Sunday, April 30, 2017
VOLUME - NUMBER
Advertisements
Home/Current Issue >  Daily News Archive > 

Mill-Max Introduces Discrete Insulated Pins and Receptacles

OYSTER BAY, NY - Mill-Max is pleased to announce a new selection of insulated terminals. Six popular Mill-Max pins and receptacles have been fitted with cylindrical insulating sleeves for electrical isolation applications. The new offerings include three header pins, two receptacles and one solder cup pin to suit a variety of uses.

Read More

America II Adds Two Lines to Its Global Channel Partnership

Global Distributor Continues to Grow its Vast Supply Chain

ST. PETERSBURG, FL - America II Electronics, Inc., one of the world’s largest distributors of semiconductors and electronic components, today announced it has signed franchise distribution agreements with two manufacturers.
 

Read More

MIRTEC Europe to Exhibit at SMT/Hybrid/Packaging 2017

MIRTEC, “The Global Leader in Inspection Technology,” today announced they will display their award-winning 3D AOI and SPI Inspection Systems in pb tec’s booth, in Hall 4A, Stand 140 at the upcoming SMT/Hybrid/Packaging Show, scheduled to take place May 16-18 at the Messe in Nuremberg, Germany.
 

Read More

Park Electrochemical Corp. Announces Consolidation of Its U.S. Electronic Materials Business Units

MELVILLE, N.Y - Park Electrochemical Corp. (NYSE:PKE) announced the consolidation of its Nelco Products, Inc. electronics Business Unit located in Fullerton, California (“NPI”) and its Neltec, Inc. electronics Business Unit located in Tempe, Arizona (“Neltec”).
 

Read More

Microtronic GmbH to Show Sonix ECHO™ Scanning Acoustic Microscope at SMT Hybrid Packaging

MUNICH, GERMANY - Microtronic GmbH, a leading sales specialist of microelectronics, today announced plans to show the Sonix ECHO™ scanning acoustic microscope in Stand 221j in Hall 5 at SMT Hybrid Packaging, scheduled to take place May 16-18, 2017 in Nuremburg, Germany.
 

Read More

Ironwood Electronics: Socket your Quad Flat No Lead package using elastomer socket with superior electrical performance

EAGAN, MN - Ironwood Electronics has recently introduced a new high performance elastomer socket for 0.4mm pitch QFN package. The CG25-QFN-2003 socket is designed for a 5mmx5mm package size and operates at bandwidths up to 40 GHz with less than 1dB of insertion loss (GSSG configuration).
 

Read More

BTU to Demo the Updated WINCON Control System at SMT Hybrid Packaging 2017

NORTH BILLERICA, MA - BTU International, Inc., a leading supplier of advanced thermal processing equipment for the electronics manufacturing and alternative energy markets, today announced plans to exhibit with EPP Electronic Production Partners GmbH at SMT Hybrid Packaging.
 

Read More

KYZEN’s Newest Innovation, the KYZEN ANALYSTTM, Will Be Launched at SMT Hybrid Packaging 2017 this May!

NASHVILLE, TN - Today KYZEN announced plans to introduce the new KYZEN ANALYST in Europe this spring at SMT Hybrid Packaging 2017. KYZEN will have live, on-site demonstrations of their latest innovation, the KYZEN ANALYST, at the show in Hall 4A, Stand 536.
 

Read More

Knowles Capacitors Show Impressive Product Line Up at Space Tech 2017

NORWICH, UK - To coincide with Space Tech Expo, taking place in Pasadena, California, USA over May 23 to 25, Knowles Capacitors has produced a new shortform capability guide outlining their range of Space Heritage products.

Read More

epoxySet: EO-98HT, Very High Temperature, Electrically Conductive Adhesive

LINCOLN, RI - epoxySet presents the EO-98HT, electrically conductive epoxy for electrical circuits, LED attachment, die attach and grounding applications. With a volume resistivity of approximately 10-4 ohm-cm, the EO-98HT is an excellent choice for solder replacement or circuit/wire bonding where high conductivity and reliability are required.
 

Read More

Live Demonstrations will be available on Nordson DAGE, Nordson MATRIX and Nordson YESTECH Inspection Systems at SMT

AYLESBURY, UK - Nordson DAGE, Nordson MATRIX, and Nordson YESTECH, divisions of Nordson Corporation, today announced that they will exhibit in Hall 4A, Stand 214, at the upcoming SMT/Hybrid/Packaging scheduled to take place May 16-18 at the Messe in Nuremberg, Germany.

Read More

Vi TECHNOLOGY to Exhibit Full Inspection Solution at SMT/Hybrid/Packaging

Saint-Egrève, France - Vi TECHNOLOGY, a leading provider of inspection solutions for PCB assembly, will exhibit in Hall 4A, Stand 240 at SMT/Hybrid/Packaging, scheduled to take place May 16-18, 2017 at the Messe in Nuremberg, Germany.
 

Read More

InnovationsFORUM Hungary Reflects Changes In Manufacturing Landscape

Budapest, Hungary - From the keynote through each and every presentation, the 2017 InnovationsFORUM Hungary, held on May 25th at The Hungarian Academy of Science in Budapest, reflects the changes that are occurring in Eastern European manufacturing and the desire to utilize innovation at every point in the product lifecycle.
Read More

SEHO Focuses on 100% Process Control

ERLANGER, KY - SEHO Systems GmbH, a worldwide leading manufacturer of complete solutions for soldering processes and automated production lines, will focus on automatic process control in Hall 4, Stand 129 at the upcoming SMT/Hybrid/Packaging show, scheduled to take place May 16-18, 2017 at the Messe in Nuremberg, Germany.
 

Read More

CyberOptics to Demonstrate Breakthrough Multi-Reflection Suppression (MRS) Sensor Technology at SMT/Hybrid/Packaging

MINNEAPOLIS, MN - CyberOptics® Corporation, a leading global developer and manufacturer of high-precision 3D sensing technology solutions, will display an advanced Ultra-High Resolution Multi-Reflection Suppression (MRS) sensor for the CyberOptics’ SQ3000® 3D Automated Optical Inspection (AOI) system in Hall 4, Stand 101 at the upcoming SMT/Hybrid/Packaging, scheduled to take place May 16-18, 2017 at the Messe in Nuremberg, Germany.

Read More

SMT Xtra Celebrates 10-Year Milestone at SMT Hybrid Packaging 2017

MARYVILLE, TN - SMT Xtra, a leading provider of productivity enhancing solutions for the global surface mount electronic assembly sector, today announced plans to exhibit at SMT Hybrid Packaging, scheduled to take place May 16-18, 2017 in Nuremburg, Germany.
 

Read More

Digi-Key: TDK Corporation NTCG Series Thermistors


Scienscope to Showcase Automated Component Counters at NEPCON China

CHINO, CA - Scienscope International, a complete inspection solutions provider, today announced plans to exhibit in Stand 1H22 at NEPCON China, scheduled to take place April 25-27, 2017 at the Shanghai World EXPO Exhibition & Convention Center.
 

Read More

Indium Corporation Expert to Present at RaMP2017 Workshop

CLINTON, NY - Indium Corporation’s Karthik Vijay, Technical Manager for Europe, Africa, and the Middle East, will present at the RF and Microwave Packaging (RaMP) 2017 Workshop on April 26-27, in Paris, France.

Karthik will present Enhanced Thermal Management with Compressible Solder Thermal Interface Materials (TIMs) and Engineered Low-Voiding Solder Preforms.

Read More

Alpha to Showcase Preform Technology at National Electrical Wire Processing Technology Expo

SOMERSET, NJ - Alpha Assembly Solutions, the world leader in the production of solder preforms for the cable interconnect and connector termination market, will exhibit for the first time at the 17th Annual National Electrical Wire Processing Technology Expo taking place May 10 – 11 in Milwaukee, Wisconsin.

Read More
 
 
search login