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Ersa to Exhibit the VERSAFLEX-Ultra Selective Solder Module at SMT Nuremberg

PLYMOUTH, WI - Kurtz Ersa North America, a leading supplier of electronics production equipment, today announced plans to exhibit the new VERSAFLEX-Ultra selective solder module. The system will be displayed in Booths 4-111 and 5-434 at the upcoming SMT/Hybrid/Packaging show, to be held May 16-18 at the Messe in Nuremberg, Germany.

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Würth Elektronik eiSos and IDT sponsor the Wireless Power Contest: Innovative wireless power ideas – the winners are announced

WALDENBURG, GERMANY - Würth Elektronik eiSos, one of Europe’s leading manufacturers of electronic and electromechanical components, congratulates the winners of the Open Electronics Wireless Power Contest. Over 300 ideas were entered by talented young electronic specialists and hobbyists.

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ECD Logs Record-Breaking Year, Attributes Impressive Results to Customer Loyalty, Product Innovation and Outstanding Service

MILWAUKIE, OR - ECD is celebrating the company’s most successful year on record, as 2016 is now in the books and closed with significant financial and product development achievements. Strategic focus, a new product line, enhancements to existing technologies, award-winning service and a dedicated team are all cited as key contributors to the record-breaking result.

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Josef Ernst Named Vice President CRM at ASM Assembly Systems

MUNICH, GERMANY - As the new Vice President CRM, Josef Ernst will be responsible for the global customer relationship management of ASM SMT Solutions, which is part of ASM Pacific Technology, the world’s largest equipment manufacturer for the electronics industry.
 

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Avnet Appoints Phillip Gallagher, Global President of Core Distribution Business

PHOENIX, AZ - Avnet, a leading global technology distributor, today announced the appointment of Phillip Gallagher to the role of president, of Avnet’s Core Distribution Business reporting to CEO William Amelio.

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Mill-Max Introduces Discrete Insulated Pins and Receptacles

OYSTER BAY, NY - Mill-Max is pleased to announce a new selection of insulated terminals. Six popular Mill-Max pins and receptacles have been fitted with cylindrical insulating sleeves for electrical isolation applications. The new offerings include three header pins, two receptacles and one solder cup pin to suit a variety of uses.

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America II Adds Two Lines to Its Global Channel Partnership

Global Distributor Continues to Grow its Vast Supply Chain

ST. PETERSBURG, FL - America II Electronics, Inc., one of the world’s largest distributors of semiconductors and electronic components, today announced it has signed franchise distribution agreements with two manufacturers.
 

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MIRTEC Europe to Exhibit at SMT/Hybrid/Packaging 2017

MIRTEC, “The Global Leader in Inspection Technology,” today announced they will display their award-winning 3D AOI and SPI Inspection Systems in pb tec’s booth, in Hall 4A, Stand 140 at the upcoming SMT/Hybrid/Packaging Show, scheduled to take place May 16-18 at the Messe in Nuremberg, Germany.
 

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Park Electrochemical Corp. Announces Consolidation of Its U.S. Electronic Materials Business Units

MELVILLE, N.Y - Park Electrochemical Corp. (NYSE:PKE) announced the consolidation of its Nelco Products, Inc. electronics Business Unit located in Fullerton, California (“NPI”) and its Neltec, Inc. electronics Business Unit located in Tempe, Arizona (“Neltec”).
 

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Microtronic GmbH to Show Sonix ECHO™ Scanning Acoustic Microscope at SMT Hybrid Packaging

MUNICH, GERMANY - Microtronic GmbH, a leading sales specialist of microelectronics, today announced plans to show the Sonix ECHO™ scanning acoustic microscope in Stand 221j in Hall 5 at SMT Hybrid Packaging, scheduled to take place May 16-18, 2017 in Nuremburg, Germany.
 

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Ironwood Electronics: Socket your Quad Flat No Lead package using elastomer socket with superior electrical performance

EAGAN, MN - Ironwood Electronics has recently introduced a new high performance elastomer socket for 0.4mm pitch QFN package. The CG25-QFN-2003 socket is designed for a 5mmx5mm package size and operates at bandwidths up to 40 GHz with less than 1dB of insertion loss (GSSG configuration).
 

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BTU to Demo the Updated WINCON Control System at SMT Hybrid Packaging 2017

NORTH BILLERICA, MA - BTU International, Inc., a leading supplier of advanced thermal processing equipment for the electronics manufacturing and alternative energy markets, today announced plans to exhibit with EPP Electronic Production Partners GmbH at SMT Hybrid Packaging.
 

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KYZEN’s Newest Innovation, the KYZEN ANALYSTTM, Will Be Launched at SMT Hybrid Packaging 2017 this May!

NASHVILLE, TN - Today KYZEN announced plans to introduce the new KYZEN ANALYST in Europe this spring at SMT Hybrid Packaging 2017. KYZEN will have live, on-site demonstrations of their latest innovation, the KYZEN ANALYST, at the show in Hall 4A, Stand 536.
 

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Knowles Capacitors Show Impressive Product Line Up at Space Tech 2017

NORWICH, UK - To coincide with Space Tech Expo, taking place in Pasadena, California, USA over May 23 to 25, Knowles Capacitors has produced a new shortform capability guide outlining their range of Space Heritage products.

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epoxySet: EO-98HT, Very High Temperature, Electrically Conductive Adhesive

LINCOLN, RI - epoxySet presents the EO-98HT, electrically conductive epoxy for electrical circuits, LED attachment, die attach and grounding applications. With a volume resistivity of approximately 10-4 ohm-cm, the EO-98HT is an excellent choice for solder replacement or circuit/wire bonding where high conductivity and reliability are required.
 

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Live Demonstrations will be available on Nordson DAGE, Nordson MATRIX and Nordson YESTECH Inspection Systems at SMT

AYLESBURY, UK - Nordson DAGE, Nordson MATRIX, and Nordson YESTECH, divisions of Nordson Corporation, today announced that they will exhibit in Hall 4A, Stand 214, at the upcoming SMT/Hybrid/Packaging scheduled to take place May 16-18 at the Messe in Nuremberg, Germany.

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Vi TECHNOLOGY to Exhibit Full Inspection Solution at SMT/Hybrid/Packaging

Saint-Egrève, France - Vi TECHNOLOGY, a leading provider of inspection solutions for PCB assembly, will exhibit in Hall 4A, Stand 240 at SMT/Hybrid/Packaging, scheduled to take place May 16-18, 2017 at the Messe in Nuremberg, Germany.
 

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InnovationsFORUM Hungary Reflects Changes In Manufacturing Landscape

Budapest, Hungary - From the keynote through each and every presentation, the 2017 InnovationsFORUM Hungary, held on May 25th at The Hungarian Academy of Science in Budapest, reflects the changes that are occurring in Eastern European manufacturing and the desire to utilize innovation at every point in the product lifecycle.
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SEHO Focuses on 100% Process Control

ERLANGER, KY - SEHO Systems GmbH, a worldwide leading manufacturer of complete solutions for soldering processes and automated production lines, will focus on automatic process control in Hall 4, Stand 129 at the upcoming SMT/Hybrid/Packaging show, scheduled to take place May 16-18, 2017 at the Messe in Nuremberg, Germany.
 

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CyberOptics to Demonstrate Breakthrough Multi-Reflection Suppression (MRS) Sensor Technology at SMT/Hybrid/Packaging

MINNEAPOLIS, MN - CyberOptics® Corporation, a leading global developer and manufacturer of high-precision 3D sensing technology solutions, will display an advanced Ultra-High Resolution Multi-Reflection Suppression (MRS) sensor for the CyberOptics’ SQ3000® 3D Automated Optical Inspection (AOI) system in Hall 4, Stand 101 at the upcoming SMT/Hybrid/Packaging, scheduled to take place May 16-18, 2017 at the Messe in Nuremberg, Germany.

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