Friday, August 18, 2017
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HARTING distinguished for exceptional quality

Hitachi Rail presents award in London / Cabling for carriage transitions

The HARTING Technology Group has received an award for exceptional quality from rail manufacturer Hitachi Rail.

Espelkamp, Germany - The HARTING Technology Group has been known for decades for its high-quality products and solutions. Now, the technology group has received an award for exceptional quality from rail manufacturer Hitachi Rail.

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Laurel, MD - C.R. International Inc. has recently added a new FUJI AIMEX III machine to increase the company’s ability to meet increasing customer demand for hi-speed throughput.

The FUJI AIMEX III gives CRI the capability to place 01005” (.254 x .127 mm) discrete components. An additional benefit is 74,000 pph placement rate on a maximum PCB size of 24” W by 59” L. On the fly vision insures accurate placement and reduced component pick errors. While CRI has always been able to place down to 0201 discrete components, recent customer requests prompted the selection of the FUJI AIMEX III.

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Optimal Electronics Announces Addition of Robotics Expert to Its Industry 4.0 Team

AUSTIN, TXOptimal Electronics Corporation, a global provider of smart factory software solutions for the electronics assembly industry, today announced that Mile Ostojic has joined its Industry 4.0 team as the company’s new expert for robotic applications. Ostojic has more than 30 years of R&D and application experience in control systems, robotics and automation.

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Aven 1500W Heat Gun with Digital Temperature Control

Ann Arbor, MI - Aven’s 1500W Heat Gun offers precise heat control with a sharp LCD display. The gun heats rapidly to a minimum of 100-degrees Celsius and a maximum temperature of 650-degrees Celsius.
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At NEPCON China with VisionXP+ Vac and CondensoXC

Rehm presents new equipment for reflow soldering

NEPCON China is one of the most important trade fairs for the electronics sector in Asia. From 29 to 31 August 2017, visitors in Shenzhen can find out about innovations from the world of electronics manufacturing in the areas of consumer electronics, communication, automotive and medical technology. In Hall 1 Booth 1J55, Rehm Thermal Systems is set to present the new VisionXP+ Vac, an efficient system for reflow convection soldering and the CondensoXC, a compact system for reliable condensation soldering. Our team on site is looking forward to your visit!

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DigiKey | Murata and Electric Imp imp005 Transceiver Module Breakout – Another Geek Moment

Pat, from Digi-Key Electronics, give a brief tutorial on setting up the imp005 breakout board from Murata and Electric Imp.

The imp005 wireless transceiver module from Murata and Electric Imp targets end-to-end devices such as sensor data transmission to a piece of equipment or device.
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Tom Salmon, VP Global Member Services & Standards, SEMI at Semicon West 2017

SEMI VP, Tom Salmon chats to SCOOP's Philip Stoten at this year's Semicon West on the topic of Smart everything and what it mean to the association and the industry.

TopLine Rolls Out Graphite Tool for CGA1738 Micro-Coil Spring

Irvine CA   TopLine announces a new Graphite Tool (patent pending) for precision positioning of 0.4mm diameter Micro-coil springs onto BGA1738 organic substrates as an alternative to conventional solder balls. Micro-coil springs, originally introduced by NASA, provide compliant interconnects between IC packages and the Printed Circuit Board (PCB).

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Alpha’s Latest Product Innovations Target Voiding Issues

Somerset, NJ  Alpha Assembly Solutions, the world leader in the production of electronic soldering and bonding materials, addresses the issue of voiding with its latest selection of advanced product technologies.

Voiding is a common issue in PCB Assembly and is caused by volatile ingredients in the solder paste. Voiding can occur anywhere in the solder joint and is especially problematic as it reduces the mechanical properties and thermal conductivity of solder joints.

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Koh Young Americas Adds Strategic Marketing & Sales Capability

Chandler, AZIn a strategic move by the world’s leading True 3D measurement company to further accelerate its growth and continue delivering best-in-class intelligent inspection solutions, Koh Young Americas has hired Brent Fischthal for the newly created position of Senior Manager for Americas Marketing and Eastern Regional Sales. 

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PI's Latest Nano-Positioning and Precision Motion Control Systems Display at Optics+Photonics 2017

New silicon photonics (SiP) alignment engines will be a fan favorite, along with precision motion and control technologies, at Optics+Photonics in San Diego, starting August 6, 2017.

Auburn, MA – Optics & Photonics is known as the premier show in North America for the latest advancements in optical engineering and applications, nanotechnology, sustainable energy, organic photonics, and astronomical instrumentation. In San Diego next week, PI’s booth will feature the latest state-of-the-art precision motion technologies and interactive displays of nanopositioning components, with PI engineers on-hand to answer questions and help you find the right solution for your precision motion project in industry, research, or science.

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SMT Hybrid Packaging 2018: “Call for Tutorials” Is Launched

NUREMBERG, GERMANY - SMT Hybrid Packaging starts the event year as usual with the “Call for Tutorials”: interested users and experts from industry and academia are invited to submit their contribution about electronic assembly production.

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TEBIS to Feature Release 4 of Its Current Version 4.0 at WESTEC 2017

TROY, MI - Tebis America, a leading software company specializing in CAD/CAM systems for design and manufacturing servicing the tool, die, mold, automotive and aerospace manufacturing industries will feature the latest release of its Version 4.0 at WESTEC 2017, Booth No. 1823, September 12-14, 2017, Los Angeles.

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Dr. Mike Bixenman Receives Best Paper Award for His Presentation at ICSR

NASHVILLE, TN - KYZEN is pleased to announce that Dr. Mike Bixenman, DBA, received the ‘Best of Presentation’ Award at the 2017 International Conference on Soldering and Reliability (ICSR) for his paper entitled “Reliable Microelectronic Assembly Process Design Test Methods – A Non-Standard Approach.” The award is determined through the evaluations of those that attended the presentation.

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TDM Systems to feature Tool Data Management of the future at WESTEC 2017

SCHAUMBURG, IL - TDM Systems, a leading provider of tool data management in the machining industry will present its new generation of software for Tool Lifecycle Management at WESTEC 2017, Booth No. 2446, September 12-14, 2017, Los Angeles.

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FRAMOS and PYXALIS Expand Cooperation Worldwide for High Performance Custom Image Sensors

MUNICH, GERMANY - FRAMOS as a leading global image sensor distributor, and PYXALIS, as an advanced custom image sensor supplier, have extended their collaboration. FRAMOS has been working with PYXALIS for several years and, after a very productive relationship, have entered into a formal agreement.
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Würth Elektronik eiSos Group intensifies its Formula E technology partnership: A furious end of the racing season, a major step forward for eMobility

WALDENBURG, GERMANY - The situation couldn’t have been more thrilling: last weekend’s race in Montreal marked the end of an exciting season of the world’s first electric racing series. The hard battle has been won: Lucas di Grassi is the new Formula E world champion.

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Metals Recycler Conecsus Partners with Amerway, Cobar for ‘Cradle to Grave’ Solution

 (L-R) Tim Brown and Terry Buck, Amerway Inc.; Steve Butler and Tom Mitchell,       Conecsus, LLC.

Terrell, TX - Conecsus, LLC, announced today that they are partnering with Amerway Inc., and COBAR Balver Zinn Solder Products, two leading global solder manufacturers, to provide a ‘cradle to grave’ solution for electronics manufacturers. Conecsus, LLC is an ISO 14001 EMS certified recycling company and a refiner of SMT solder/solder paste wastes and residues, as well as Tin, Lead, Antimony, Silver, Gold, and other metals from a variety of manufacturing industries. Conecsus converts these wastes into usable metal products, paying cash to the customer.

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Revolutionary AOI, AXI and & Bondtesting from Nordson at NEPCON South China

AYLESBURY, UK/FELDKIRCHEN, GERMANY - Nordson DAGE, Nordson MATRIX, and Nordson YESTECH, divisions of Nordson Corporation, will exhibit in Stand 1H20 at NEPCON South China, scheduled to take place August 29-31, 2017 at the Shenzhen Convention & Exhibition Center. Test and inspection solutions from Nordson DAGE, Nordson MATRIX and Nordson YESTECH will be demonstrated at the event.

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Indium Corporation Launches New Solder Paste for Fine Feature Printing

CLINTON, NY - Indium Corporation has released Indium11.8HF-SPR (T5-MC) Solder Paste – a new air and nitrogen reflow, no-clean, Pb-free solder paste designed to meet the fine feature printing requirements of mobile manufacturers.

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