Tuesday, May 24, 2016
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Engineered Material Systems to Showcase Adhesives for Stringing and Shingling Next Generation Solar Modules at Intersolar/EU PVSEC
Publication Date: 5/9/2016

DELAWARE, OH - Engineered Material Systems, Inc. (EMS), a leading global supplier of conductive interconnect materials for photovoltaic applications, will exhibit its new 561-400 series Low-Cost Snap Cure Conductive Adhesives at the Intersolar/EU PVSEC show, scheduled to take place June 23-25, 2016 in Munich.
Libra Industries Announces New Senior Account Manager
Publication Date: 5/9/2016

MENTOR, OH - Libra Industries, a privately held electronics manufacturing services (EMS) provider, is pleased to announce the appointment of Dan Rekieta – Senior Account Manager.

Dan Rekieta started out his career in the electronics manufacturing industry more than 34 years ago with Texas Instruments, first as a PCB designer/drafter, and then as a PCB design supervisor. He joined ACD (now Libra Industries) in 1991, and is excited to rejoin Libra Industries’ Dallas facility.
Acculogic Will Show Advanced Test Equipment at the Space Tech Expo
Publication Date: 5/9/2016

MARKHAM, ON - Acculogic Inc., a global leader in electronic production test solutions, announces that it will exhibit in Booth #4031 at the Space Tech Expo, scheduled to take place May 24-26, 2016 at the Pasadena Convention Center in Pasedena, California.
Computrol Strengthens Its Functional Test Capabilities with a SPEA 4050 Flying Probe Tester
Publication Date: 5/9/2016

MERIDIAN, ID - Computrol, Inc., a world-class provider of mid- to low-volume, high-mix electronic manufacturing services to OEMs, today announced that it has purchased and installed a SPEA 4050 Flying Probe Tester. The addition of the SPEA flying probe at Computrol’s Meridian, ID facility further strengthens the company’s extensive functional test capabilities. Features of the SPEA 4050 include:
Digi-Key Daily
Publication Date: 5/9/2016

TE Connectivity's KILOVAC KHR500 BUBBA II high voltage 600 A contactors are a smaller, lighter version of the EV500 BUBBA contactors. The KHR500 series is non-polarized allowing bi-directional switching and is offered in a wide voltage range of 28VDC - 1000VDC input. HKR500 is ideal for applications including marine, aerospace, solar, and energy storage systems. TE's KHR500 contactors are available at Digi-Key.

TTI, Inc. Participates in Upcoming Wiring Processing Technology Expo – Booth #1149
Publication Date: 5/6/2016

FORT WORTH, TX - Join global electronic components distributor, TTI at the upcoming National Electrical Wire Processing Technology Expo, May 11-12, to be held at the Wisconsin Center in Milwaukee, Wisconsin.

Visit the Specialists at booth #1149, Wednesday, May 11, 9:00 a.m. to 4:00 p.m. and Thursday, May 12, 9:00 a.m. to 3:00 p.m. to learn about TTI’s extensive line offering of connectors, switches, relays and the accessories you need.
APEM Launches Custom 16MM Secret-Until-Lit LED Indicator
Publication Date: 5/6/2016

VISTA, CA - APEM, Inc., a leading global manufacturer of human-machine interface products, brings you the newest option to the Q Series Indicator range: the 16mm Secret-Until-Lit LED indicator.

APEM’s Q16 Secret-Until-Lit LED Indicators feature a black polycarbonate insert that gives you the ability to hide a specific custom legend until the indicator illumination is turned “ON”.
Europlacer: Component Storage Captivates Visitors at Nepcon Shanghai.
Publication Date: 5/6/2016

 Europlacer’s Nepcon Shanghai booth featuring the Lzero3 intelligent storage tower
DORSET, UNITED KINGDOM - China manufacturers visiting the Nepcon Shanghai event confirmed that efficient ways of managing SMT stock is an increasing priority in their production landscape. Time wasted searching for stock locations and retrieving inventory is now impeding optimum productivity. The result was exceptionally high levels of interest in line-side storage solutions such as Europlacer’s intelligent Lzero3 tower.
Akrometrix Announces the Release of the CRE6, Convection Reflow Emulation for Warpage Metrology
Publication Date: 5/6/2016

ATLANTA, GA - Akrometrix, LLC, the leading provider of thermal warpage and strain metrology equipment to both the front- and back-end semiconductor and electronics industries, today announced that the company released its next-generation Convection Reflow Emulation Module (CRE6) for warpage metrology.
Henkel Partners with Tekra to Expand Coverage of its Electronic Inks Business in North America
Publication Date: 5/6/2016

IRVINE, CA - Henkel Adhesive Technologies’ Electronics business today announced a new distribution partnership with plastic film and adhesives solutions provider, Tekra, A Division of EIS, Inc. Under the terms of the agreement, Tekra will deliver sales, technical consultation and post-sale service for Henkel’s full line of electronic ink materials in support of customers throughout North America.
SHENMAO Presents Technical Paper at SMTA/ICSR Conference
Publication Date: 5/5/2016

SAN JOSE, CA - SHENMAO Technology, Inc. will present the technical paper “A New Dispensing Solder Paste for Laser Soldering Technology” at the 10 th. Anniversary of the SMTA International Conference of Soldering and Reliability 2016 in Toronto, Canada, featuring advancements in newly developed composition of Powder, Fluxes and produces best dispensibility, minimal flux residue, no-splash or solder balling issues and minimal and smaller voids.
Alpha Assembly Solutions to Present Latest Product Innovations for Die Attach Applications at the Exhibitor Forum at PCIM, Nuremberg
Publication Date: 5/5/2016

SOMERSET, NJ - Alpha Assembly Solutions, the world leader in the production of electronic soldering and bonding materials, will present at the Exhibitor Forum at the PCIM Exhibition which will be held at the Exhibition Centre in Nuremberg, Germany on Tuesday 10th – Thursday 12th May.
Melissa Grupen-Shemansky Appointed SEMI’s CTO for Flexible Electronics and Advanced Packaging
Publication Date: 5/5/2016

SAN JOSE, CA - SEMI today announced the appointment of Melissa Grupen-Shemansky, Ph.D., as Chief Technology Officer (CTO) for the FlexTech Group and for SEMI’s Advanced Packaging program. With over 20 years of experience in the semiconductor industry, Grupen-Shemansky has a strong background in R&D, manufacturing, business development, and technology strategy.
New widefield confocal microscope ZEISS Smartproof 5 for industrial applications
Publication Date: 5/5/2016

OBERKOCHEN, GERMANY - The new ZEISS Smartproof 5 widefield confocal microscope is designed for a wide range of industrial applications in quality assurance and quality control departments, production environments and R&D labs.

Keystone Electronics: New SMT Coin Cell Contacts for Battery Enclosures
Publication Date: 5/5/2016

ASTORIA, NY - Keystone Electronics has recently introduced additional contacts into its diverse selection of SMT enclosure coin cell contacts providing more design versatility for cost effective, dependable connections in self-contained battery compartments.

These new contacts require minimal board space while allowing easy installation and removal of a coin cell battery within a battery enclosure.
Scienscope Enters Exclusive Representative Agreement with ARK Manufacturing Solutions, LLC for Arizona, New Mexico and Sonora, Mexico
Publication Date: 5/5/2016

CHINO, CA - Scienscope International, a complete inspection solutions provider, has appointed Ark Manufacturing Solutions as its exclusive manufacturers’ representative in the Southwestern U.S. ARK Manufacturing Solutions will represent Scienscope’s state-of-the-art X-ray cabinet systems.
TRI Selected as Best Supplier by EM Asia Readers
Publication Date: 5/4/2016

 TRI VP Jim Lin receives EM Asia Best Supplier award at NEPCON China 2016
TAIPEI, TAIWAN - Test Research, Inc. (TRI) is proud to announce it has been recognized as the Best Supplier of the Year by readers of EM Asia, the leading industry magazine in East Asia. VP of sales Jim Lin received the award at a ceremony held during NEPCON China 2016 and commented on the opportunity: "We are excited that the industry continues to recognize TRI's commitment to our customers and we will continue to deliver the most advanced PCBA test and inspection solutions with outstanding service and support".
Nordson MARCH’s Compact ModVIA Plasma System is Easily Expandable from 4 to 8 Cells to Increase Machine Capacity for Production Demands
Publication Date: 5/4/2016

CONCORD, CA - Nordson MARCH, a Nordson company (NASDAQ:NDSN), a global leader in plasma cleaning technology, introduces its ModVIA™ plasma system, a fully integrated, flexible system that doubles its capacity from 4 to 8 cells (8-16 panels) to easily accommodate manufacturing production growth. The ModVIA’s compact design and small footprint save valuable floor space while delivering the same time-tested results and proven technology to treat printed circuit boards for desmear, etchback, and to provide surface activation, like other systems in the Nordson MARCH VIA™ family.
U.S.Tech at EDS and EWPTE
Publication Date: 5/4/2016

After two major international shows, SMT Nuremberg and NEPCON China, U.S.Tech comes home for a pair of domestic exhibitions. Jacob Fattal will be traveling to Las Vegas for EDS, May 10-13, and Joe Zummo will make an appearance in Milwaukee at the Electrical Wire Processing Technology Expo (EWPTE), May 11-12.

Hallmark Nameplate Selects Ersa’s Smartflow 2020 Selective Soldering System
Publication Date: 5/4/2016

PLYMOUTH, WI - Kurtz Ersa North America, a leading supplier of electronics production equipment, is pleased to announce that it has installed a Smartflow 2020 selective soldering system at Hallmark Nameplate, Inc.’s ESD-controlled manufacturing facility in Florida. Hallmark Nameplate offers through-hole, surface mount, or mixed-PCB assembly services.
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