Tuesday, June 28, 2016
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Ironwood Electronics: 27 GHz Bandwidth Socket for Xilinx FPGA
Publication Date: 6/17/2016

EAGAN, MN - Ironwood Electronics has recently introduced a new high performance BGA socket for 1mm pitch, 2104 pin BGA IC's. The SG-BGA-6444 socket is designed for IC size - 47.5x47.5mm package size and operates at bandwidths up to 27 GHz with less than 1dB of insertion loss.
 
Easier Test of DIMM Sockets with Universal JTAG Hardware
Publication Date: 6/17/2016

EINDHOVEN, THE NETHERLANDS - JTAG Technologies – a specialist in board (PCBA) test solutions based on JTAG and IEEE 1149.x standards announce a new family of hardware adapters specifically designed for testing of a variety of DIMM & SODIMM sockets (sizes and styles) using a JTAG/boundary-scan controller and supporting software.
Techcon Systems to Debut Custom Filling Service at the Farnborough Air Show
Publication Date: 6/17/2016

CYPRESS, CA - Techcon Systems, a product group of OK International and a leading provider of fluid dispensing systems and products, today announced plans to exhibit at the Farnborough International Air Show (Booth #3/A51). The event is scheduled to take place July 11-16th at the Show Centre in Farnborough, UK.
A-Tek Systems Group appointed North American Distribution Partner for Schunk Electronic Solutions
Publication Date: 6/16/2016

LONGMONT, CO - A-Tek Systems Group was recently appointed the North American distribution partner for Schunk Electronic Solutions. Schunk manufacturers high performance depaneling machines for both in-line and stand-alone / batch applications. Schunk is headquartered in St. Georgen, Germany.

Schunk Electronic Solutions sets the standards with depaneling equipment, which is developed to meet today’s challenges in depaneling any panel / board design, as thin as .042” to .125” thick from V-scored to tabbed printed circuit boards.
Nordson DAGE Will Show the New Quadra? 7 X-ray Inspection System for the First Time at SEMICON West
Publication Date: 6/16/2016

AYLESBURY, UNITED KINGDOM - Nordson DAGE, a division of Nordson Corporation (NASDAQ: NDSN), will exhibit in Booth #5844 at SEMICON West, scheduled to take place July 12-14, 2016 at the Moscone Center in San Francisco, CA. The leader in X-ray inspection for electronics, Nordson DAGE will show its 4th generation, ultra-high resolution, off-line MXI X-ray system – the Quadra™ 7 – for the first time in the Americas’.
Würth Elektronik eiSos at the PCIM Asia 2016
Publication Date: 6/16/2016

WALDENBURG, GERMANY - Würth Elektronik eiSos is exhibiting at the PCIM Asia 2016 taking place from 28 thru 30 June 2016. In its presentation in the Shanghai World Expo Exhibition & Convention Center, the manufacturer will be focusing on power modules, for instance the step-down converters of the Magl³C product series, and on the topics of wireless power transfer and energy harvesting.
Indium Corporation’s Indium and Indium Alloy Reclaim and Recycle Program Enriches Return on Investment
Publication Date: 6/16/2016

CLINTON, NY - Indium Corporation's indium metal and indium alloy reclaim and recycle program earns customers an enhanced return on used materials.

Indium is used extensively in thermal management, low-temperature soldering, and sealing applications. In many instances, the indium is not fully consumed and can be reclaimed from the process.
 
NanoFocus AG: New process tool for the inspection of probe cards generates positive response from semiconductor industry
Publication Date: 6/16/2016

OBERHAUSEN, GERMANY - NanoFocus AG launched the new measuring system µsprint hp-opc 3000 for the optical inspection of probe cards in May and June 2016 within the framework of the IS-Test Workshop in Munich and the SWTW in San Diego (USA). The presentation of the measuring system was well received by a broad international expert audience.
Saki Presents 3D AOI Side-Angle Optics and Lighting Technology at NEPCON Thailand, Booth 6D11 and 6D12
Publication Date: 6/16/2016

THAILAND - Saki Corporation, an innovator in the field of automated optical inspection equipment, will present its 3D automated optical inspection (AOI) equipment with innovative side-angle cameras and ring lighting technology at NEPCON Thailand 2016, held June 22-25, 2016, at BITEC in Bangkok, Thailand.
 
KYZEN’s Dr. Mike to Conduct the Cleaning Session at the Advanced Selective Soldering Process Seminar
Publication Date: 6/16/2016

NASHVILLE, TN - KYZEN is pleased to announce that Dr. Mike Bixenman will present at the Advanced Selective Soldering Process Seminar, scheduled to take place Tuesday, June 28 at Kester’s Global Headquarters in Itasca, IL. KYZEN also is a sponsor for the event.

The Advanced Selective Soldering Process Seminar will cover flux, cleaning, process and PCB design.
 
PI: PiezoWalk Motor Technology Powers Ultra-Precise Compact Linear Positioner
Publication Date: 6/16/2016

AUBURN, MA - PI’s new N-565 compact, nanometer-precision linear stages are designed for high-end applications in bio-nanotechnology, fiber-optics, microscopy, semiconductor testing, and metrology and scientific research in beamlines and laser labs.
IPC Announces Results of the IPC Rework Experience Competition at SMT Hybrid Packaging International Exhibition and Conference 2016
Publication Date: 6/15/2016

BANNOCKBURN, IL - The first ever Rework Experience Competition was held at this year’s SMT Hybrid Packaging international exhibition and conference. This competition tested competitor’s skills in reworking a finished printed circuit board. There were seven total competitors and all seven successfully completed the challenge.
 
OKW Enclosures, Inc: New High Top RAILTEC C DIN Rail Enclosures
Publication Date: 6/15/2016

BRIDGEVILLE, PA - High top RAILTEC C is suitable for applications including automation, building and safety, HVAC, timers, sensors, relays, lighting controls, subrack interfaces, modules, amplifiers and transformers.

Enclosures lock quickly and easily on to TH35 rails. They are available with a closed or an open front (which has easily removable ridges to give stability during transport).
Computrol Triples Its Medium Volume Inspection Capability with Three Koh Young SPI Systems
Publication Date: 6/15/2016

MERIDIAN, ID - Computrol, Inc., a world-class provider of mid- to low-volume, high-mix electronic manufacturing services to OEMs, has purchased three KY-8030-3 in-line, fully automated SPI systems from Koh Young Technology.

Computrol’s medium-volume customers will benefit from the KY-8030’s rugged dependability and all of the benefits of in-line 3D SPI.
 
BTU Continues Advanced Research in Electronics Assembly
Publication Date: 6/15/2016

NORTH BILLERICA, MA - BTU International, Inc., a leading supplier of advanced thermal processing equipment for the electronics manufacturing and alternative energy markets, has renewed its membership in the Advanced Research in Electronics Assembly (AREA) Consortium, established by Universal Instruments’ Advanced Process Laboratory (APL).
Plasma Etch, Inc. Announces Semicon West Plasma Ashing Demonstrations
Publication Date: 6/15/2016

CARSON CITY, NV - Plasma Etch, Inc., a leader in plasma treatment, will be providing live demonstrations of the company’s popular PE-50 Plasma Asher at SEMICON West. The demonstrations will be performed at booth number 5872.

This is a great opportunity for manufacturers to get their hands on a working PE-50 Plasma Asher. Company representatives will be on hand to answer questions and provide live demonstrations.
 
Universal Instruments to Distribute Mentor Graphics Production Plan Tool for Fuzion SMT Platforms
Publication Date: 6/13/2016

WILSONVILLE, OR - Mentor Graphics Corporation (NASDAQ: MENT) today announced that Universal Instruments, a global leader of advanced automation and assembly equipment for the electronics manufacturing industry, will offer the Valor® Production Plan tool to users of Universal Instruments’ Fuzion® surface mount technology (SMT) placement platform.
Nordson DAGE Opens Asian Clean Room Demonstration Facility for XM8000 and Bondtester Wafer Metrology Tools
Publication Date: 6/13/2016

AYLESBURY, UK - Nordson DAGE, a division of Nordson Corporation (NASDAQ: NDSN), and the leaders in X-ray inspection and Bondtesting announces the opening of their Asian clean room demonstration facility. Located south of Seoul, Republic of Korea, close to Incheon International Airport and in the heart of South Korea’s technology base, this 102 m2 clean room and conferencing center provides all of their regional customers with access to Nordson DAGE’s award-winning 4800 advanced automated wafer-level bondtester and XM8000 automatic wafer x-ray metrology tool.
Ersa’s Application / Process Engineer to Present Selective Soldering Techniques
Publication Date: 6/13/2016

PLYMOUTH, WI - Kurtz Ersa North America, a leading supplier of electronics production equipment, is pleased to announce that Joseph Clure, Application / Process Engineer, will present at the Advanced Selective Soldering Process Seminar, scheduled to take place Tuesday, June 28th at Kester’s Global Headquarters in Itasca, IL.
SMTA International Program Finalized and Registration Open
Publication Date: 6/13/2016

ROSEMONT, IL - If you want to get the latest research to help you reduce defects and control your processes, look no further than the SMTA International Technical Conference. Choose from four days of session tracks including Advanced Packaging; Flux, Solder, Adhesives; Inspection Technologies; Manufacturing Excellence; as well as the Harsh Enivronments Symposium, Evolving Technologies Summit, and the Lead-Free Soldering Technology Symposium.
 
 
 
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