Thursday, August 17, 2017
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TopLine Rolls Out Graphite Tool for CGA1738 Micro-Coil Spring

Irvine CA   TopLine announces a new Graphite Tool (patent pending) for precision positioning of 0.4mm diameter Micro-coil springs onto BGA1738 organic substrates as an alternative to conventional solder balls. Micro-coil springs, originally introduced by NASA, provide compliant interconnects between IC packages and the Printed Circuit Board (PCB).

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Alpha’s Latest Product Innovations Target Voiding Issues

Somerset, NJ  Alpha Assembly Solutions, the world leader in the production of electronic soldering and bonding materials, addresses the issue of voiding with its latest selection of advanced product technologies.

Voiding is a common issue in PCB Assembly and is caused by volatile ingredients in the solder paste. Voiding can occur anywhere in the solder joint and is especially problematic as it reduces the mechanical properties and thermal conductivity of solder joints.

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Koh Young Americas Adds Strategic Marketing & Sales Capability

Chandler, AZIn a strategic move by the world’s leading True 3D measurement company to further accelerate its growth and continue delivering best-in-class intelligent inspection solutions, Koh Young Americas has hired Brent Fischthal for the newly created position of Senior Manager for Americas Marketing and Eastern Regional Sales. 

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PI's Latest Nano-Positioning and Precision Motion Control Systems Display at Optics+Photonics 2017

New silicon photonics (SiP) alignment engines will be a fan favorite, along with precision motion and control technologies, at Optics+Photonics in San Diego, starting August 6, 2017.

Auburn, MA – Optics & Photonics is known as the premier show in North America for the latest advancements in optical engineering and applications, nanotechnology, sustainable energy, organic photonics, and astronomical instrumentation. In San Diego next week, PI’s booth will feature the latest state-of-the-art precision motion technologies and interactive displays of nanopositioning components, with PI engineers on-hand to answer questions and help you find the right solution for your precision motion project in industry, research, or science.

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SMT Hybrid Packaging 2018: “Call for Tutorials” Is Launched

NUREMBERG, GERMANY - SMT Hybrid Packaging starts the event year as usual with the “Call for Tutorials”: interested users and experts from industry and academia are invited to submit their contribution about electronic assembly production.

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TEBIS to Feature Release 4 of Its Current Version 4.0 at WESTEC 2017

TROY, MI - Tebis America, a leading software company specializing in CAD/CAM systems for design and manufacturing servicing the tool, die, mold, automotive and aerospace manufacturing industries will feature the latest release of its Version 4.0 at WESTEC 2017, Booth No. 1823, September 12-14, 2017, Los Angeles.

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Dr. Mike Bixenman Receives Best Paper Award for His Presentation at ICSR

NASHVILLE, TN - KYZEN is pleased to announce that Dr. Mike Bixenman, DBA, received the ‘Best of Presentation’ Award at the 2017 International Conference on Soldering and Reliability (ICSR) for his paper entitled “Reliable Microelectronic Assembly Process Design Test Methods – A Non-Standard Approach.” The award is determined through the evaluations of those that attended the presentation.

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TDM Systems to feature Tool Data Management of the future at WESTEC 2017

SCHAUMBURG, IL - TDM Systems, a leading provider of tool data management in the machining industry will present its new generation of software for Tool Lifecycle Management at WESTEC 2017, Booth No. 2446, September 12-14, 2017, Los Angeles.

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FRAMOS and PYXALIS Expand Cooperation Worldwide for High Performance Custom Image Sensors

MUNICH, GERMANY - FRAMOS as a leading global image sensor distributor, and PYXALIS, as an advanced custom image sensor supplier, have extended their collaboration. FRAMOS has been working with PYXALIS for several years and, after a very productive relationship, have entered into a formal agreement.
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Würth Elektronik eiSos Group intensifies its Formula E technology partnership: A furious end of the racing season, a major step forward for eMobility

WALDENBURG, GERMANY - The situation couldn’t have been more thrilling: last weekend’s race in Montreal marked the end of an exciting season of the world’s first electric racing series. The hard battle has been won: Lucas di Grassi is the new Formula E world champion.

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Metals Recycler Conecsus Partners with Amerway, Cobar for ‘Cradle to Grave’ Solution

 (L-R) Tim Brown and Terry Buck, Amerway Inc.; Steve Butler and Tom Mitchell,       Conecsus, LLC.

Terrell, TX - Conecsus, LLC, announced today that they are partnering with Amerway Inc., and COBAR Balver Zinn Solder Products, two leading global solder manufacturers, to provide a ‘cradle to grave’ solution for electronics manufacturers. Conecsus, LLC is an ISO 14001 EMS certified recycling company and a refiner of SMT solder/solder paste wastes and residues, as well as Tin, Lead, Antimony, Silver, Gold, and other metals from a variety of manufacturing industries. Conecsus converts these wastes into usable metal products, paying cash to the customer.

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Revolutionary AOI, AXI and & Bondtesting from Nordson at NEPCON South China

AYLESBURY, UK/FELDKIRCHEN, GERMANY - Nordson DAGE, Nordson MATRIX, and Nordson YESTECH, divisions of Nordson Corporation, will exhibit in Stand 1H20 at NEPCON South China, scheduled to take place August 29-31, 2017 at the Shenzhen Convention & Exhibition Center. Test and inspection solutions from Nordson DAGE, Nordson MATRIX and Nordson YESTECH will be demonstrated at the event.

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Indium Corporation Launches New Solder Paste for Fine Feature Printing

CLINTON, NY - Indium Corporation has released Indium11.8HF-SPR (T5-MC) Solder Paste – a new air and nitrogen reflow, no-clean, Pb-free solder paste designed to meet the fine feature printing requirements of mobile manufacturers.

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Carlos Espinoza Promoted to Operations Manager for KIC

SAN DIEGO, CA - KIC is pleased to announce the promotion of Carlos Espinoza to Operations Manager. Espinoza joined KIC in September 2016 as a senior buyer/planner, and quickly climbed the ladder at KIC to operations manager within 8 months.

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COT Installs New Production Cell with MAZAK Equipment

GAINESVILLE, GA - Count On Tools Inc., a leading provider of precision components and SMT spare parts, is pleased to announce that with the recent expansion of its manufacturing facility, the company has purchased and installed four new MAZAK machining centers to further increase production capabilities and lower product lead times.

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Amerway Earns ISO 9001 Quality Certification

ALTOONA, PA - Amerway Inc., a leading a solder manufacturer servicing the electronics industry with high-purity solder products, announced today that the company has been awarded ISO 9001 quality certification.

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CyberOptics Unveils SQ3000-DD™ 3D AOI with Dual MRS Sensors at NEPCON Shenzhen

Extension of the Award-Winning SQ3000 Platform Maximizes Flexibility and Increases Throughput

MINNEAPOLIS, MN - CyberOptics® Corporation, a leading global developer and manufacturer of high-precision 3D sensing technology solutions, will unveil the new SQ3000-DD 3D Automated Optical Inspection (AOI) system with two Multi-Reflection Suppression (MRS) Sensors in Booth 1J45 at NEPCON South China, scheduled to take place August 29-31, 2017 at the Shenzhen Convention & Exhibition Center.

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Applied Energy Systems Showcases New SEMI-GAS® Nanoturion™ Fully Automatic Valve Manifold Box for Dichlorosilane (DCS)

System Features Multi-Zone Heat Capabilities to Stabilize DCS Flow Rates and Delivery Pressures for Semiconductor Manufacturing Applications

MALVERN, PA - Applied Energy Systems (AES), provider of high and ultra high purity gas systems, services, and solutions – including design, manufacturing, testing, installation, and expert field service – is showcasing its SEMI-GAS® Nanoturion™ Valve Manifold Box for Dichlorosilane (DCS) to support semiconductor process equipment manufacturing and related applications.

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ISRA VISION: Highly flexible and reliable – New 3D sensor uses shape measurement for high-precision quality control

DARMSTADT, GERMANY - Measuring edges, hole dimensions, flushness, gaps – with a combination of different measurement methods and 3D point cloud technology, a new 3D sensor has become a universal solution for a wide range of measurement tasks.

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Austin American Technology Names Todd Rountree President

AAT Appoints Veteran Management Executive to Oversee AATC Operations. Steve Stach, past President to Retire after Distinguished 31-Year Career

AUSTIN, TX - Austin American Technology (AATC) today announced Todd Rountree has been named President and Chief Operating Officer (COO), effective immediately. As President and COO, Todd will have responsibility for all of the Company’s operations worldwide.

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