Tuesday, July 26, 2016
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Indium Corporation’s ITO and IGZO Reclaim and Recycle Program Helps Customers Increase ROI
Publication Date: 7/18/2016

CLINTON, NY - Indium Corporation's indium tin oxide (ITO) and indium gallium zinc oxide (IGZO) reclaim and recycle program enables customers to earn a greater return on production materials.
Fuji America Expanding Sales Force
Publication Date: 7/15/2016

VERNON HILLS, IL - Fuji America Corporation is looking to expand its North American sales representative base in the following states; Idaho, Wyoming, Montana, Colorado and Utah. Fuji is a world leading technology based company in the Surface Mount Assembly business with over 85,000 machines installed worldwide.
BTU’s PYRAMAX Featuring its WINCON Oven Control System at SMTA Ohio
Publication Date: 7/15/2016

NORTH BILLERICA, MA — BTU International, Inc., a leading supplier of advanced thermal processing equipment for the electronics manufacturing and alternative energy markets, will exhibit at the SMTA Ohio Expo & Tech Forum, scheduled to take place Thursday, August 4, 2016 at the Embassy Suites Cleveland Rockside in Cleveland, Ohio. BTU will showcase its RecipePro recipe generator software, jointly developed with Electronic Controls Design Inc. (ECD), and will highlight the latest version of the Energy Pilot software and Industry 4.0 compliant solutions – all components of BTU’s proprietary WINCON oven control software.

HELUKABEL Continues Global Expansion with 26th Subsidiary
Publication Date: 7/14/2016

ELGIN, IL – HELUKABEL, one of the world’s leading cable manufacturers, has opened a new branch in Portugal, its 26th branch worldwide. Cables and wires, predominantly for industrial applications, from conventional control cables to highly flexible data cables, will soon be stored in a 6,500 square foot warehouse in Coimbra, located between the industrial centers of Lisbon and Porto. The branch will initially be run by a sales and logistics team of four employees.

Standards Industry Leaders Honored at SEMICON West 2016
Publication Date: 7/14/2016

SAN FRANCISCO, CA — SEMI honored four industry leaders for their outstanding accomplishments in developing Standards for the electronics and related industries. The SEMI Standards awards were announced at the SEMI International Standards reception held during SEMICON West 2016.

The 2016 SEMI International Standards Excellence Award, inspired by Karel Urbanek,is the most prestigious award in the SEMI International Standards Program. Yesterday, it was awarded to Terry Asakawa of Tokyo Electron. His leadership was critical in establishing the PV Automation Global Technical Committee and its subsequent transformation into the Automation Technology Global Technical Committee, as he envisioned how the SEMI Standards Program could effectively address simpler, flow-oriented manufacturing in industries outside of semiconductor manufacturing.
VJ Electronix to Give Three Presentations around Rework and X-ray at the PHASE 4, Inc. Arizona Show &Tell Technical Conference
Publication Date: 7/14/2016

LITTLETON, MA - VJ Electronix, Inc., a leader in rework technologies and global provider of advanced X-ray inspection systems, today announced plans to participate in the PHASE 4, Inc. Arizona Show & Tell Technical Conference, scheduled to take place August 9-11, 2016 at TechShop in Chandler, AZ. VJ Electronix will give three presentations during the event, in addition to exhibiting the XQuick II with AccuCount Technology.

Indium Corporation Features Indium 8.9HF, Indium10.1 Solder Pastes at NEPCON South China
Publication Date: 7/14/2016

CLINTON, NY - Indium Corporation will feature its Indium10.1 and Indium8.9HF solder pastes at NEPCON South China 2016, on Aug. 30-Sept. 1, in Shenzhen, China.

Indium Corporation, the industry-leading source of void-reducing materials and results, has specifically formulated Indium10.1 solder paste to reduce voiding significantly below the industry average – for improved finished goods reliability. Indium10.1 delivers robust reflow capabilities and a wide processing window, which accommodates various board sizes and throughput requirements, and minimizes defects.

Bruce Rodewald joins EPLAN Americas as new President and CEO
Publication Date: 7/13/2016

 
 Bruce Rodewald, new President and CEO, EPLAN Americas.

Schaumburg, Il – EPLAN Software & Services, the global provider of leading engineering software solutions, has appointed Bruce Rodewald as President and CEO of EPLAN Americas. He succeeds the retiring Raymond Gaynor, who had led the Americas division since 2011.


TeraView EOTPR 5000 – A Game Changer in Advanced IC Package Inspection
Publication Date: 7/13/2016

San Francisco, CATeraView, the pioneer and leader in terahertz technology and solutions (http://www.teraview.com is pleased to introduce our fully automated integrated circuit (IC) package inspection system, the EOTPR 5000.  Building on the success of the EOTPR 2000 which has an established track record in the industry for rapid fault isolation and manual inspection, the EOTPR 5000 is a fully automated advanced IC package inspection system that utilizes TeraView’s proprietary EOTPR terahertz technology to detect weak or marginal interconnect quality in high-volume manufacturing environments, which­ no other technology can detect today.

Seika Machinery Debuts the Malcom SP-2 Wetting Tester
Publication Date: 7/13/2016

TORRANCE, CA  — Seika Machinery, Inc., a provider of advanced machinery, materials and engineering services, is pleased to introduce the Malcom SP-2 Wetting Tester. The SP-2 helps to test the wettability of solder paste and components while actually simulating the SMT mounting and reflow process.

IBL Technologies Brings Its Economy Vapor Phase Soldering System to the PHASE 4, Inc. Mini Show
Publication Date: 7/13/2016

BURNSVILLE, MN  ― IBL Technologies, LLC has announced its participation in the PHASE 4, Inc. Mini-show & Technical conference, scheduled to take place August 9-11, 2016 at TechShop in Chandler, AZ. Jochen Lipp, CEO of IBL Technologies, will be available to demonstrate the redesigned SV260 Economy Vapor Phase Soldering Machine for small series and prototyping.

Tanaka Kikinzoku Kogyo Provides Flexible Touch Panel Market with Silver Nanoparticle Ink-Printed Film
Publication Date: 7/12/2016

Tanaka Kikinzoku Kogyo K.K. (Head office: Chiyoda-ku, Tokyo; Representative Director & CEO: Akira Tanae), the manufacturing business of Tanaka Precious Metals, announced today a collaboration with several technology research institutes in Japan to commercialize a fabricated conductive film for touch panel sensors. The film is manufactured from a transparent flexible substrate printed with silver nanoparticle ink to form ultrafine wiring of 0.8 microns wide (1 micron is one-thousandth of a millimeter). This new product will be exhibited at the SEMICON West exhibition to be held on July 12-14.

Schleuniger EcoStrip 9380 – Welcome to the Future of Entry Level Cut & Strip
Publication Date: 7/12/2016

Manchester, NH - At the 2015 productronica trade fair, Schleuniger debuted the new EcoStrip 9380, the company’s latest innovation in its cut and strip product family. This capable, entry level machine for professional demands once again confirmed Schleuniger’s number one position in this market segment. 
SEICA announces further expansion in China
Publication Date: 7/12/2016

Strambino, Italy  - SEICA’s Chinese subsidiary, Seica Electronics (Suzhou), has doubled the size of their technical support team in the first half of 2016, and is looking to continue the trend in the near term. The Seica support team provide 24/7 technical support to the installed base in China, and is able to supply test application programs and fixtures directly from our Chinese offices.

MVP to Demo Microelectronics and Packaging Inspection Toolbox for AOI at Semicon West 2016
Publication Date: 7/11/2016

Carlsbad, CA Machine Vision Products (MVP) today announced it would be demonstrating their diverse inspection toolbox on the MVP 850 Platform for Microelectronics and Packaging at the Semicon West 2016 exhibition. Applications will include Lead Frame inspection for die placement, epoxy and wire bond as well as demonstrating new surface inspection capabilities. The exhibition is at the Moscone Center in San Francisco from July 12-14 2016. Machine Vision Products are exhibiting at booth #6471 in the North Hall. 

Eunil Adds ECM-1100 to Coating Master ECM Series
Publication Date: 7/11/2016

CHULA VISTA, CA - Eunil, a worldwide producer of factory automation and a manufacturer of SMT peripheral equipment, has released its latest in-line coating machine, the ECM-1100, as part of the Coating Master ECM Series.

Dazor Lighting Solutions Introduces New Digital Magnification System
Publication Date: 7/8/2016

ST. LOUIS, MO - Dazor Lighting Solutions has released a new low-cost digital bench-top magnification system, CODA. This streamlined and easy-to-use system is designed to provide the ultimate in magnification simplicity for production, quality control, and other inspection applications. 

 

Nicomatic Celebrates 40 Years in Business with New Logo Release
Publication Date: 7/8/2016

Warminster, PA - Nicomatic has a recent update to their brand image, with Friday July 8th 2016 marking their 40th anniversary, they have announced a new logo.  This is the first official new logo since Nicomatic came to the market in 1976.  With their in-house design and great use of negative space, Nicomatic moves towards a sleek and stylish look; showing the evolution of the company from passive components to more technology driven “smart” products.  The future is bright and Nicomatic shows they are here to stay.
Nordson ASYMTEK Teams with Parker Chomerics for High-volume, Precision Conductive Coating Spray Application
Publication Date: 7/8/2016

Carlsbad, CA - Nordson ASYMTEK, a Nordson company, and Parker Chomerics, a Division of Parker Hannifin Corporation, are partnering at SEMICON West in Parker Chomerics' booth #6557 to demonstrate precision, high-volume spray applications for EMI coating solutions. One specific solution uses Nordson ASYMTEK's Select Coat® Conformal Coating System with a DispenseJet® applicator to apply thin coatings of Parker Chomerics' new CHO-SHIELD-604 conductive coating to achieve a target thickness of 25 µm. SEMICON West is being held at Moscone Center, San Francisco, CA,July 12-14, 2016.
Seika Machinery Now Carries the Malcom SWB-2 Automatic Wetting Balance Tester
Publication Date: 7/8/2016

TORRANCE, CA  — Seika Machinery, Inc., a leading provider of advanced machinery, materials and engineering services, has just introduced the Malcom SWB-2 Automatic Wetting Balance Tester. The automated solution has been designed for measuring the wetting force of your through-hole components using wave solder.

 
 
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