Friday, December 9, 2016
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Avnet Announces Distribution Agreement with Central Semiconductor in the Americas
Publication Date: 11/30/2016

PHOENIX & HAUPPAUGE, N.Y. - Avnet, Inc., a leading global technology distributor, today announced a distribution agreement with Central Semiconductor Corp., a leading manufacturer of innovative discrete semiconductors. Effective immediately, Central Semiconductor’s entire line of discrete semiconductors will be available for purchase by customers in the Americas through Avnet’s broadline components Electronics Marketing group and Avnet USI, Avnet’s defense/aerospace specialty distribution business unit.
SEMI Adds Industry Veteran to Americas Leadership
Publication Date: 11/30/2016

SAN JOSE, CA - SEMI, the global industry association representing more than 2,000 companies in the electronics manufacturing supply chain, today announced the hire of David Anderson as president of the SEMI Americas region. Reporting to SEMI’s president and CEO, the president of SEMI Americas has P&L responsibility as well as ownership of all Americas region programs and events, including SEMICON West.
Indium Corporation’s Karch Recognized for Best Presentation at IMAPS Autumn Conference 2016
Publication Date: 11/30/2016

CLINTON, NY - Indium Corporation’s Andreas Karch, Regional Technical Manager for Germany, Austria and Switzerland, was recognized for his technical presentation at the IMAPS Autumn Conference in October in Munich, Germany.

Karch was awarded “Best Presentation” for the session New Solder Material Technology in the Manufacturing Process of IGBT Modules, which discussed a new method that produces strong, reliable solder joints that resist cracking and thermal fatigue.
IDT Extends 1.8 V RF Timing Family with Dual-Channel Buffer Devices that Deliver High Performance, Low Power
Publication Date: 11/30/2016

SAN JOSE, CA - Integrated Device Technology, Inc. (IDT) today introduced four high-performance, low-power, LVDS dual-channel fanout buffers, delivering high performance and power savings for system and board designers.
Kurtz Ersa Holds Selective/Wave Solder Process Seminar in Guadalajara, MX
Publication Date: 11/30/2016

PLYMOUTH, WI - Kurtz Ersa North America, a leading supplier of electronics production equipment, recently held its first process seminar at its new facility in Guadalajara. The local seminar allowed surrounding customers to attend and advance their knowledge and understanding about why selecting a proper flux for the specific process they are using is so important.
Tech-Etch: Configurable PDF Sales Drawings Offered For Download To Assist In Board Level Shielding Design Process
Publication Date: 11/29/2016

PLYMOUTH, MA - Tech-Etch offers downloadable interactive PDF sales drawings that let the user design standard 1-piece, 2-piece, or low-profile board level shields. The user simply fills in required dimensions and then chooses available options to complete the drawing, such as surface or through hole mounting, materials, and finish.
Ventec International Group Focus On High Thermal Performance Materials for Automotive and LED Applications at HKPCA 2016, China
Publication Date: 11/29/2016

SUZHOU, CHINA - Ventec International Group, a world leader in the production of polyimide & high reliability epoxy laminates and prepregs, will exhibit in Booth #4B16 at HKPCA, China, scheduled to take place December 7th-9th, 2016 at the Shenzhen Convention & Exhibition Center, China.
Cooperation between Würth Elektronik eiSos and Modelithics: Simulation models for high-frequency inductances
Publication Date: 11/29/2016

WALDENBURG, GERMANY - Würth Elektronik eiSos and Modelithics proudly present the results of their cooperation project: with immediate effect, Microwave Global Models™ products are now available for three product families of SMT high-frequency inductors. HF developers now have the opportunity to test the 0402 and 0603 designs of the WE-MK, WE-KI, and WE-TCI coil families in simulations.
Rehm Is Developing a New Curtain Nozzle for Highly Selective Conformal Coating
Publication Date: 11/29/2016

BLAUBEUREN, GERMANY - Circuit board coating is not just about complete reliability. Precise application procedures are required to cope with the constant miniaturisation in the electronics industry and the associated narrower tolerances between the areas to be lacquered and the areas which must remain free of lacquer. Electronics manufacturers are increasingly confronted with an ever-growing range of product and material mixes.
Dymax Multi-Cure® 9-20557 Conformal Coating Offers Protection Against Thermal Shock
Publication Date: 11/28/2016

TORRINGTON, CT - Dymax Multi-Cure® 9-20557 is designed for rapid conformal coating of printed circuit boards and other electronic assemblies. This MIL-I-46058C listed product is especially formulated to remain on the edges of difficult-to-wet components and sharp leads, while its low modulus allows it to excel in coating applications where thermal shock performance is critical.

Multi-Cure® 9-20557, which is UL approved and meets the IPC –CC-830 standard, has been optimized for coating thicknesses between 51 mic [0.002 in] and 510 mic [0.020 in].
FREE Digital Download of Failures Analysis Booklet from ACI Technologies
Publication Date: 11/28/2016

PHILADELPHIA, PA - ACI Technologies, a manufacturing and scientific research corporation dedicated to the advancement of electronics processes and materials, invites you to download a free copy of its very popular e-booklet, “Failure Analysis Techniques for Electronics” from its Website store, which is located at

electronica 2016: ScoopTalk Roundtable - The PCB Supply Chain, Opportunities & Challenges
Publication Date: 11/28/2016

Munich, Germany - Kim Sauer (@kimsauermedia) is joined by Dr. Michele Stampanoni, Cicor's VP Strategic Sales & Business Development, Alun Morgan, EIPC Chairman and Mark Goodwin, Ventec's COO EMEA & USA to explore the challenges and opportunities faced by those operating in the PCB supply chain.

A ScoopTalk production filmed on location at Electronica 2016 and sponsored by ASM, KIC, Mentor Graphics and Ventec.
electronica 2016: Albert Yanez Sr., Corporate Executive VP, President of Americas at Asteelflash
Publication Date: 11/28/2016

Munich, Germany -  Scoop's Kim Sauer (@kimsauermedia) meets Albert Yanez Sr., Asteelflash's Corporate Executive VP, President of Americas to discuss recent milestones including the new facility in Tunisia. This is the first factory in the region with Fuji TX placement and expected to earn TS certification for Automotive, a certification recently earned at Asteelflash's Tijuana factory in Mexico.

Filmed on location at Electronica 2016 in Munich, Germany thanks to sponsorship from ASM, KIC, Mentor Graphics and Ventec.
See our electronica 2016 play list at:
Christian Gück Is the New Head of YXLON Inspection Services and Is Going to Expand the Inspection Service Worldwide
Publication Date: 11/28/2016

HATTINGEN, GERMANY - Christian Gück took over the management of YXLON Inspection Services and will promote the expansion of the inspection services for customers worldwide. Especially dimensional metrology by means of computed tomography poses considerable challenges both to X-ray systems and inspectors. Gück, who had already focused on metrology during his studies, had the opportunity to gain extended experience in the field of conventional measuring methods like tactile or optical technologies as well as CT Metrology during several years with a renowned German company.
Everett Charles Technologies to exhibit at BIOMEDevice Show 2016
Publication Date: 11/28/2016

Fontana, CA - Everett Charles Technologies (ECT) will exhibit its leading Contacting and Compliant Connector Solutions at the upcoming BIOMEDevice Show scheduled to take place December 7 - 8, 2016 at the San Jose Exhibition Center, California. 

CyberOptics Showcases Large Particle Sensing Functionality in Next-Generation Airborne Particle Sensors at SEMICON Japan
Publication Date: 11/23/2016

MINNEAPOLIS, MN - CyberOptics® Corporation, a leading global developer and manufacturer of high precision 3D sensing technology solutions, announces it will showcase its next-generation Airborne Particle Sensor technology (APS2) with an extended particle size range at the upcoming SEMICON Japan in Tokyo, December 14-16, 2016 in booth #4605.
Bjorn Dahle, CEO of KIC at Electronica 2016
Publication Date: 11/23/2016

Bernhard Muerkens, YXLON International at Electronica 2016
Publication Date: 11/23/2016

Teledyne DALSA’s Industry-Leading Large Format CMOS Detectors Featured at RSNA 2016
Publication Date: 11/23/2016

WATERLOO, ONTARIO - Teledyne DALSA, a Teledyne Technologies company and global leader in digital X-Ray image sensing technology, will display its Xineos family of CMOS dynamic flat X-Ray detectors at the RSNA 2016 Technical Exhibition, November 27 to December 2, at McCormick Place in Chicago.
Alpha Appoints ER-SA Elektrík as New Distributor Partner for Turkey
Publication Date: 11/23/2016

SOMERSET, NJ - Alpha Assembly Solutions, the world leader in the production of electronic soldering and bonding materials, is pleased to announce the appointment of ER-SA Elektrík as its official Distributor Partner for Turkey.
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