tools – Visit Booth #1011 at SMTAI
Publication Date: 9/13/2016

MARKHAM, ON - Acculogic Inc., a global leader in electronic production test solutions, announces that it will exhibit in Booth #1011 at SMTA International, scheduled to take place September 27-28, 2016 at the Donald Stephens Convention Center in Rosemont, IL. Company representatives will demonstrate the FLS980 Series III, Scorpion Briz Test & Programming station, and comprehensive line of Boundary Scan Test tools.
 
ALPHA® Recycling Services to Demonstrate Source Reduction Program at SMTA International
Publication Date: 9/12/2016

SOMERSET, NJ - Alpha Assembly Solutions, the largest solder manufacturer and recycler in North America, plans to showcase their recycling services at the SMTA International exhibition, taking place September 27th-28th in Rosemont, Illinois.

Located at Booth #723, ALPHA® Recycling Services is the only refiner and recycler of solder in North America that is ISO9001, 14001 and 18001 compliant, as well as ITAR registered and Conflict-Free Mineral certified.
 
Lansdale and Freescale Semi Partner to Manufacture RF Prescalers
Publication Date: 9/12/2016

PHOENIX, AZ - Lansdale Semiconductor, Inc. president, R. Dale Lillard, announced today the continued availability of the ML3356, a Wideband FSK Receiver. The ML3356 device can be used for single and double conversion VHF receiver systems, primarily for FSK data transmission up to 500 K baud (250 kHz). It contains an Oscillator, Mixer, Limiting IF, Quadrature Detector, Signal Strength Meter Drive, Squelch, Squelch Status output and Data Shaping Amplifier.
 
Digi-Key: Connected Cellular BeagleBone IoT Dev Kit
Publication Date: 9/12/2016

BTU’s Energy Pilot Saves Manufacturers Money Whenever the Oven Is Idle
Publication Date: 9/12/2016

NORTH BILLERICA, MA - BTU International, Inc., a leading supplier of advanced thermal processing equipment for the electronics manufacturing and alternative energy markets, will exhibit in Booth #835 at IMAPS Pasadena, scheduled to take place Oct. 10-13, 2016 at the Pasadena Convention Center. BTU will showcase its RecipePro recipe generator software, jointly developed with Electronic Controls Design Inc. (ECD), along with the latest version of the Energy Pilot software and Industry 4.0 compliant solutions.
 
KYZEN Establishes New Standard with VOC-free Solvent
Publication Date: 9/9/2016

NASHVILLE, TN - KYZEN, a global leader in environmentally responsible cleaning technologies, introduces a new line of solvent blends designed for high reliability in a wide spectrum of industrial cleaning applications. With critical focus on meeting increasing regulations and high quality output, KYZEN’s new solvents have affectionately been dubbed “green and clean,” by many in the industry.
PDR Americas Releases PDR ThermoActive Suite Plus Rework Software
Publication Date: 9/9/2016

SHINGLE SPRINGS, CA - PDR Americas, a leader in IR rework, test and inspection, today announces its latest upgrade – the new ThermoActive Suite Plus ‘dynamic profile software,’ signaling a new era in rework process control. PDR’s recently released advanced state-of-the-art smart algorithms and high-speed processing capability ensures the most exacting rework process control in the industry.
Kerr to manage operations at Lauren Manufacturing
Publication Date: 9/9/2016

NEW PHILADELPHIA, OH - Lauren Manufacturing has named Chris Kerr plant manager of its New Philadelphia, Ohio location.

In this new position, Kerr will oversee day-to-day operations of the manufacturing facility, which engineers custom rubber seals and components for use in a wide range of markets.
Great Lakes Engineering, Inc. Is Unsurpassed in Customer Service
Publication Date: 9/9/2016

GREAT LAKES, MN - Great Lakes Engineering has prided itself on providing exemplary service to customers for more than 30 years, and the company knows it is succeeding when it receives a heartfelt ‘Thank You’ from a satisfied customer!

Visit Noren Products Inc. at The Battery Show 2016
Publication Date: 9/9/2016

MENLO PARK, CA - Noren Products, Inc. will be attending The Battery Show at the Suburban Showplace in Novi, MI from September 13th-15th, located in Booth #2032, to discuss specific thermal challenges. The Noren Products team brings years of thermal knowledge and industry best practices which has built their reputation as an industry leader in thermal solutions for a variety of industries, worldwide.
 
Techcon Systems to Exhibit at FEICA Conference in Vienna, Austria
Publication Date: 9/9/2016

CYPRESS, CA - Techcon Systems, a product group of OK International and a leading provider of fluid dispensing systems and products, is exhibiting at the FEICA 2016 Conference and EXPO, taking place September 7-9, 2016 in Vienna, Austria.
Microscan Releases AutoVISION® Machine Vision Software for MicroHAWK® MV Smart Cameras
Publication Date: 9/9/2016

RENTON, WA - Microscan, a global manufacturer of industrial machine vision solutions for quality control and guidance in factory and clinical automation, announces the latest version of its simplified AutoVISION Machine Vision Software to support new MicroHAWK Smart Cameras, now released and available for order.
U.S.Tech Publisher's Choice: September 2016
Publication Date: 9/8/2016

For our Publisher's Choice article this month we are highlighting a piece by the staff of Cicor Advanced Microelectronics & Substrates GmbH about developments in thick-film ceramic technology, which in combination with new fine-line structuring methods, allow for high-quality and high-density substrates.
Indium Corporation to Lead Special Session on Void Reduction at SMTA International
Publication Date: 9/8/2016

CLINTON, NY - Indium Corporation, the industry leader for void-reducing solutions, will chair a special session focusing on void reduction in bottom-terminated components (BTCs) at the SMTA International Conference on Sept. 29 in Rosemont, Ill.

Voiding is of critical concern in today's electronics assembly arena, especially in BTCs, due to impacts on electrical, thermal, and mechanical performance.
 
 
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