Tuesday, April 25, 2017
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MIRTEC Europe to Exhibit at SMT/Hybrid/Packaging 2017

MIRTEC, “The Global Leader in Inspection Technology,” today announced they will display their award-winning 3D AOI and SPI Inspection Systems in pb tec’s booth, in Hall 4A, Stand 140 at the upcoming SMT/Hybrid/Packaging Show, scheduled to take place May 16-18 at the Messe in Nuremberg, Germany.
 

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Park Electrochemical Corp. Announces Consolidation of Its U.S. Electronic Materials Business Units

MELVILLE, N.Y - Park Electrochemical Corp. (NYSE:PKE) announced the consolidation of its Nelco Products, Inc. electronics Business Unit located in Fullerton, California (“NPI”) and its Neltec, Inc. electronics Business Unit located in Tempe, Arizona (“Neltec”).
 

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Microtronic GmbH to Show Sonix ECHO™ Scanning Acoustic Microscope at SMT Hybrid Packaging

MUNICH, GERMANY - Microtronic GmbH, a leading sales specialist of microelectronics, today announced plans to show the Sonix ECHO™ scanning acoustic microscope in Stand 221j in Hall 5 at SMT Hybrid Packaging, scheduled to take place May 16-18, 2017 in Nuremburg, Germany.
 

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Ironwood Electronics: Socket your Quad Flat No Lead package using elastomer socket with superior electrical performance

EAGAN, MN - Ironwood Electronics has recently introduced a new high performance elastomer socket for 0.4mm pitch QFN package. The CG25-QFN-2003 socket is designed for a 5mmx5mm package size and operates at bandwidths up to 40 GHz with less than 1dB of insertion loss (GSSG configuration).
 

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BTU to Demo the Updated WINCON Control System at SMT Hybrid Packaging 2017

NORTH BILLERICA, MA - BTU International, Inc., a leading supplier of advanced thermal processing equipment for the electronics manufacturing and alternative energy markets, today announced plans to exhibit with EPP Electronic Production Partners GmbH at SMT Hybrid Packaging.
 

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KYZEN’s Newest Innovation, the KYZEN ANALYSTTM, Will Be Launched at SMT Hybrid Packaging 2017 this May!

NASHVILLE, TN - Today KYZEN announced plans to introduce the new KYZEN ANALYST in Europe this spring at SMT Hybrid Packaging 2017. KYZEN will have live, on-site demonstrations of their latest innovation, the KYZEN ANALYST, at the show in Hall 4A, Stand 536.
 

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Knowles Capacitors Show Impressive Product Line Up at Space Tech 2017

NORWICH, UK - To coincide with Space Tech Expo, taking place in Pasadena, California, USA over May 23 to 25, Knowles Capacitors has produced a new shortform capability guide outlining their range of Space Heritage products.

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epoxySet: EO-98HT, Very High Temperature, Electrically Conductive Adhesive

LINCOLN, RI - epoxySet presents the EO-98HT, electrically conductive epoxy for electrical circuits, LED attachment, die attach and grounding applications. With a volume resistivity of approximately 10-4 ohm-cm, the EO-98HT is an excellent choice for solder replacement or circuit/wire bonding where high conductivity and reliability are required.
 

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Live Demonstrations will be available on Nordson DAGE, Nordson MATRIX and Nordson YESTECH Inspection Systems at SMT

AYLESBURY, UK - Nordson DAGE, Nordson MATRIX, and Nordson YESTECH, divisions of Nordson Corporation, today announced that they will exhibit in Hall 4A, Stand 214, at the upcoming SMT/Hybrid/Packaging scheduled to take place May 16-18 at the Messe in Nuremberg, Germany.

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Vi TECHNOLOGY to Exhibit Full Inspection Solution at SMT/Hybrid/Packaging

Saint-Egrève, France - Vi TECHNOLOGY, a leading provider of inspection solutions for PCB assembly, will exhibit in Hall 4A, Stand 240 at SMT/Hybrid/Packaging, scheduled to take place May 16-18, 2017 at the Messe in Nuremberg, Germany.
 

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InnovationsFORUM Hungary Reflects Changes In Manufacturing Landscape

Budapest, Hungary - From the keynote through each and every presentation, the 2017 InnovationsFORUM Hungary, held on May 25th at The Hungarian Academy of Science in Budapest, reflects the changes that are occurring in Eastern European manufacturing and the desire to utilize innovation at every point in the product lifecycle.
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SEHO Focuses on 100% Process Control

ERLANGER, KY - SEHO Systems GmbH, a worldwide leading manufacturer of complete solutions for soldering processes and automated production lines, will focus on automatic process control in Hall 4, Stand 129 at the upcoming SMT/Hybrid/Packaging show, scheduled to take place May 16-18, 2017 at the Messe in Nuremberg, Germany.
 

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CyberOptics to Demonstrate Breakthrough Multi-Reflection Suppression (MRS) Sensor Technology at SMT/Hybrid/Packaging

MINNEAPOLIS, MN - CyberOptics® Corporation, a leading global developer and manufacturer of high-precision 3D sensing technology solutions, will display an advanced Ultra-High Resolution Multi-Reflection Suppression (MRS) sensor for the CyberOptics’ SQ3000® 3D Automated Optical Inspection (AOI) system in Hall 4, Stand 101 at the upcoming SMT/Hybrid/Packaging, scheduled to take place May 16-18, 2017 at the Messe in Nuremberg, Germany.

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SMT Xtra Celebrates 10-Year Milestone at SMT Hybrid Packaging 2017

MARYVILLE, TN - SMT Xtra, a leading provider of productivity enhancing solutions for the global surface mount electronic assembly sector, today announced plans to exhibit at SMT Hybrid Packaging, scheduled to take place May 16-18, 2017 in Nuremburg, Germany.
 

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Digi-Key: TDK Corporation NTCG Series Thermistors


Scienscope to Showcase Automated Component Counters at NEPCON China

CHINO, CA - Scienscope International, a complete inspection solutions provider, today announced plans to exhibit in Stand 1H22 at NEPCON China, scheduled to take place April 25-27, 2017 at the Shanghai World EXPO Exhibition & Convention Center.
 

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Indium Corporation Expert to Present at RaMP2017 Workshop

CLINTON, NY - Indium Corporation’s Karthik Vijay, Technical Manager for Europe, Africa, and the Middle East, will present at the RF and Microwave Packaging (RaMP) 2017 Workshop on April 26-27, in Paris, France.

Karthik will present Enhanced Thermal Management with Compressible Solder Thermal Interface Materials (TIMs) and Engineered Low-Voiding Solder Preforms.

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Alpha to Showcase Preform Technology at National Electrical Wire Processing Technology Expo

SOMERSET, NJ - Alpha Assembly Solutions, the world leader in the production of solder preforms for the cable interconnect and connector termination market, will exhibit for the first time at the 17th Annual National Electrical Wire Processing Technology Expo taking place May 10 – 11 in Milwaukee, Wisconsin.

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Kurtz Ersa Awards Yankee Soldering Technology for Rework & Inspection Sales Performance

PLYMOUTH, WI - Kurtz Ersa North America, a leading supplier of electronics production equipment, today announced that Todd Dezwarte, Ersa’s Sales Manager for Rework, Inspection & Tools, presented Yankee Soldering Technology with an Ersa ‘Rep of the Year Award‘ for outstanding sales of rework and inspection equipment in the New England area in 2016.
 

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New EPLAN Cogineer automates generation of schematics

SCHAUMBURG, IL - EPLAN is launching EPLAN Cogineer, a new software package that generates schematics automatically, at the 2017 Hannover Trade Fair later this month.
 

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