Tuesday, October 24, 2017
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Nippon Pulse introduces four-axis FMAX box controller with built-in driver

RADFORD, VA – Nippon Pulse is excited to announce its first box-level controller to join its chip and board controller product lines. The FMAX-4X-2SD is a box controller for up to four axes of movement, with built-in servo drivers for the X and Y axes. The X and Y axes can control rotary and linear brushless motors, such as Nippon Pulse’s Linear Shaft Motor servo; the Z and U axes can control other types of motors by connecting additional drivers.


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Metcal Introduces Digital Hot Air Pencil for Light Rework Applications

CYPRESS, CA ― October 13, 2017 ― Metcal today announced the introduction of its new HCT2-200 Digital Hot Air Pencil. The HCT2-200 is the latest addition to Metcal’s line of convection rework tools. This digital handheld convection tool is designed for use in light rework applications that use smaller components and integrated circuits.


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Fujipoly: Reinforced Thermal Interface Thin Film

Carteret, NJ — Sarcon® 20GAR from Fujipoly® is a high-performance, glass fabric reinforced thermal interface material that is perfect for complex die-cut shapes. It delivers a thermal conductivity of 3.0 W/mK while exhibiting a thermal resistance of only .17°Cin2/W.


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Compact 6-Axis Motion Controller for High Precision Positioning Applications in Industry and Research

PI’s new cost-efficient servo motor controller drives 6 and 4 axis motion systems.

Auburn, MA – Precision positioning systems industry leader PI (Physik Instrumente) has released a new 6-axis servo motor controller – the C-884.6DC. Most modern precision motion systems are driven by servo motors, because they provide high torque, fast acceleration, smooth motion with a wide dynamic speed range, and fast start stop performance. 


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Nordson DAGE to Discuss Its Wafer X-ray Metrology Platform at IWLPC

Booth #1

AYLESBURY, UK - Nordson DAGE, a division of Nordson Corporation, announces plans to exhibit at the 14th annual International Wafer-Level Packaging Conference (IWLPC) Expo, scheduled to take place Oct. 24-26, 2017 in San Jose, CA. The Nordson DAGE inspection experts will discuss the XM8000 Wafer X-ray Metrology Platform in Booth #1.
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ASM’s Wide Range of Smart Manufacturing Tools and Solutions Is a Visitor’s Magnet

SUWANEE, GA - An overall positive mood in the Northern American electronics manufacturing industry was reflected by large visitors at SMTA International 2017, September 19-20, in Rosemont, Illinois. Clearly the most prominent topic of interest: smart manufacturing tools and concepts and how to realize them.
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Indium Corporation Features Indium3.2HF Solder Paste for Fine Feature Printing at IWLPC 2017

CLINTON, NY - Indium Corporation will feature its Indium3.2HF Solder Paste at the 14th International Wafer-Level Packaging Conference (IWLPC 2017—Silicon to Systems), Oct. 24-26, in San Jose, Calif.

Indium Corporation’s Indium3.2HF is an air or nitrogen reflow, water-soluble solder paste specifically formulated for fine feature printing applications (Type 6SG). 

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WAGO Names New General Manager for Mexico

GERMANTOWN, WI - WAGO North America has named Daniel Hernandez as the new general manager for Mexico. Hernandez holds a degree in Mechanical Engineering, as well as, a Masters of Business Administration. He worked in varying management roles for IMI Norgren, an automation company, before becoming General Manager for CKD, a Japanese automation company, in which he was responsible for starting the company in Mexico.
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KIC releases new smart technology for real-time insight into reflow and wave solder processes

SAN DIEGO, CA - KIC is pleased to announce the release of its new Vantage network software system. The new software provides a real-time dash-board for thermal processes, accessible anywhere, from any authorized PC or mobile device.
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Viscom presents powerful 3D AOI and SPI with ultra-modern data exchange for Industry 4.0 at SMTA Guadalajara

HANOVER, GERMANY - Viscom is pleased to announce plans to exhibit the 3D AOI system S3088 ultra gold and 3088 basic at SMTA Guadalajara Expo & Tech Forum, scheduled to take place Oct. 18-19, 2017 at Hotel Riu Guadalajara. Viscom will showcase its latest high-performance 3D AOI and SPI systems – S3088 series – along with a number of exciting new 3D imaging features and the new Viscom Open Interface 4.0. 

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Avnet Opens Registration for Global MiniZed SpeedWay Design Workshop Series: Training gives engineers head start in mastering design flows using Xilinx’s Vivado Design Suite

PHOENIX, AZ - Avnet, a leading global technology distributor, today announced that registration is now open for a series of interactive SpeedWay Design Workshops™ to help engineers jump start the development of single-core Xilinx® Zynq®-7000 All Programmable SoC devices using the Avnet MiniZed™ Zynq SoC development kit, a cost-optimized prototyping platform for embedded vision and Industrial IoT systems.
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Coto Technology Awarded "Best of Show" (Silver) at Sensors Midwest 2017

New RedRock TMR Magnetic Sensors Capture Attention of Electronic Engineers/Designers

ROSEMONT, IL - Coto Technology has been awarded Sensors Midwest's Best of Show "Silver" award for its newly-released RedRock TMR RR121 Magnetic Sensor. Seeking to replace aging magnetic sensor technology, the RR121 represents a huge breakthrough for design engineers seeking the lowest possible power consumption and highest sensitivity in an ultra-miniature package.
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Libra Industries Hires Senior PCB Designer

MENTOR, OH - Libra Industries, a privately held electronics manufacturing services (EMS) provider, is pleased to announce that it has hired Alan Vannasy as a Senior PCB Designer. Vannasy is an electronics packaging designer with more than 12 years of experience in the design and development of new mechanical designs and printed circuit board designs, from initial concept to production.
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Specialty Coating Systems Debuts New-Generation Omegameter SMD 650 Ionic Testing System

INDIANAPOLIS, IN - Specialty Coating Systems (SCS) announced today the launch of the Omegameter SMD 650, the next-generation, software-controlled Omegameter ionic contamination test system.

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Alpha to Showcase Latest Products for SMT Assembly at productronica, Munich, Germany

Hall B3, Booth 272

SOMERSET, NJ - Alpha Assembly Solutions, the world leader in the production of electronic soldering and bonding materials, will be exhibiting its latest range of product solutions, alongside its sister company MacDermid Enthone Electronics Solutions, at the productronica exhibition in Munich, Germany from Tuesday 14th – Friday 17th November. 

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Pillarhouse International: Selective Meets The Wave

Productronica 2017, Hall 4 Booth 220

CHELMSFORD, UK - Over recent years there has been a big push to try and remove wave soldering from the through -hole assembly process. This is not always possible. Common wave associated problems such as bridging between pins and skipped joints etc. inevitably require a high reliance for a re-work function with this mode of operation.

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Pickering Interfaces to Introduce New PXI and LXI Switching Solutions at productronica 2017

Booth A1.452

CLACTON-ON-SEA, UK - Pickering Interfaces, a leading provider of signal switching and simulation solutions used in electronic test and verification, will showcase their latest high-density PXI and Ethernet LXI Switching & Simulation at productronica 2017 in Munich, November 14th to 17th, Booth A1.452.

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SkyWater Technology Foundry Appoints Thomas Sonderman as President

Veteran semiconductor executive to lead semiconductor wafer manufacturer

BLOOMINGTON, MI - SkyWater Technology Foundry has named Thomas Sonderman as the company President. Effective immediately, Sonderman will be responsible for leading the operations of the semiconductor wafer manufacturing company. Interim-CEO Gary Obermiller, will continue to serve the organization as Chairman of the Board of Directors and provide guidance on strategic planning.
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PACE Delivers 100th PRC 2000 Miniature/Microminiature Repair System to DLA under $1.2 Million Contract

VASS, NC - PACE Worldwide recently delivered the 100th PRC 2000 Miniature/Microminiature Electronic Repair System to Defense Logistics Agency Troop Support, part of a $1.2M contract requiring delivery of 384 total systems.
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Indium Corporation Expert to Present at IWLPC 2017

CLINTON, NY - Indium Corporation’s Dr. Yan Liu, Research Chemist, will present at the 14th International Wafer-Level Packaging Conference (IWLPC 2017—Silicon to Systems), Oct. 24-26, in San Jose, Calif.
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