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LPKF: Laser Solutions for the Medical Device Industry at MD&M West
Publication Date: 12/28/2016

TUALATIN, OR - LPKF Laser & Electronics has announced it will exhibit at the 2017 MD&M West Exposition, which takes place February 7-9 at the Anaheim Convention Center in Anaheim, Calif. LPKF, a manufacturer of laser systems for a variety of applications, will showcase its solutions for the medical device industry in booth 1650.
Keystone Electronics: New Surface Mount Threaded Standoffs for PC Boards
Publication Date: 12/28/2016

ASTORIA, NY - Keystone Electronics has introduced a new series of threaded standoffs specifically designed and packaged for use on PC Boards in the same manner as other surface mount components.

Manufactured from steel with a tin plate, these standoffs can be added to the board using the same SMT equipment used to populate the board, reducing scrap and handling time while minimizing damage to a PCB that may occur while using traditional mounting products ensuring easy reflow soldering for reliable solder joints.
Leading2Lean’s TraceCloud Engine Saves Manufacturers Millions of Dollars by Connecting Traceability Systems Among Numerous Plants
Publication Date: 12/27/2016

RENO, NV —Leading2Lean, a cloud-based lean manufacturing solutions provider, has introduced TraceCloud, a new CloudDISPATCH engine designed to identify possible manufacturing problems across disparate systems in different plants. TraceCloud purports to eliminate the cost and risk of removing existing traceability systems and replacing them with a standardized system across all plants—an expense of upwards of tens of millions of dollars.
MIRTEC Europe Awards Ankatek of Turkey Achievement Award
Publication Date: 12/21/2016

PLYMOUTH, UNITED KINGDOM - MIRTEC, “The Global Leader in Inspection Technology,” announces that Ankatek of Turkey has been awarded the 2016 Achievement award as the distributor who has really gone above and beyond. In Ankatek’s case, that means breaking into a previously dormant market.
Customer-Oriented Service and Acquisitions Boost Würth Elektronik eiSos
Publication Date: 12/21/2016

 CEOs of Würth Elektronik eiSos, Oliver Konz (left) and Thomas Schrott
WALDENBURG, GERMANY - For the first time in the company’s history, Würth Elektronik eiSos has surpassed the 500 million euro sales mark. The global growth of the supplier of electronic and electromechanical components continued in 2016, with the company strategically investing in acquisitions in high-growth technology and application areas. The company attributes the reasons for its success to its consistent focus on quality and service.
LPKF Announces First Sales of the New ProtoLaser R in Asia
Publication Date: 12/20/2016

TUALATIN, OR - For the past 40 years, LPKF has been the global market leader in the field of systems for manufacturing PCBs in development laboratories. And now the Garbsen-based company is rounding off the high-end of this segment with a world first: the ProtoLaser R is the first system optimized for the use in development departments using an ultrashort picosecond pulse laser, allowing it to work on highly sensitive materials thanks to the lack of heat input. With its compactness and price, the LPKF ProtoLaser R is currently one of a kind on the market.
Schaeffler Expands Expertise in Electric Mobility
Publication Date: 12/20/2016

NUREMBERG, GERMANY - The automotive and industrial supplier Schaeffler has today concluded a purchase contract with SEMIKRON International GmbH for the acquisition of 51% of the shares of Compact Dynamics GmbH, a manufacturer of high-performance electric motors. At the same time, Schaeffler and SEMIKRON have agreed a cooperation for the development of power electronics systems and the integration of power electronics components.
 
SCHMID Group: KSG orders DES line with New Etching Options
Publication Date: 12/20/2016

FREUDENSTADT, GERMANY - An etching speed increased by up to 25 %, line/space structures of less than 50 μm and etching factors greater than 6: With the New Etching Options SCHMID enables an etching process with qualities that were considered hard to achieve until recently.
 
Mr. Paul Mason Appointed Wacker Chemical Corporation Vice President & Chief Financial Officer
Publication Date: 12/20/2016

 Mr. Paul Mason; Wacker Vice President & Chief Financial Officer. Photo: Wacker Chemical Corporation.
ADRIAN, MI - Mr. Paul Mason has been appointed Wacker Chemical Corporation Vice President & Chief Financial Officer. He succeeds Dr. Tobias Brandis who is returning to Germany as President - WACKER POLYSILICON, taking over for Mr. Ewald Schindlbeck who is retiring after 33 years with the company.

In making the announcement, David Wilhoit, Wacker Chemical Corporation President & CEO, commented that Mr. Mason brings to WACKER a well-defined portfolio of expertise and skills to oversee the company’s Finance, Accounting, Tax, IT and Procurement departments.
 
IDT Launches Industry’s Highest Efficiency 15W Turnkey Wireless Power Reference Kit
Publication Date: 12/19/2016

SAN JOSE, CA - Integrated Device Technology, Inc. (IDT) (NASDAQ: IDTI) today introduced a high-efficiency 15W wireless power reference design kit, delivering the same ease of use and product support collateral that have become the hallmark of the Company’s wireless power kits.
 
Digi-Key: Bel ABC/MBC Low-Profile Series Power Supplies
Publication Date: 12/19/2016

Hitachi FT150 Micro-XRF Added at Eastern Applied Research
Publication Date: 12/19/2016

BUFFALO, NY - An Authorized Distributor of Hitachi High-Tech Science Corporation, Eastern Applied Research, is pleased to add the Hitachi FT-150 Micro-XRF Analyzer at their Western NY facility. The Hitachi FT-150 is designed for ultra thin film measurements and micro-spot analysis needs - and will be available for third party testing services plus demonstrations and review for organizations looking to add a premier poly-capillary x-ray fluorescence spectrometer for long-term testing needs.
Ironwood Electronics: Socket and Test Your 14x10mm BGA Device Using Extreme Temperature Socket
Publication Date: 12/19/2016

EAGAN, MN - Ironwood Electronics recently introduced a new Stamped spring pin socket addressing high performance requirements for testing BGA208 - CBT-BGA-7041. The contactor is a stamped spring pin with 31 gram actuation force per ball and cycle life of 125,000 insertions. The self inductance of the contactor is 0.88 nH, insertion loss < 1 dB at 15.7 GHz and capacitance 0.097pF. The current capacity of each contactor is 4 amps at 40C temperature rise.
Computrol, Inc. Speeds up Production Times with the Installation of Five New Intelligent Component Storage Systems
Publication Date: 12/16/2016

MERIDIAN, IDAHO - Computrol, Inc., a world-class provider of mid- to low-volume, high-mix electronic manufacturing services to OEMs, is pleased to announce that it has installed five Europlacer LZero3 Component Storage Systems at its Meridian facility. The Lzero3 networks with existing MRP/ERP systems and pick-and-place machines to efficiently pick and restock factory works orders.
 
Accurex Solutions of India Wins MIRTEC Europe 2016 Sales Award
Publication Date: 12/16/2016

PLYMOUTH, UNITED KINGDOM - MIRTEC, “The Global Leader in Inspection Technology,” today announced that Accurex Solutions of India has won their 2016 Sales Award, leading in equipment sales for all MIRTEC Europe distributors. For 29 years, Accurex Solutions has been the leading manufacturers’ supplier and service provider in India.
Advanced Interconnections Adds 3.4mm stack height Mezza-pede® SMT Connector
Publication Date: 12/16/2016

WEST WARWICK, RI - Advanced Interconnections Corp. has extended its line of Mezza-pede® SMT Connectors with a new lower profile header (model DHAL) which reduces board stack height by 15%. The innovative design features an ultrathin insulator, at only 0.025 inch (0.63mm) – half the thickness of the original header design. When paired with mating socket model DHS, a z-axis stack height of 0.132 in. (3.4mm) is achievable.
 
PI’s Award-Winning Fast Multichannel Photonics Alignment Engine
Publication Date: 12/15/2016

AUBURN, MA - The FMPA Fast Multichannel Photonics Alignment Engine is an advanced alignment system based on a highly specialized digital motion controller with embedded advanced alignment and tracking functionality and a hybrid precision scanning and tracking mechanism combining the advantages of piezoelectric on servo-motorized drives.
Libra Industries Completes Advanced SPI Training with Omron
Publication Date: 12/15/2016

MENTOR, OH - Libra Industries, a privately held electronics manufacturing services (EMS) provider, today announced that Glenn Watson – Quality Manager and Joel Wolnik – Production Manager, recently completed SPI training at Omron’s Chicago facility. Libra Industries recently installed four Omron CDK VP5200-V Solder Paste Inspection systems in multiple locations, and the training gave some of the company’s team members a more in-depth look at the system’s capabilities.
Pillarhouse USA Has Strong 4th Quarter Performance
Publication Date: 12/15/2016

ELK GROVE VILLAGE, IL - With the end of 2016 fast approaching, Pillarhouse USA Inc. are pleased to report that, after what has been a difficult trading year for many US companies, they are bucking the trend and their Q4 sales are proving exceptionally strong.

When asked for comments on the Pillarhouse USA’s recent performance, Jonathan Wol, President, commented “Following average Q2 sales figures, we saw a large increase in overall sales activity and purchase orders placed in Q3.
 
Alpha Facility in Altoona, PA Receives ITAR Certification
Publication Date: 12/15/2016

SOMERSET, NJ - Alpha Assembly Solutions, the largest solder manufacturer and recycler in North America, announces their facility in Altoona, Pennsylvania is now ITAR certified.

As an ITAR (International Trade in Arms Regulations) certified service provider, Alpha, a part of the MacDermid Performance Solutions group of businesses, can assure that scrap boards do not leave the United States, which is of particular concern to those manufacturing military and aerospace electronics who have to disassemble and dispose of assemblies without compromising the top secret design of the circuit.
 
 
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